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  t h e b g a 7 0 0 l 1 6 is a wireless lan dual band low noise amplifer. the amplifer comprises a single stage amplifer for the 2.45 g h z band and a two- stage amplifer to meet the requirements of the 4.9 to 5.95 g h z band. the complete circuitry, including a temperature stabilization block, fts on one die and needs no external matching elements. one of the challenges of wireless lan application designers is to maximize network coverage and data throughput. the receiver system noise fgure determines sensitivity, network coverage and data throughput. the BGA700L16 uses a combination of silicon germanium carbon epitaxy proprietary process and a low ohmic on chip ground contact from infneon technologies to deliver the word best-in class noise fgure for wireless lan systems. the BGA700L16 ships as bare die or in a low profle tiny small leadless package code-named tslp-16. the package dimensions are 2.3 x 2.3 x 0.39 mm 3 . w w w . i n f i n e o n . c o m / s m a l l s i g n a l d i s c r e t e s applications 802.11a/b/g/n features input/output 50 w matched internally sige:c process shut down mode temperature stabilization benefts e xtended coverage ultra-low noise fgure small form factor h igh level of integration low cost tslp-16 package 2.3 x 2.3 x 0.39 mm 3 small signal discretes product brief BGA700L16 low noise amplifier for ieee 802.11a/b/g/n
product brief h ow to reach us: http://www.infneon.com published by infneon technologies ag 81726 munich, germany ? infneon technologies ag 2006. all rights reserved. legal disclaimer the information given in this product brief shall in no event be regarded as a guarantee of conditions or characteristics (beschaffenheitsgarantie). with respect to any examples or hints given herein, any typical values stated herein and/or any informa - tion regarding the application of the device, infneon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infneon technologies offce (www.infneon.com). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infneon technologies offce. infneon technologies components may only be used in life- support devices or systems with the express written approval of infneon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. published by infneon technologies ag application circuit bandgap referenc e and biasing ci rcuit 6 v cc 1 bac kside_gnd lna_on_5 2 v cc 2 lna_on_2 4 rf_in_2 4 rf_in_5 2 rf_out_5 2 rf_out_2 4 16 15 4 2 13 9 7 0 1 f 1 f performance band [ghz] supply voltage [v] supply current [ma] gain [db] noise figure [db] input p1db [db] 2.4 2.4 C 3.3 11 15 0.9 -10 5.6 2.4 C 3.3 17 21 1.3 -10 ordering no. b132- h 8884-x-x-7600 printed in germany ps 01071. nb


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