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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. lp5907 snvs798n ? april 2012 ? revised april 2018 lp5907 250-ma, ultra-low-noise, low-i q ldo 1 1 features 1 ? input voltage range: 2.2 v to 5.5 v ? output voltage range: 1.2 v to 4.5 v ? stable with 1- f ceramic input and output capacitors ? no noise bypass capacitor required ? remote output capacitor placement ? thermal-overload and short-circuit protection ? ? 40 c to 125 c operating junction temperature ? low output voltage noise: < 6.5 v rms ? psrr: 82 db at 1 khz ? output voltage tolerance: 2% ? very low i q (enabled): 12 a ? low dropout: 120 mv (typical) ? create a custom design using the lp5907 with the webench ? power designer 2 applications ? mobile phones, tablets ? digital cameras and audio devices ? portable and battery-powered equipment ? portable medical equipment ? smart meters and field transmitters ? rf, pll, vco, and clock power supplies ? ip cameras ? drones 3 description the lp5907 is a low-noise ldo that can supply up to 250 ma output current. designed to meet the requirements of rf and analog circuits, the lp5907 device provides low noise, high psrr, low quiescent current, and low line or load transient response figures. using new innovative design techniques, the lp5907 offers class-leading noise performance without a noise bypass capacitor and the ability for remote output capacitor placement. the device is designed to work with a 1- f input and a 1- f output ceramic capacitor (no separate noise bypass capacitor is required). this device is available with fixed output voltages from 1.2 v to 4.5 v in 25-mv steps. contact texas instruments sales for specific voltage option needs. device information (1) part number package body size lp5907 dsbga (4) 0.675 mm 0.675 mm (max) sot-23 (5) 2.90 mm 1.60 mm (nom) x2son (4) 1.00 mm 1.00 mm (nom) (1) for all available packages, see the orderable addendum at the end of the data sheet. space space space simplified schematic productfolder en in out gnd 1 p f 1 p f input enable gnd output lp5907 support &community tools & software technical documents ordernow referencedesign
2 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 4 6 specifications ......................................................... 5 6.1 absolute maximum ratings ...................................... 5 6.2 esd ratings .............................................................. 5 6.3 recommended operating conditions ....................... 5 6.4 thermal information .................................................. 6 6.5 electrical characteristics ........................................... 6 6.6 output and input capacitors ..................................... 7 6.7 typical characteristics .............................................. 8 7 detailed description ............................................ 12 7.1 overview ................................................................. 12 7.2 functional block diagram ....................................... 12 7.3 feature description ................................................. 12 7.4 device functional modes ........................................ 13 8 application and implementation ........................ 14 8.1 application information ............................................ 14 8.2 typical application .................................................. 14 9 power supply recommendations ...................... 17 10 layout ................................................................... 18 10.1 layout guidelines ................................................. 18 10.2 layout examples ................................................... 18 11 device and documentation support ................. 20 11.1 documentation support ........................................ 20 11.2 receiving notification of documentation updates 20 11.3 community resources .......................................... 20 11.4 trademarks ........................................................... 20 11.5 electrostatic discharge caution ............................ 20 11.6 glossary ................................................................ 20 12 mechanical, packaging, and orderable information ........................................................... 21 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision m (january 2018) to revision n page ? added overshoot on start-up with en row to electrical characteristics table ...................................................................... 7 changes from revision l (august 2016) to revision m page ? added links for webench ................................................................................................................................................... 1 ? added information about ykm package option ..................................................................................................................... 1 ? added minor editorial changes .............................................................................................................................................. 1 changes from revision k (may 2016) to revision l page ? changed title of data sheet and updated list of applications and wording of 1st sentence in description ............................ 1 ? changed " 10 v rms " to " 6.5 v rms " ....................................................................................................................................... 1 changes from revision j (march 2016) to revision k page ? changed " linear regulator " to " ldo " in title and first sentence of description .................................................................... 1 changes from revision i (august 2015) to revision j page ? changed v out min and max values and v en min value in abs max table and v en row of roc table to correct format errors; replace text of footnote 2 of abs max table ............................................................................................................... 5 changes from revision h (november 2014) to revision i page ? added icon for reference design to top navs and " v out vs temperature " graph to typical characteristics ..................... 1 ? changed storage temperature to abs max table; replace handling ratings with esd ratings ......................................... 5 ? deleted " v out 1.8 v " from first row of vout spec ............................................................................................................. 6
