1. 2. 3. material content data sheet sales product name bby 57-02v h6327 issued 29. august 2013 ma# MA000787826 package pg-sc79-2-1 weight* 1.68 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 18 noble metal gold 7440-57-5 0.003 0.18 1787 inorganic material silicon 7440-21-3 0.026 1.53 1.71 15265 17070 leadframe inorganic material silicon 7440-21-3 0.000 0.01 92 non noble metal titanium 7440-32-6 0.001 0.05 460 non noble metal chromium 7440-47-3 0.002 0.14 1379 non noble metal copper 7440-50-8 0.767 45.78 45.98 457955 459886 wire non noble metal copper 7440-50-8 0.007 0.39 0.39 3925 3925 encapsulation organic material carbon black 1333-86-4 0.007 0.43 4339 plastics epoxy resin - 0.124 7.38 73755 inorganic material silicondioxide 60676-86-0 0.596 35.58 43.39 355759 433853 leadfinish non noble metal tin 7440-31-5 0.055 3.26 3.26 32575 32575 plating noble metal silver 7440-22-4 0.088 5.27 5.27 52691 52691 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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