1. 2. 3. material content data sheet sales product name bsc0906ns issued 27. july 2015 ma# MA001014400 package pg-tdson-8-6 weight* 117.95 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.210 0.18 0.18 1784 1784 leadframe non noble metal iron 7439-89-6 0.038 0.03 321 inorganic material phosphorus 7723-14-0 0.011 0.01 96 non noble metal copper 7440-50-8 37.762 32.02 32.06 320152 320569 wire noble metal gold 7440-57-5 0.047 0.04 0.04 394 394 encapsulation organic material carbon black 1333-86-4 0.088 0.08 750 plastics epoxy resin - 6.279 5.32 53236 inorganic material silicondioxide 60676-86-0 37.852 32.07 37.47 320916 374902 leadfinish non noble metal tin 7440-31-5 1.470 1.25 1.25 12461 12461 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1403 1403 solder noble metal silver 7440-22-4 0.009 0.01 79 non noble metal tin 7440-31-5 0.007 0.01 63 non noble metal lead 7439-92-1 0.355 0.30 0.32 3007 3149 heatspreader non noble metal iron 7439-89-6 0.011 0.01 96 inorganic material phosphorus 7723-14-0 0.003 0.00 29 non noble metal copper 7440-50-8 11.320 9.60 9.61 95974 96099 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 189 inorganic material phosphorus 7723-14-0 0.007 0.01 57 non noble metal copper 7440-50-8 22.292 18.90 18.93 188993 189239 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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