3 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated ? added " sot-23, x2son packages " to second row of vout spec ...................................................................................... 6 changes from revision g (october 2013) to revision h page ? added device information and handling rating tables, feature description , device functional modes , application and implementation , power supply recommendations , layout , device and documentation support , and mechanical, packaging, and orderable information sections; moved some curves to application curves section ............. 1
4 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 5 pin configuration and functions yke and ykm packages 4-pin dsbga pin functions: dsbga pin i/o description dsbga number name a1 in i input voltage supply. connect a 1- f capacitor at this input. a2 out o regulated output voltage. connect a minimum 1- f low-esr capacitor to this pin. connect this output to the load circuit. an internal 230- (typical) pulldown resistor prevents a charge remaining on v out when the regulator is in the shutdown mode (v en low). b1 en i enable input. a low voltage ( < v il ) on this pin turns the regulator off and discharges the output pin to gnd through an internal 230- pulldown resistor. a high voltage ( > v ih ) on this pin enables the regulator output. this pin has an internal 1-m pulldown resistor to hold the regulator off by default. b2 gnd ? common ground dqn package 4-pin x2son bottom view dbv package 5-pin sot-23 top view pin functions: x2son, sot-23 pin i/o description name x2son number sot-23 number in 4 1 i input voltage supply. connect a 1- f capacitor at this input. out 1 5 o regulated output voltage. connect a minimum 1- f low-esr capacitor to this pin. connect this output to the load circuit. an internal 230- (typical) pulldown resistor prevents a charge remaining on v out when the regulator is in the shutdown mode (v en low). en 3 3 i enable input. a low voltage ( < v il ) on this pin turns the regulator off and discharges the output pin to gnd through an internal 230- pulldown resistor. a high voltage ( > v ih ) on this pin enables the regulator output. this pin has an internal 1-m pulldown resistor to hold the regulator off by default. gnd 2 2 ? common ground n/c ? 4 ? no internal electrical connection. thermal pad 5 ? ? thermal pad for x2son package, connect to gnd or leave floating. do not connect to any potential other than gnd. out 1 2 3 4 gnd in en 5 b2 b1 a2 a1 out gnd in en b2 b1 a2 a1 out gnd in en top view bottom view n/c 1 23 54 en gnd in out
5 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltages are with respect to the gnd pin. (3) abs max v out is the lessor of v in + 0.3 v, or 6 v. (4) internal thermal shutdown circuitry protects the device from permanent damage. 6 specifications 6.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) (2) min max unit v in input voltage ? 0.3 6 v v out output voltage ? 0.3 see (3) v en enable input voltage ? 0.3 6 continuous power dissipation (4) internally limited w t jmax junction temperature 150 c t stg storage temperature ? 65 150 c (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per ansi/esda/jedec js-001 (1) 2000 v charged-device model (cdm), per jedec specification jesd22-c101 (2) 1000 (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltages are with respect to the gnd pin. (3) in applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. maximum ambient temperature (t a-max ) is dependent on the maximum operating junction temperature (t j-max-op = 125 c), the maximum power dissipation of the device in the application (p d-max ), and the junction-to ambient thermal resistance of the part/package in the application (r ja ), as given by the following equation: t a-max = t j-max-op ? (r ja p d-max ). see application and implementation . 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) (1) (2) min max unit v in input supply voltage 2.2 5.5 v v en enable input voltage 0 5.5 i out output current 0 250 ma t j junction temperature ? 40 125 c t a ambient temperature (3) ? 40 85 c
6 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report. 6.4 thermal information thermal metric (1) lp5907 unit dbv (sot-23) dqn (x2son) yke (dsbga) ykm (dsbga) 5 pins 4 pins 4 pins 4 pins r ja junction-to-ambient thermal resistance 193.4 216.1 206.1 194.1 c/w r jc(top) junction-to-case (top) thermal resistance 102.1 161.7 1.5 3.0 c/w r jb junction-to-board thermal resistance 45.8 162.1 37.0 62.7 c/w jt junction-to-top characterization parameter 8.4 5.1 15.0 1.1 c/w jb junction-to-board characterization parameter 45.3 161.7 36.8 62.7 c/w r jc(bot) junction-to-case (bottom) thermal resistance n/a 123.0 n/a n/a c/w (1) all voltages are with respect to the device gnd terminal, unless otherwise stated. (2) minimum and maximum limits are ensured through test, design, or statistical correlation over the junction temperature (t j ) range of ? 