View NX3DV221TK_8860340.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. general description the nx3dv221 is a high-bandwidth switch de signed for the switching of high-speed usb 2.0 signals in handset and consumer applications. these applications could be cell phones, digital cameras, and notebooks with hubs or controllers with limited usb i/os. the wide bandwidth (1 ghz) of this switch allows signal to pass with minimum edge and phase distortion. the device multiplexes diff erential outputs from a usb host device to one of two corresponding outputs. the switch is bidirectional and offers little or no attenuation of the high-speed signals at the outp uts. it is designed for low bit-to-bit skew and high channel-to-channel no ise isolation, and is compatible with various standards, such as high-speed usb 2.0 (480 mbps). 2. features and benefits ? wide supply voltage range from 2.3 v to 3.6 v ? switch voltage accepts signals up to 5.5 v ? 1.8 v control logic at v cc = 3.6 v ? low-power mode when oe is high (2 ? a maximum) ? 6 ? (maximum) on resistance ? 0.1 ? (typical) on resistance mismatch between channels ? 6 pf (typical) on -state capacitance ? high bandwidth (1.0 ghz typical) ? latch-up performance exceeds 100 ma per jesd 78b class ii level a ? esd protection: ? hbm jesd22-a114f class 3a exceeds 8000 v ? cdm jesd22-c101e exceeds 1000 v ? hbm exceeds 12000 v for i/o to gnd protection ? specified from ? 40 ? c to +85 ? c 3. applications ? routes signals for usb 1.0, 1.1 and 2.0 nx3dv221 high-speed usb 2.0 switch with enable rev. 4 ? 19 june 2013 product data sheet
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 2 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 4. ordering information 5. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. functional diagram table 1. ordering information type number package temperature range name description version nx3dv221gm ? 40 ? c to +85 ? c xqfn10 plastic extremely thin quad flat package; no leads; 10 terminals; body 2 ? 1.55 ? 0.5 mm sot1049-3 NX3DV221TK ? 40 ? c to +85 ? c hvson10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 ? 3 ? 0.85 mm sot650-2 table 2. marking type number marking code [1] nx3dv221gm x21 NX3DV221TK x21 fig 1. logic symbol 001aao078 controllogic charge pump v cc d+ d- 8 oe 6 s 9 7 2d- 4 2d+ 3 1d- 2 1d+ 1
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 3 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 7. pinning information 7.1 pinning 7.2 pin description 8. functional description [1] h = high voltage level; l = low voltage level; x = don?t care. fig 2. pin configuration sot1049-3 (xqfn10) fig 3. pin configuration sot650-2 (hvson10) ddd 2( 7udqvsduhqwwrsylhz ' ' 6 ' ' ' ' *1' 1;'9 9 && ddd 1;'9 2( ' *1' ' ' ' ' 6 ' 9 && 7udqvsduhqwwrsylhz whuplqdo lqgh[duhd table 3. pin description symbol pin description 1d+ 1 independent input or output 1d ? 2 independent input or output 2d+ 3 independent input or output 2d ? 4 independent input or output gnd 5 ground (0 v) oe 6 output enable input (active low) d ? 7 common input or output d+ 8 common input or output s 9 select input v cc 10 supply voltage table 4. function table [1] input channel s oe l l d+ = 1d+; d ? = 1d ? h l d+ = 2d+; d ? = 2d ? x h switches off
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 4 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 9. limiting values [1] the minimum input voltage rating may be exceeded if the input current rating is observed. [2] the minimum and maximum switch voltage ratings may be e xceeded if the switch clamping current rating is observed. 10. recommended operating conditions 11. static characteristics table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +4.6 v v i input voltage s, oe input [1] ? 0.5 +7.0 v v sw switch voltage [2] ? 0.5 +7.0 v i ik input clamping current v i < ? 0.5 v ? 