multilayer ceramic chip capacitors 1 of 3 creation date : november 20, 2017 (gmt) cga5l3x7r1h225m160ae tdk item description cga5l3x7r1h225mt***s applications automotive grade feature soft soft termination aec-q200 aec-q200 series cga5(3216) [eia 1206] status production size length(l) 3.20mm +0.40,-0.20mm width(w) 1.60mm +0.30,-0.20mm thickness(t) 1.60mm +0.30,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 2.2f 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 227m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 20, 2017 (gmt) cga5l3x7r1h225m160ae characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga5l3x7r1h225m160ae esr cga5l3x7r1h225m160ae capacitance cga5l3x7r1h225m160ae dc bias characteristic cga5l3x7r1h225m160ae temperature characteristic cga5l3x7r1h225m160ae(no bias) cga5l3x7r1h225m160ae(dc bias = 25v) ripple temperature rising cga5l3x7r1h225m160ae(100khz) cga5l3x7r1h225m160ae(500khz) cga5l3x7r1h225m160ae(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 20, 2017 (gmt) cga5l3x7r1h225m160ae associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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