40 c to 125 c, unless otherwise stated. typical values represent the most likely parametric norm at t a = 25 c, and are provided for reference purposes only. (3) in applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. maximum ambient temperature (t a-max ) is dependent on the maximum operating junction temperature (t j-max-op = 125 c), the maximum power dissipation of the device in the application (p d-max ), and the junction-to ambient thermal resistance of the part/package in the application r ja ), as given by the following equation: t a-max = t j-max-op ? (r ja p d-max ). see application and implementation . (4) the device maintains a stable, regulated output voltage without a load current. (5) quiescent current is defined here as the difference in current between the input voltage source and the load at v out . (6) ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device. (7) dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mv below its nominal value. (8) short-circuit current (i sc ) for the lp5907 is equivalent to current limit. to minimize thermal effects during testing, i sc is measured with v out pulled to 100 mv below its nominal voltage. 6.5 electrical characteristics v in = v out(nom) + 1 v, v en = 1.2 v, i out = 1 ma, c in = 1 f, c out = 1 f (unless otherwise noted) (1) (2) (3) parameter test conditions min typ max unit v in input voltage t a = 25 c 2.2 5.5 v v out output voltage tolerance v in = (v out(nom) + 1 v) to 5.5 v, i out = 1 ma to 250 ma ? 2 2 %v out v in = (v out(nom) + 1 v) to 5.5 v, i out = 1 ma to 250 ma (v out < 1.8 v, sot-23, x2son packages) ? 3 3 line regulation v in = (v out(nom) + 1 v) to 5.5 v, i out = 1 ma 0.02 %/v load regulation i out = 1 ma to 250 ma 0.001 %/ma i load load current see (4) 0 250 ma maximum output current 250 i q quiescent current (5) v en = 1.2 v, i out = 0 ma 12 25 a v en = 1.2 v, i out = 250 ma 250 425 v en = 0.3 v (disabled) 0.2 1 i g ground current (6) v en = 1.2 v, i out = 0 ma 14 a v do dropout voltage (7) i out = 100 ma 50 mv i out = 250 ma (dsbga package) 120 200 i out = 250 ma (sot-23, x2son packages) 250 i sc short-circuit current limit t a = 25 c (8) 250 500 ma
7 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated electrical characteristics (continued) v in = v out(nom) + 1 v, v en = 1.2 v, i out = 1 ma, c in = 1 f, c out = 1 f (unless otherwise noted) (1) (2) (3) parameter test conditions min typ max unit (9) this specification is verified by design. (10) there is a 1-m resistor between en and ground on the device. psrr power-supply rejection ratio (9) f = 100 hz, i out = 20 ma 90 db f = 1 khz, i out = 20 ma 82 f = 10 khz, i out = 20 ma 65 f = 100 khz, i out = 20 ma 60 e n output noise voltage (9) bw = 10 hz to 100 khz i out = 1 ma 10 v rms i out = 250 ma 6.5 r ad output automatic discharge pulldown resistance v en < v il (output disabled) 230 t sd thermal shutdown t j rising 160 c thermal hysteresis t j falling from shutdown 15 logic input thresholds v il low input threshold v in = 2.2 v to 5.5 v, v en falling until the output is disabled 0.4 v v ih high input threshold v in = 2.2 v to 5.5 v v en rising until the output is enabled 1.2 v i en input current at en pin (10) v en = 5.5 v and v in = 5.5 v 5.5 a v en = 0 v and v in = 5.5 v 0.001 transient characteristics v out line transient (9) v in = (v out(nom) + 1 v) to (v out(nom ) + 1.6 v) in 30 s ? 1 mv v in = (v out(nom) + 1.6 v) to (v out(nom ) + 1.6 v) in 30 s 1 load transient (9) i out = 1 ma to 250 ma in 10 s ? 40 i out = 250 ma to 1 ma in 10 s 40 overshoot on start-up (9) stated as a percentage of v out(nom) 5% overshoot on start-up with en (9) stated as a percentage of v out(nom) , v in = v out + 1 v to 5.5 v, 0.7 f < c out < 10 f, 0 ma < i out < 250 ma, en rising until the output is enabled 1% t on turnon time from v en > v ih to v out = 95% of v out(nom) , t a = 25 c 80 150 s (1) the minimum capacitance should be greater than 0.5 f over the full range of operating conditions. the capacitor tolerance should be 30% or better over the full temperature range. the full range of operating conditions for the capacitor in the application must be considered during device selection to ensure this minimum capacitance specification is met. x7r capacitors are recommended however capacitor types x5r, y5v and z5u may be used with consideration of the application and conditions. (2) this specification is verified by design. 6.6 output and input capacitors over operating free-air temperature range (unless otherwise noted) parameter test conditions min (1) typ max unit c in input capacitance (2) capacitance for stability 0.7 1 f c out output capacitance (2) 0.7 1 10 f esr output/input capacitance (2) 5 500 m
8 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 6.7 typical characteristics v in = 3.7 v, v out = 2.8 v, i out = 1 ma, c in = 1 f, c out = 1 f, t a = 25 c (unless otherwise noted) figure 1. quiescent current vs input voltage figure 2. v en thresholds vs v in v out = 1.2 v, v en = v in figure 3. v out vs v in v out = 4.5 v, v en = v in figure 4. v out vs v in figure 5. ground current vs output current figure 6. load regulation 2.3 2.8 3.3 3.8 4.3 4.8 5.3 5.8 0 2 4 6 8 10 12 14 16 i q ( a) v in (v) sva-30180569 vin (v) ven (v) 2 2.5 3 3.5 4 4.5 5 5.5 6 0.5 0.6 0.7 0.8 0.9 1 d001 vih rising vil falling vin (v) vout (v) 0 0.5 1 1.5 2 2.5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 d002 rload = 1.2 k : rload = 4.8 : vin (v) vout (v) 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 d003 rload = 4.5 k : rload = 18 : 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 ground current ( a) i out (ma) vin = 3.0v vin = 3.8v vin = 4.2v vin = 5.5v sva-30180571 0 50 100 150 200 250 2.700 2.725 2.750 2.775 2.800 2.825 2.850 2.875 2.900 v out (v) load (ma) v in = 3.6v -40c 90c 25c sva-30180567