50 - ma i sk switch clamping current v i < ? 0.5 v ? 50 - ma i sw switch current - ? 120 ma i cc supply current - +100 ma i gnd ground current ? 100 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? cto+125 ?c- 2 5 0 m w table 6. recommended operating conditions symbol parameter conditions min max unit v cc supply voltage 2.3 3.6 v v i input voltage s, oe input 0 v cc v v sw switch voltage 0 5.5 v t amb ambient temperature ? 40 +85 ?c table 7. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground 0 v). symbol parameter conditions t amb = 25 ?c t amb =-40 ? c to +85 ?c unit min typ max min max v ih high-level input voltage v cc = 2.3 v to 2.7 v - - - 0.46v cc -v v cc = 2.7 v to 3.6 v - - - 0.46v cc -v v il low-level input voltage v cc = 2.3 v to 2.7 v - - - - 0.25v cc v v cc = 2.7 v to 3.6 v - - - - 0.25v cc v v ik input clamping voltage v cc = 2.7 v, 3.6 v; i i = ? 18 ma --- - ? 1.8 v i i input leakage current s, oe input; v cc = 0 v, 2.7 v, 3.6; v i =gndto3.6v -0.01- - ? 1 ? a
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 5 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 11.1 test circuits i off power-off leakage current per pin; v cc =0v v sw = 0 v to 2.7 v - 0.01 - - ? 2.0 ? a v sw = 0 v to 3.6 v - 0.01 - - ? 2.0 ? a v sw =0vto5.25v - 0.01 - - ? 3.0 ? a i s(off) off-state leakage current nd+ and nd- ports; see figure 4 v cc = 2.7 v, 3.6 v - - - - ? 1 ? a i cc supply current v cc = 2.7 v, 3.6 v oe =gnd - 18.5 - - 30 ? a oe =v cc (low-power mode) -0.01- - 2 ? a ? i cc additional supply current s, oe input; one input at 1.8 v; other inputs at gnd or v cc v cc = 2.7 v - 0.8 - - 1.8 ? a v cc = 3.6 v - 12.5 - - 20 ? a c i input capacitance v sw = gnd or v cc ; v cc = 2.5 v, 3.3 v -1- - 2.5pf c s(off) off-state capacitance v sw = gnd or v cc ; v cc = 2.5 v, 3.3 v -3- - 5.0pf c s(on) on-state capacitance v sw = gnd or v cc ; v cc = 2.5 v, 3.3 v -6- - 7.5pf table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground 0 v). symbol parameter conditions t amb = 25 ?c t amb =-40 ? c to +85 ?c unit min typ max min max v i =0v; v o = 0 v to 5.25 v fig 4. test circuit for measuring off-state leakage current i s 001aao080 2 1 2dn v il or v ih v ih 1dn s dn switch v i v o gnd oe v cc v il v ih v ih v ih 1 2 s switch oe
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 6 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 11.2 on resistance [1] typical values are measured at t amb = 25 ? c. [2] measured at identical v cc , temperature and input voltage. [3] flatness is defined as the difference between the maximum and minimum value of on resistance measured at identical v cc and temperature. 11.3 on resistance test circuit and waveforms table 8. on resistance at recommended operating conditions; voltages are referenced to gnd (ground = 0 v); for graphs see figure 6 . symbol parameter conditions t amb = ? 40 ? c to +85 ?c t amb = ? 40 ? c to +85 ?c unit min typ [1] max min max r on on resistance v cc =2.3 v, 3.0v see figure 5 v i =0v; i i =30ma -3.6 - - 6 ? v i =2.4v; i i = ? 15 ma -4.3 - - 7 ? ? r on on resistance mismatch between channels v cc = 2.3 v, 3.0 v [2] v i =0v; i i =30ma -0.1 - - - ? v i =1.7v; i i = ? 15 ma -0.1 - - - ? r on(flat) on resistance (flatness) v cc =2.3 v, 3.0v; v i = 0 v to v cc [3] i i =30ma - 0.8 - - - ? i i = ? 15 ma - 0.7 - - - ? r on = v sw / i sw . fig 5. test circuit for measuring on resistance v 001aao081 2 1 2dn v il or v ih v il 1dn s dn switch v i i sw v sw gnd oe v cc v il v ih v il v il 1 2 s switch oe
