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QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 1 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com p ad configuration p ad no. label 1 rf input 2 vg1 3 vg2 4 vg3 5 rf output 6 vd3 7 vd2 8 vd1 applications ? satellite communications ? point - to - point communications general description qorvos qpa 2628d is a high - performance, low noise amplifier fabricated on qorvos production 90nm phe mt (qpht09) process. covering 2 5 C 3 1 ghz, the qpa262 8d provides 22 db small signal gain and p1db of 19 dbm , while supporting a noise figure of 1. 7 db and im3 levels of ?5 3 dbc (at pout=0 dbm/tone). the qpa 2628d is in die form, 2.40 x 1.00 x 0.10 mm, with both rf ports matched to 50 ohms and with integrated dc blocking caps on both i/o ports for simple system integration. the qpa 2628d high performance makes it ideal for satellite and point to point communication systems. lead - free and rohs compliant. evaluation boards are available upon request. ordering information part eccn description qpa 2628d 3a001.b.2.d 2 5 ? C ? 3 1 ghz low noise amplifier product features ? frequency range: 2 5 C 31 ghz ? noise figure: 1.7 db (typical) ? small signal gain: 22 db (typical) ? p 1db : 19 dbm (typical) ? im3: ? 53 dbc (pout=0 dbm/tone) (typical) ? bias: v d = 3.5 v, i dq = 9 0 ma, v g = ? 0.46 v ( t yp ical ) ? die dimensions: 2.40 x 1.00 x 0. 10 mm functional block diagram rf out rf in 1 5 8 7 6 2 3 4
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 2 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com absolute maximum ratings parameter value drain voltage (v d ) 5 .0 v drain current (i d 1 / i d 2 / i d 3) 45/45/160 ma gate voltage range 0 to ? 1.5 v gate current (i g 1 / i g 2 / i g 3 at 125 c) 5 .0 /5 .0 /6.6 ma rf input power (50 ?, 85 c ) 20 dbm channel temperature, t ch 175 c mounting temperature (30 seconds) 260 c storage temperature ? 55 to 150 c operation of this device outside the parameter ranges given above may cause permanent damage. these are stress ratings only, and functional operation of the device at these conditions is not implied. recommended operating conditions parameter value drain voltage 3.5 v drain current (quiescent, i dq ) 90 ma drain current (i d , low noise / p sat ) 90 / 200 ma gate voltage (typical) ? 0.46 v operating temperature range ? 40 to 85?c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions, unless otherwise noted: 25 c, v d = 3.5 v, i dq = 9 0 ma . data de - embedded to mmic bondwires . parameter min typical max units frequency 25 3 1 ghz small signal gain 22 db noise figure 1. 7 db 1 - db compression point 19 dbm input return loss 8 db outp ut return loss 14 db 3 rd order intermodulation level (pout=0 dbm/tone) ?53 dbc output toi (pout=0 dbm/tone) 27 dbm gain temperature coefficient ?0.013 dbm/c
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 3 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com thermal and reliability information parameter test conditions value units thermal resistance ( jc ) (1) t base = 85 c , v d = 3. 5 v , i d q = 90 m a quiescent/small signal operation p diss = 0.315 w 65.1 c /w channel temperature (t ch ) 105.5 c median lifetime (t m ) 1.236e08 hrs notes: 1. thermal resistance is measured to back of the mmic carrier plate. . median lifetime test conditions: v d = 4 v failure criteria = 10% reduction in i d _max 1e+04 1e+05 1e+06 1e+07 1e+08 1e+09 1e+10 1e+11 1e+12 1e+13 25 50 75 100 125 150 175 200 median lifetime, t m (hours) channel temperature, t ch ( c) median lifetime vs. channel temperature fet 17
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 4 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com typical performance : small signal test conditions unless otherwise noted: temp. = 25 c , v d = 3.5 v, i dq = 90 ma . data de - embedded to mmic bondwires. 10 12 14 16 18 20 22 24 26 28 30 24 25 26 27 28 29 30 31 32 s21 (db) frequency (ghz) gain vs. freq. vs. temp. ?40 c +25 c +85 c 10 12 14 16 18 20 22 24 26 28 30 24 25 26 27 28 29 30 31 32 s21 (db) frequency (ghz) gain vs. frequency vs. v d 3.0 v 3.5 v 4.0 v i dq = 90 ma -30 -25 -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 s11 (db) frequency (ghz) input return loss vs. freq. vs. temp. ?40 c +25 c +85 c -30 -25 -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 s11 (db) frequency (ghz) input return loss vs. freq. vs. v d 3.0 v 3.5 v 4.0 v i dq = 90 ma -30 -25 -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 s22 (db) frequency (ghz) output return loss vs. freq. vs. temp. ?40 c +25 c +85 c -30 -25 -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 s22 (db) frequency (ghz) output return loss vs. freq. vs. v d 3.0 v 3.5 v 4.0 v i dq = 90 ma