9 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated typical characteristics (continued) v in = 3.7 v, v out = 2.8 v, i out = 1 ma, c in = 1 f, c out = 1 f, t a = 25 c (unless otherwise noted) figure 7. v out vs temperature figure 8. line regulation figure 9. inrush current v in = 3.2 v ? 4.2 v, load = 1 ma figure 10. line transient v in = 3.2 v ? 4.2 v, load = 250 ma figure 11. line transient load = 0 ma ? 250 ma, ? 40 c figure 12. load transient junction temperature ( q c) ' v out (%) -50 -25 0 25 50 75 100 125 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 d010 3.0 3.5 4.0 4.5 5.0 5.5 2.700 2.725 2.750 2.775 2.800 2.825 2.850 2.875 2.900 v out (v) v in (v) load = 10 ma -40c 90c 25c sva-30180568 2 ms/div v out 2v/div 2v/div 1a/div v in = v en i in sva-30180509 10 s/div v out (ac coupled) 10 mv/ div 1v/div v in sva-30180510 10 s/div 10 mv/ div 1v/div v in v out (ac coupled) sva-30180511 100 s/div v out 100 mv/div load 200 ma/div sva-30180512
10 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated typical characteristics (continued) v in = 3.7 v, v out = 2.8 v, i out = 1 ma, c in = 1 f, c out = 1 f, t a = 25 c (unless otherwise noted) load = 0 ma ? 250 ma, 90 c figure 13. load transient load = 0 ma ? 250 ma, 25 c figure 14. load transient load = 0 ma figure 15. start-up load = 250 ma figure 16. start-up figure 17. noise density test figure 18. dropout voltage vs load current 100 s/div v out 100 mv/div load 200 ma/div sva-30180513 0 50 100 150 200 250 0 20 40 60 80 100 120 140 dropout voltage (mv) load current (ma) dropout voltage sva-30180573 20 s/div v out 1v/div en 1v/div sva-30180516 20 s/div v out 1v/div en 1v/div sva-30180515 100 s/div v out 100 mv/div load 200 ma/div sva-30180514
11 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated typical characteristics (continued) v in = 3.7 v, v out = 2.8 v, i out = 1 ma, c in = 1 f, c out = 1 f, t a = 25 c (unless otherwise noted) figure 19. psrr loads averaged 100 hz to 100 khz figure 20. psrr loads averaged 10 hz to 10 mhz frequency (khz) psrr (db) 0.1 1 10 100 -120 -100 -80 -60 -40 -20 0 d004 250 ma 200 ma 150 ma 100 ma 50 ma 20 ma frequency (khz) psrr (db) 0.01 0.1 1 10 100 1000 10000 -120 -100 -80 -60 -40 -20 0 d005 250 ma 200 ma 150 ma 100 ma 50 ma 20 ma
12 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 7 detailed description 7.1 overview designed to meet the needs of sensitive rf and analog circuits, the lp5907 provides low noise, high psrr, low quiescent current, as well as low line and load transient response figures. using new innovative design techniques, the lp5907 offers class leading noise performance without the need for a separate noise filter capacitor. the lp5907 is designed to perform with a single 1- f input capacitor and a single 1- f ceramic output capacitor. with a reasonable pcb layout, the single 1- f ceramic output capacitor can be placed up to 10 cm away from the lp5907 device. 7.2 functional block diagram 7.3 feature description 7.3.1 enable (en) the lp5907 en pin is internally held low by a 1-m resistor to gnd. the en pin voltage must be higher than the v ih threshold to ensure that the device is fully enabled under all operating conditions. the en pin voltage must be lower than the v il threshold to ensure that the device is fully disabled and the automatic output discharge is activated. 7.3.2 low output noise any internal noise at the lp5907 reference voltage is reduced by a first order low-pass rc filter before it is passed to the output buffer stage. the low-pass rc filter has a ? 3 db cut-off frequency of approximately 0.1 hz. in v bg 1.20v en + en en gnd por + out 1 m v ih r f c f + en en r ad
13 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated feature description (continued) 7.3.3 output automatic discharge the lp5907 output employs an internal 230- (typical) pulldown resistance to discharge the output when the en pin is low, and the device is disabled. 7.3.4 remote output capacitor placement the lp5907 requires at least a 1- f capacitor at the out pin, but there are no strict requirements about the location of the capacitor in regards the out pin. in practical designs, the output capacitor may be located up to 10 cm away from the ldo. 7.3.5 thermal overload protection (t sd ) thermal shutdown disables the output when the junction temperature rises to approximately 160 c which allows the device to cool. when the junction temperature cools to approximately 145 c, the output circuitry enables. based on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. this thermal cycling limits the dissipation of the regulator and protects it from damage as a result of overheating. the thermal shutdown circuitry of the lp5907 has been designed to protect against temporary thermal overload conditions. the t sd circuitry was not intended to replace proper heat-sinking. continuously running the lp5907 device into thermal shutdown may degrade device reliability. 7.4 device functional modes 7.4.1 enable (en) the lp5907 enable (en) pin is internally held low by a 1-m resistor to gnd. the en pin voltage must be higher than the v ih threshold to ensure that the device is fully enabled under all operating conditions. when the en pin is pulled low, and the output is disabled, the output automatic discharge circuitry is activated. any charge on the out pin is discharged to gnd through the internal 230- (typical) pulldown resistance. 7.4.2 minimum operating input voltage (v in ) the lp5907 does not include any dedicated uvlo circuitry. the lp5907 internal circuitry is not fully functional until v in is at least 2.2 v. the output voltage is not regulated until v in has reached at least the greater of 2.2 v or (v out + v do ).