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 7 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 12. dynamic characteristics fig 6. on resistance as a function of input voltage 001aao082 v i (v) 03 2 1 4.0 3.5 4.5 5.0 r on () 3.0 table 9. dynamic characteristics at recommended operating conditions; voltages are re ferenced to gnd (ground = 0 v); for test circuit, see figure 10 . symbol parameter conditions t amb = 25 ?c t amb = ? 40 ? c to +85 ?c unit min typ [1] max min max t pd propagation delay dn to ndn or ndn to dn; see figure 7 [2] [3] v cc = 2.3 v to 2.7 v - 0.25 - - - ns v cc = 3.0 v to 3.6 v - 0.25 - - - ns t en enable time s to dn, ndn; see figure 9 [3] v cc = 2.3 v to 2.7 v - - - - 50 ns v cc =3.0vto 3.6v --- - 30ns oe to dn, ndn; see figure 9 [3] v cc = 2.3 v to 2.7 v - - - - 32 ns v cc =3.0vto 3.6v --- - 17ns t dis disable time s to dn, ndn; see figure 9 [3] v cc = 2.3 v to 2.7 v - - - - 23 ns v cc =3.0vto 3.6v --- - 12ns oe to dn, ndn; see figure 9 [3] v cc = 2.3 v to 2.7 v - - - - 12 ns v cc =3.0vto 3.6v --- - 10ns
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 8 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable [1] typical values are measured at t amb = 25 ? c and v cc = 2.5 v and 3.3 v respectively. [2] the propagation delay is the calculated rc ti me constant of the typical on resistanc e of the switch and the specified load c apacitance, when driven by an ideal volt age source (zero output impedance). [3] t pd is the same as t plh and t phl . [4] guaranteed by design. 12.1 waveforms, test circuit and graphs t sk(o) output skew time see figure 8 [4] v cc = 2.3 v to 2.7 v - 0.1 - - 0.2 ns v cc = 3.0 v to 3.6 v - 0.1 - - 0.2 ns t sk(p) pulse skew time see figure 7 [4] v cc = 2.3 v to 2.7 v - 0.1 - - 0.2 ns v cc = 3.0 v to 3.6 v - 0.1 - - 0.2 ns table 9. dynamic characteristics ?continued at recommended operating conditions; voltages are re ferenced to gnd (ground = 0 v); for test circuit, see figure 10 . symbol parameter conditions t amb = 25 ?c t amb = ? 40 ? c to +85 ?c unit min typ [1] max min max logic levels: v ol and v oh are typical output voltage levels that occur with the output load. t sk(p) = |t phl ? t plh |. fig 7. the data input to output propagation delay times and pulse skew time 001aao083 t phl t plh 50% 50% input 800 mv 400 mv v oh v ol output
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 9 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable logic levels: v ol and v oh are typical output voltage levels that occur with the output load. t sk(o) = |t plh (1) ? t plh (2) | or |t phl (1) ? t phl (2) |. fig 8. output skew time 001aao084 t phl (1) t plh (1) 50% 50% input 800 mv 400 mv v oh v ol t sk(o) 50% output 1 output 2 v oh v ol t sk(o) t plh (2) t phl (2) measurement points are given in table 10 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 9. enable and disable times 001aao085 t en t dis t dis v x v x v x v x output off to high high to off output high to off off to high s, oe input v i v oh v m v m gnd v oh gnd gnd t en table 10. measurement points supply voltage input output v cc v m v i v x 2.3 v to 3.6 v 0.5v i 1. 8 v 0.9v oh
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 10 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable test data is given in table 11 . definitions test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. v ext = external voltage for measuring switching times. v i may be connected to s or oe . fig 10. test circuit for switching times 001aao086 2dn v il 1dn dn gnd v ext = v cc v i r l c l r l c l oe v cc g table 11. test data supply voltage input load v cc v i t r , t f c l r l 2.3 v to 3.6 v 1.8 v ? 5ns 50pf 500 ? fig 11. eye-pattern 480 mbps usb signal with no switch. 001aao087 + 0.5 v -0.5 v time scale (0.25 ns/div)
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 11 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable fig 12. eye-pattern 480 mbps usb signal with switch (normally closed path) 001aao088 + 0.5 v -0.5 v time scale (0.25 ns/div) fig 13. eye-pattern 480 mbps usb signal with switch (normally open path) 001aao089 + 0.5 v -0.5 v time scale (0.25 ns/div)