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 5 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com typical performance : small signal test conditions unless otherwise noted: temp. = 25 c , v d = 3.5 v, i dq = 9 0 ma . data de - embedded to mmic bondwires. 10 12 14 16 18 20 22 24 26 28 30 24 25 26 27 28 29 30 31 32 s21 (db) frequency (ghz) gain vs. frequency vs. i dq 70 ma 90 ma 110 ma v d = 3.5 v -30 -25 -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 s11 (db) frequency (ghz) input return loss vs. freq. vs. i dq 70 ma 90 ma 110 ma v d = 3.5 v -30 -25 -20 -15 -10 -5 0 24 25 26 27 28 29 30 31 32 s22 (db) frequency (ghz) output return loss vs. freq. vs. i dq 70 ma 90 ma 110 ma v d = 3.5 v
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 6 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com typical performance : noise figure test conditions unless otherwise noted: temp. = 25 c , v d = 3.5 v, i dq = 90 ma . data de - embedded to mmic bondwires. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 24 25 26 27 28 29 30 31 32 noise figure (db) frequency (ghz) noise figure vs. freq. vs. temp. ?40 c +25 c +85 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 24 25 26 27 28 29 30 31 32 noise figure (db) frequency (ghz) noise figure vs. frequency vs. v d 3.0 v 3.5 v 4.0 v i dq = 90 ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 24 25 26 27 28 29 30 31 32 noise figure (db) frequency (ghz) noise figure vs. frequency vs. i dq 70 ma 90 ma 110 ma v d = 3.5 v
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 7 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com typical performance : large signal test conditions unless otherwise noted: temp. = 25 c , v d = 3.5 v, i dq = 90 ma . data de - embedded to mmic bondwires. 10 12 14 16 18 20 22 24 26 24 25 26 27 28 29 30 31 32 output power (dbm) frequency (ghz) p1db vs. freq. vs. temp. -40 c +25 c +85 c 10 12 14 16 18 20 22 24 26 24 25 26 27 28 29 30 31 32 output power (dbm) frequency (ghz) psat vs. freq. vs. temp. -40 c +25 c +85 c 0 5 10 15 20 25 30 35 40 45 50 55 60 10 15 20 25 30 35 40 45 50 55 60 65 70 24 25 26 27 28 29 30 31 32 pae at psat (%) pae at p1db (%) frequency (ghz) pae vs. freq. vs. temp. ?40 c p1db +25 c p1db +85 c p1db ?40 c psat +25 c psat +85 c psat 2 4 6 8 10 12 14 16 18 20 22 24 26 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 output power (dbm) input power (dbm) output power vs. input power vs. freq. 25 ghz 28 ghz 31 ghz 12 14 16 18 20 22 24 26 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 power gain (db) input power (dbm) power gain vs. input power vs. freq. 25 ghz 28 ghz 31 ghz 80 100 120 140 160 180 200 220 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 drain current (ma) input power (dbm) drain current vs. input power vs. freq. 25 ghz 28 ghz 31 ghz
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 8 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com typical performance : l inearity test conditions unless otherwise noted: temp. = 25 c , v d = 3.5 v, i dq = 90 ma . data de - embedded to mmic bondwires. -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im3 (dbc) frequency (ghz) im3 vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 0 dbm -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im3 (dbc) frequency (ghz) im3 vs. frequency vs. v d 3.0 v 3.5 v 4.0 v i dq = 90 ma, d f =10 mhz, pout/tone = 0 dbm -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im3 (dbc) frequency (ghz) im3 vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 5 dbm -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im3 (dbc) frequency (ghz) im3 vs. frequency vs. i dq 70 ma 90 ma 110 ma v d = 3.5 v, d f =10 mhz, pout/tone = 0 dbm -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im3 (dbc) frequency (ghz) im3 vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 10 dbm 10 15 20 25 30 35 24 25 26 27 28 29 30 31 32 otoi (dbm) frequency (ghz) otoi vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 0 dbm
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 9 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com typical performance : linearity test conditions unless otherwise noted: temp. = 25 c , v d = 3.5 v, i dq = 90 ma . data de - embedded to mmic bondwires. -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im5 (dbc) frequency (ghz) im5 vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 0 dbm -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 22 23 24 25 26 27 28 29 30 31 32 im5 (dbc) frequency (ghz) im5 vs. frequency vs. v d 3.0 v 3.5 v 4.0 v i dq = 90 ma, d f =10 mhz, pout/tone = 0 dbm -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im5 (dbc) frequency (ghz) im5 vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 5 dbm -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 22 23 24 25 26 27 28 29 30 31 32 im5 (dbc) frequency (ghz) im5 vs. frequency vs. i dq 70 ma 90 ma 110 ma v d = 3.5 v, d f =10 mhz, pout/tone = 0 dbm -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 24 25 26 27 28 29 30 31 32 im5 (dbc) frequency (ghz) im5 vs. frequency vs. temperature -40 c +25 c +85 c d f =10 mhz, pout/tone = 10 dbm