14 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the lp5907 is designed to meet the requirements of rf and analog circuits, by providing low noise, high psrr, low quiescent current, and low line or load transient response figures. the device offers excellent noise performance without the need for a noise bypass capacitor and is stable with input and output capacitors with a value of 1 f. the lp5907 delivers this performance in industry standard packages such as dsbga, x2son, and sot-23 which, for this device, are specified with an operating junction temperature (t j ) of ? 40 c to 125 c. 8.2 typical application figure 21 shows the typical application circuit for the lp5907. input and output capacitances may need to be increased above the 1 f minimum for some applications. figure 21. lp5907 typical application 8.2.1 design requirements design parameter example value input voltage range 2.2 v to 5.5 v output voltage 1.8 v output current 200 ma output capacitor range 0.7 f to 10 f input/output capacitor esr range 5 to 500 m en in out gnd 1 p f 1 p f input enable gnd output lp5907
15 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 8.2.2 detailed design procedure 8.2.2.1 custom design with webench ? tools click here to create a custom design using the lp5907 device with the webench ? power designer. 1. start by entering the input voltage (v in ), output voltage (v out ), and output current (i out ) requirements. 2. optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. compare the generated design with other possible solutions from texas instruments. the webench power designer provides a customized schematic along with a list of materials with real-time pricing and component availability. in most cases, these actions are available: ? run electrical simulations to see important waveforms and circuit performance ? run thermal simulations to understand board thermal performance ? export customized schematic and layout into popular cad formats ? print pdf reports for the design, and share the design with colleagues get more information about webench tools at www.ti.com/webench . 8.2.2.2 power dissipation and device operation the permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the ic, to the ultimate heat sink, the ambient environment. thus, the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die junction and ambient air. the maximum allowable power dissipation for the device in a given package can be calculated using equation 1 : p d-max = ((t j-max ? t a ) / r ja ) (1) the actual power being dissipated in the device can be represented by equation 2 : p d = (v in ? v out ) i out (2) these two equations establish the relationship between the maximum power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the device. these two equations should be used to determine the optimum operating conditions for the device in the application. in applications where lower power dissipation (p d ) and/or excellent package thermal resistance (r ja ) is present, the maximum ambient temperature (t a-max ) may be increased. in applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature (t a-max ) may have to be derated. t a-max is dependent on the maximum operating junction temperature (t j-max-op = 125 c), the maximum allowable power dissipation in the device package in the application (p d-max ), and the junction-to ambient thermal resistance of the part/package in the application (r ja ), as given by equation 3 : t a-max = (t j-max-op ? (r ja p d-max )) (3) alternately, if t a-max can not be derated, the p d value must be reduced. this can be accomplished by reducing v in in the v in ? v out term as long as the minimum v in is met, or by reducing the i out term, or by some combination of the two. 8.2.2.3 external capacitors like most low-dropout regulators, the lp5907 requires external capacitors for regulator stability. the device is specifically designed for portable applications requiring minimum board space and smallest components. these capacitors must be correctly selected for good performance. 8.2.2.4 input capacitor an input capacitor is required for stability. the input capacitor should be at least equal to, or greater than, the output capacitor for good load transient performance. at least a 1 f capacitor has to be connected between the lp5907 input pin and ground for stable operation over full load current range. basically, it is ok to have more output capacitance than input, as long as the input is at least 1 f.
