1. 2. 3. material content data sheet sales product name bga 713n7 e6327 issued 29. august 2013 ma# MA001067824 package pg-tsnp-7-1 weight* 3.85 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.114 2.97 2.97 29710 29710 leadframe non noble metal zinc 7440-66-6 0.004 0.11 1117 non noble metal tin 7440-31-5 0.005 0.14 1396 non noble metal chromium 7440-47-3 0.006 0.17 1675 non noble metal copper 7440-50-8 2.136 55.42 55.84 554220 558408 wire noble metal gold 7440-57-5 0.042 1.10 1.10 10960 10960 encapsulation organic material carbon black 1333-86-4 0.006 0.16 1641 plastics epoxy resin - 0.183 4.76 47587 inorganic material silicondioxide 60676-86-0 1.075 27.90 32.82 278957 328185 leadfinish non noble metal tin 7440-31-5 0.111 2.89 2.89 28926 28926 plating noble metal silver 7440-22-4 0.104 2.69 2.69 26924 26924 glue plastics epoxy resin - 0.013 0.34 3378 noble metal silver 7440-22-4 0.052 1.35 1.69 13509 16887 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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