date : 08- jul. - 2010 doc. no : qw0905-LSG13530-PF rev. : a data sheet round type led lamps LSG13530-PF pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
25.0min ? ? page 1/5 8.6 1.5max 5.0 ligitek electronics co.,ltd. property of ligitek only
absolute maximum ratings at ta=25 ? ?
r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) ambient temperature(
dip soldering preheat: 120 0 0 preheat 50 25 120 100 150 temp( 260
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. 1.t.sol=230
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