16 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated the input capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean analog ground. any good quality ceramic, tantalum, or film capacitor may be used at the input. note to ensure stable operation it is essential that good pcb practices are employed to minimize ground impedance and keep input inductance low. if these conditions cannot be met, or if long leads are to be used to connect the battery or other power source to the lp5907, ti recommends increasing the input capacitor to at least 10 f. also, tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low- impedance source of power (like a battery or a very large capacitor). if a tantalum capacitor is used at the input, it should be verified by the manufacturer to have a surge current rating sufficient for the application. the initial tolerance, applied voltage de-rating, and temperature coefficient must all be considered when selecting the input capacitor to ensure the actual capacitance is never less than 0.7 f over the entire operating range. 8.2.2.5 output capacitor the lp5907 is designed specifically to work with a very small ceramic output capacitor, typically 1 f. a ceramic capacitor (dielectric types x5r or x7r) in the 1 f to 10 f range, and with esr between 5 m to 500 m , is suitable in the lp5907 application circuit. for this device the output capacitor should be connected between the out pin and a good connection back to the gnd pin. it may also be possible to use tantalum or film capacitors at the device output, v out , but these are not as attractive for reasons of size and cost (see capacitor characteristics ). the output capacitor must meet the requirement for the minimum value of capacitance and have an esr value that is within the range 5 m to 500 m for stability. like the input capacitor, the initial tolerance, applied voltage de-rating, and temperature coefficient must all be considered when selecting the input capacitor to ensure the actual capacitance is never less than 0.7 f over the entire operating range. 8.2.2.6 capacitor characteristics the lp5907 is designed to work with ceramic capacitors on the input and output to take advantage of the benefits they offer. for capacitance values in the range of 1 f to 10 f, ceramic capacitors are the smallest, least expensive and have the lowest esr values, thus making them best for eliminating high frequency noise. the esr of a typical 1 f ceramic capacitor is in the range of 20 m to 40 m , which easily meets the esr requirement for stability for the lp5907. a better choice for temperature coefficient in a ceramic capacitor is x7r. this type of capacitor is the most stable and holds the capacitance within 15% over the temperature range. tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 1 f to 10 f range. another important consideration is that tantalum capacitors have higher esr values than equivalent size ceramics. this means that while it may be possible to find a tantalum capacitor with an esr value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same esr value. it should also be noted that the esr of a typical tantalum increases about 2:1 as the temperature goes from 25 c down to ? 40 c, so some guard band must be allowed. 8.2.2.7 remote capacitor operation the lp5907 requires at least a 1- f capacitor at the out pin, but there is no strict requirements about the location of the capacitor in regards to the pin. in practical designs the output capacitor may be located up to 10 cm away from the ldo. this means that there is no need to have a special capacitor close to the output pin if there is already respective capacitors in the system (like a capacitor at the input of supplied part). the remote capacitor feature helps user to minimize the number of capacitors in the system.
17 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated as a good design practice, keep the wiring parasitic inductance at a minimum, which means to use as wide as possible traces from the ldo output to the capacitors, keeping the ldo output trace layer as close to ground layer as possible and avoiding vias on the path. if there is a need to use vias, implement as many as possible vias between the connection layers. the recommendation is to keep parasitic wiring inductance less than 35 nh. for the applications with fast load transients, it is recommended to use an input capacitor equal to or larger to the sum of the capacitance at the output node for the best load transient performance. 8.2.2.8 no-load stability the lp5907 remains stable, and in regulation, with no external load. 8.2.2.9 enable control the lp5907 may be switched on or off by a logic input at the en pin. a voltage on this pin greater than v ih turns the device on, while a voltage less than v il turns the device off. when the en pin is low, the regulator output is off and the device typically consumes less than 1 a. additionally, an output pulldown circuit is activated which ensures that any charge stored on c out is discharged to ground. if the application does not require the use of the shutdown feature, the en pin can be tied directly to the in pin to keep the regulator output permanently on. an internal 1-m pulldown resistor ties the en input to ground, ensuring that the device remains off if the en pin is left open circuit. to ensure proper operation, the signal source used to drive the en pin must be able to swing above and below the specified turnon or turnoff voltage thresholds listed in the electrical characteristics under v il and v ih . 8.2.3 application curves figure 22. start-up figure 23. load transient response 9 power supply recommendations this device is designed to operate from an input supply voltage range of 2.2 v to 5.5 v. the input supply must be well regulated and free of spurious noise. to ensure that the lp5907 output voltage is well regulated and dynamic performance is optimum, the input supply must be at least v out + 1 v. a minimum capacitor value of 1 f is required to be within 1 cm of the in pin. 20 s/div v out 1v/div en 1v/div sva-30180515 100 s/div v out 100 mv/div load 200 ma/div sva-30180514
18 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 10 layout 10.1 layout guidelines the dynamic performance of the lp5907 is dependant on the layout of the pcb. pcb layout practices that are adequate for typical ldos may degrade the psrr, noise, or transient performance of the lp5907. best performance is achieved by placing c in and c out on the same side of the pcb as the lp5907, and as close to the package as is practical. the ground connections for c in and c out must be back to the lp5907 ground pin using as wide and short a copper trace as is practical. connections using long trace lengths, narrow trace widths, and/or connections through vias must be avoided. these add parasitic inductances and resistance that results in inferior performance especially during transient conditions 10.1.1 x2son mounting the x2son package thermal pad must be soldered to the printed circuit board for proper thermal and mechanical performance. for more information, see the qfn/son pcb attachment application report. 10.1.2 dsbga mounting the dsbga package requires specific mounting techniques, which are detailed in an-1112 dsbga wafer level chip scale package . for best results during assembly, alignment ordinals on the pc board may be used to facilitate placement of the dsbga device. 10.1.3 dsbga light sensitivity exposing the dsbga device to direct light may cause incorrect operation of the device. light sources such as halogen lamps can affect electrical performance if they are situated in proximity to the device. light with wavelengths in the red and infrared part of the spectrum have the most detrimental effect; thus, the fluorescent lighting used inside most buildings has very little effect on performance. 10.2 layout examples figure 24. lp5907mf-x.x (sot-23) typical layout in gnd en out n/c c in c out 12 3 4 5 v in gnd enable v out gnd