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 10 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com application circuit bias - up procedure bias - down procedure 1. set i d limit to 22 0 ma, i g limit to 1 0 ma 1. turn off rf signal 2. set v g to ? 1.5 v 2. reduce v g to ? 1.5 v. ensure i dq ~ 0ma 3. set v d + 3.5 v 3. set v d to 0v 4. adjust v g more positive until i dq = 9 0ma (v g ~ ? 0.46 v typical) 4. turn off v d supply 5. turn off v g supply 5. apply rf signal c12 0.01 uf c15 1.0 uf c18 10 uf c9 10 uf c6 1.0 uf c3 0.01 uf rf out rf in v d v g 1 5 8 7 6 2 3 4
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 11 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com evaluation board and mounting detail rf layer is 0.008 thick rogers corp. ro4003c ( r = 3.35). metal layers are 0.5 oz. copper. the microstrip line at the connector interface is optimized for the southwest microwave end launch connector 1 4 92 - 0 4 a - 5. all d ata de - embedded to the mmic bondwires (shown) . note: multiple vias should be employed under die to minimize inductance and thermal resistance. ref . des. component value manuf. part number c3, c12 surface mount cap. cap 0.01uf +/ - 10% 50v 0402 x7r rohs various c6, c15 surface mount cap. cap 1.0uf +/ - 10% 16v 0603 x7r rohs various c9, c18 surface mount cap. cap cer 10uf 10v x7r 10% 0805 tdk rohs various mounting pad detail gnd vd c18 c15 c12 c3 c6 c9 gnd vg gnd gnd reference plane
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 12 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com mechanical drawing & bond pad description dimensions are in millimeters. pin number label description 1 rf input matched to 50 ohms, dc blocked 2 vg1 gate voltage; bias network is required (v g can be tied together at pcb) 3 vg2 gate voltage; bias network is required (v g can be tied together at pcb) 4 vg3 gate voltage; bias network is required (v g can be tied together at pcb) 5 rf output matched to 50 ohms, dc blocked 6 vd3 drain voltage; bias network is required (v d can be tied together at pcb) 7 vd2 drain voltage; bias network is required (v d can be tied together at pcb) 8 vd1 drain voltage; bias network is required (v d can be tied together at pcb) 1.000 0.905 0.500 0.095 0.000 0.000 0.100 0.557 1.120 1.833 2.300 2.400 0.436 1.186 1.998 1 5 2 3 4 8 7 6
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 13 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com assembly notes component placement and adhesive attachment assembly notes: ? vacuum pencils and/or vacuum collets are the preferred method of pick up. ? air bridges must be avoided during placement. ? the force impact is critical during auto placement. ? organic attachment (i.e., conductive epoxy) can be used in low - power applications. ? curing should be done in a convection oven; proper exhaust is a safety concern. reflow process assembly notes: ? use ausn (80/20) solder and limit exposure to temperatures above 300 ? c to 3 - 4 minutes, maximum. ? an alloy station or conveyor furnace with reducing atmosphere should be used. ? do not use any kind of flux. ? coefficient of thermal expansion matching is critical for long - term reliability. ? devices must be stored in a dry nitrogen atmosphere. interconnect process assembly notes: ? thermosonic ball bonding is the preferred interconnect technique. ? force, time, and ultrasonics are critical parameters. ? aluminum wire should not be used. ? devices with small pad sizes should be bonded with 0.0007 - inch wire.
QPA2628D 25? C ?31 ghz gaas low noise amplifier datasheet: rev - 03 - 14 - 16 - 14 of 14 - disclaimer: subject to change without notice ? 2016 triquint www.triquint.com , www.qorvo.com important notice the information contained herein is believed to be reliable. q orvo makes no warranties regarding the information contained herein. qorvo assumes no responsibility or liability whatsoever for any of the i nformation contained herein. q orvo assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for q orvo products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. q orvo products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably b e expected to cause severe personal injury or death. c ontact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about qorvo : web: www.triquint.com tel: +1. 972 . 994 . 8465 email: info - sales@triquint.com fax: +1. 972 . 994 . 8504 for technical questions and application information: email: info - products@triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: tbd value: tbd test: human body model (hbm) standard: jedec standard jesd22 - a114 solderability use only ausn (80/20) solder and limit exposure to temperatures above 300 c to 3 - 4 minutes, maximum. conductive epoxy die attach is recommended for pcbs. r o hs C compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free eccn us department of commerce : 3a001.b.2.d

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