19 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated layout examples (continued) figure 25. lp5907sn-xx (x2son) typical layout figure 26. lp5907a/uv-x.x (dsbga) typical layout b2 b1 a1 a2 v in v out power ground v en c in c out lp5907uv v in v out power ground v en c in c out lp5907sn 1 2 3 4
20 lp5907 snvs798n ? april 2012 ? revised april 2018 www.ti.com product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 11 device and documentation support 11.1 documentation support 11.1.1 custom design with webench ? tools click here to create a custom design using the lp5907 device with the webench ? power designer. 1. start by entering the input voltage (v in ), output voltage (v out ), and output current (i out ) requirements. 2. optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. compare the generated design with other possible solutions from texas instruments. the webench power designer provides a customized schematic along with a list of materials with real-time pricing and component availability. in most cases, these actions are available: ? run electrical simulations to see important waveforms and circuit performance ? run thermal simulations to understand board thermal performance ? export customized schematic and layout into popular cad formats ? print pdf reports for the design, and share the design with colleagues get more information about webench tools at www.ti.com/webench . 11.1.2 related documentation for related documentation, see the following: ? an-1112 dsbga wafer level chip scale package ? qfn/son pcb attachment application report 11.2 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 11.3 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.4 trademarks e2e is a trademark of texas instruments. webench is a registered trademark of texas instruments. all other trademarks are the property of their respective owners. 11.5 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 11.6 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions.
21 lp5907 www.ti.com snvs798n ? april 2012 ? revised april 2018 product folder links: lp5907 submit documentation feedback copyright ? 2012 ? 2018, texas instruments incorporated 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 19-jun-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lp5907a28ykmr active dsbga ykm 4 3000 green (rohs & no sb/br) sac396 level-1-260c-unlim -40 to 125 q lp5907a33ykmr active dsbga ykm 4 3000 green (rohs & no sb/br) call ti level-1-260c-unlim -40 to 125 n lp5907mfx-1.2/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 lltb lp5907mfx-1.5/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 ln8b lp5907mfx-1.8/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 llub lp5907mfx-2.5/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 ln7b lp5907mfx-2.8/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 llyb lp5907mfx-2.85/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 ln4b lp5907mfx-2.9/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 1e5x lp5907mfx-3.0/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 llzb lp5907mfx-3.1/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 ln5b lp5907mfx-3.2/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 ln6b lp5907mfx-3.3/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 llvb lp5907mfx-4.5/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 125 llxb lp5907snx-1.2/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cf lp5907snx-1.8/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cg lp5907snx-1.9 active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 3z
package option addendum www.ti.com 19-jun-2018 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lp5907snx-2.2/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 ep lp5907snx-2.5/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 f9 lp5907snx-2.7/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 ch lp5907snx-2.75 active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 hi lp5907snx-2.8/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 ci lp5907snx-2.85/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cj lp5907snx-2.9/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 gv lp5907snx-3.0/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 ck lp5907snx-3.1/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cl lp5907snx-3.2/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cm lp5907snx-3.3/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 cn lp5907snx-4.0/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 gu lp5907snx-4.5/nopb active x2son dqn 4 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 co lp5907uve-1.2/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 r lp5907uve-1.8/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 s lp5907uve-2.8/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 u lp5907uve-2.85/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 v lp5907uve-3.0/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 b
package option addendum www.ti.com 19-jun-2018 addendum-page 3 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lp5907uve-3.1/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 x lp5907uve-3.2/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 c lp5907uve-3.3/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 d lp5907uve-4.5/nopb active dsbga yke 4 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 z lp5907uvx-1.2/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 r lp5907uvx-1.6/nopb active dsbga yke 4 3000 green (rohs & no sb/br) sac396 level-1-260c-unlim -40 to 125 j lp5907uvx-1.8/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 s lp5907uvx-2.2/nopb active dsbga yke 4 3000 green (rohs & no sb/br) call ti level-1-260c-unlim -40 to 125 5 lp5907uvx-2.5/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 e lp5907uvx-2.8/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 u lp5907uvx-2.85/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 v lp5907uvx-3.0/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 b lp5907uvx-3.1/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 x lp5907uvx-3.2/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 c lp5907uvx-3.3/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 d lp5907uvx-4.5/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 z lp5907uvx19/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 8 lp5907uvx37/nopb active dsbga yke 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 125 9
package option addendum www.ti.com 19-jun-2018 addendum-page 4 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of lp5907 : ? automotive: lp5907-q1 note: qualified version definitions: ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lp5907a28ykmr dsbga ykm 4 3000 178.0 8.4 0.74 0.74 0.54 4.0 8.0 q1 lp5907a33ykmr dsbga ykm 4 3000 178.0 8.4 0.74 0.74 0.54 4.0 8.0 q1 lp5907mfx-1.2/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-1.5/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-1.8/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-2.5/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-2.8/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-2.85/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-2.9/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-3.0/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-3.1/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-3.2/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-3.3/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907mfx-4.5/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lp5907snx-1.2/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-1.8/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-1.9 x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-2.2/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 package materials information www.ti.com 27-jul-2018 pack materials-page 1
device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lp5907snx-2.5/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-2.7/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-2.75 x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-2.8/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-2.85/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-2.9/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-3.0/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-3.1/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-3.2/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-3.3/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-4.0/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907snx-4.5/nopb x2son dqn 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 q2 lp5907uve-1.2/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-1.2/nopb dsbga yke 4 250 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uve-1.8/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-1.8/nopb dsbga yke 4 250 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uve-2.8/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-2.8/nopb dsbga yke 4 250 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uve-2.85/nopb dsbga yke 4 250 178.0 8.4 0.7 0.7 0.48 4.0 8.0 q1 lp5907uve-2.85/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-3.0/nopb dsbga yke 4 250 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uve-3.0/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-3.1/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-3.1/nopb dsbga yke 4 250 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uve-3.2/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-3.3/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uve-4.5/nopb dsbga yke 4 250 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uve-4.5/nopb dsbga yke 4 250 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-1.2/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-1.2/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uvx-1.6/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uvx-1.8/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-1.8/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uvx-2.2/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uvx-2.5/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-2.8/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uvx-2.8/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-2.85/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-2.85/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uvx-3.0/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-3.0/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uvx-3.1/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uvx-3.1/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 package materials information www.ti.com 27-jul-2018 pack materials-page 2
device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lp5907uvx-3.2/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-3.3/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-4.5/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx-4.5/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uvx19/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 2.0 8.0 q1 lp5907uvx19/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 lp5907uvx37/nopb dsbga yke 4 3000 178.0 8.4 0.74 0.74 0.5 4.0 8.0 q1 lp5907uvx37/nopb dsbga yke 4 3000 178.0 8.4 0.71 0.71 0.51 2.0 8.0 q1 *all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) lp5907a28ykmr dsbga ykm 4 3000 220.0 220.0 35.0 lp5907a33ykmr dsbga ykm 4 3000 220.0 220.0 35.0 lp5907mfx-1.2/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-1.5/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-1.8/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-2.5/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-2.8/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-2.85/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-2.9/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 package materials information www.ti.com 27-jul-2018 pack materials-page 3
device package type package drawing pins spq length (mm) width (mm) height (mm) lp5907mfx-3.0/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-3.1/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-3.2/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-3.3/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907mfx-4.5/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 lp5907snx-1.2/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-1.8/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-1.9 x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.2/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.5/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.7/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.75 x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.8/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.85/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-2.9/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-3.0/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-3.1/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-3.2/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-3.3/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-4.0/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907snx-4.5/nopb x2son dqn 4 3000 184.0 184.0 19.0 lp5907uve-1.2/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-1.2/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-1.8/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-1.8/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-2.8/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-2.8/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-2.85/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-2.85/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-3.0/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-3.0/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-3.1/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-3.1/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-3.2/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-3.3/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uve-4.5/nopb dsbga yke 4 250 220.0 220.0 35.0 lp5907uve-4.5/nopb dsbga yke 4 250 210.0 185.0 35.0 lp5907uvx-1.2/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-1.2/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-1.6/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-1.8/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-1.8/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-2.2/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-2.5/nopb dsbga yke 4 3000 210.0 185.0 35.0 package materials information www.ti.com 27-jul-2018 pack materials-page 4
device package type package drawing pins spq length (mm) width (mm) height (mm) lp5907uvx-2.8/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-2.8/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-2.85/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-2.85/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-3.0/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-3.0/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-3.1/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx-3.1/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-3.2/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-3.3/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-4.5/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx-4.5/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx19/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx19/nopb dsbga yke 4 3000 210.0 185.0 35.0 lp5907uvx37/nopb dsbga yke 4 3000 220.0 220.0 35.0 lp5907uvx37/nopb dsbga yke 4 3000 210.0 185.0 35.0 package materials information www.ti.com 27-jul-2018 pack materials-page 5
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