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 12 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 12.2 additional dynami c characteristics [1] f i is biased at 350 mv . [2] v i = 632 mv (p-p) . 12.3 test circuits table 12. additional dynamic characteristics at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v); v i = gnd or v cc (unless otherwise specified); t r =t f ? 5 ns; t amb =25 ? c. symbol parameter conditions min typ max unit f ( ? 3db) ? 3 db frequency response r l =50 ? ; see figure 14 [1] [2] v cc = 2.3 v to 2.7 v - 1.0 - ghz v cc = 3.0 v to 3.6 v - 1.0 - ghz ? iso isolation (off-state) f i = 250 mhz; r l =50 ? ; see figure 15 [1] [2] v cc = 2.3 v to 2.7 v - ? 38 - db v cc = 3.0 v to 3.6 v - ? 38 - db xtalk crosstalk between switches; f i = 250 mhz; r l =50 ? ;see figure 16 [1] [2] v cc = 2.3 v to 2.7 v - ? 40 - db v cc = 3.0 v to 3.6 v - ? 40 - db to obtain 0 dbm level at output, adjust f i voltage. increase f i frequency until db meter reads ? 3db. fig 14. test circuit for measuring the frequency response when switch is in on-state db 001aao090 2 1 2dn v il or v ih v il 1dn s 350 mv dn switch f i r l gnd oe v cc v il v ih v il v il 1 2 s switch oe
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 13 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable to obtain 0 dbm level at input, adjust f i voltage. fig 15. test circuit for measuring isolation (off-state) db 001aao091 2 1 2dn v il or v ih v ih 1dn s 350 mv dn switch f i r l gnd oe v cc v ih v il v ih v ih 1 2 s switch oe 350 mv r l fig 16. test circuit for measuring crosstalk db 001aao092 2 1 2dn v il or v ih v ih 1dn s 350 mv 350 mv dn f i r l gnd oe v cc r l 50
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 14 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 13. package outline fig 17. package outline sot1049-3 (xqfn10) references outline version european projection issue date iec jedec jeita sot1049-3 - - - mo255 - - - sot1049-3_po 10-12-06 11-03-30 unit (1) mm max nom min 0.5 0.05 0.00 0.25 0.20 0.15 0.33 0.28 0.23 1.65 1.55 1.45 2.1 2.0 1.9 1.5 0.48 0.43 0.38 0.1 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. xqfn10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.55 x 2.00 x 0.50 mm sot1049-3 a 1 c 0.127 bb 1 dee 0.5 e 1 ll 1 0.40 0.35 0.30 vw 0.05 y 0.05 y 1 0.05 0 1 2 mm scale d e terminal 1 index area b a x c y c y 1 detail x a a 1 c 1 4 5 10 b b 1 l l 1 terminal 1 index area e 1 e ac b ? v c ? w 9 6
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 15 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable fig 18. package outline sot650-2 (hvson10) references outline version european projection issue date iec jedec jeita sot650-2 - - - mo-229 - - - sot650-2_po 09-03-16 09-03-18 unit mm max nom min 1.00 0.85 0.80 0.05 0.03 0.00 0.2 3.1 3.0 2.9 2.5 2.4 2.3 3.1 3.0 2.9 0.5 2 0.1 a (1) dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. hvson10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm sot650-2 a 1 b 0.30 0.25 0.18 cd (1) d h e (1) e h 1.7 1.6 1.5 ee 1 l 0.45 0.35 0.30 v 0.41 0.35 0.28 kw 0.05 y 0.08 y 1 0.1 0 1 2 mm scale terminal 1 index area b a d e c y c y 1 detail x a a 1 c x terminal 1 index area b k e 1 e ac b v c w 10 6 5 1 l d h e h
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 16 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 14. abbreviations 15. revision history table 13. abbreviations acronym description cdm charged device model cmos complementary metal oxide semiconductor esd electrostatic discharge hbm human body model mm machine model table 14. revision history document id release date data sheet status change notice supersedes nx3dv221 v.4 20130619 product data sheet - nx3dv221 v.3 modifications: ? type number NX3DV221TK added. ? package outline drawing added ( figure 18 ). nx3dv221 v.3 20120705 product data sheet - nx3dv221 v.2 nx3dv221 v.2 20111109 product data sheet - nx3dv221 v.1 nx3dv221 v.1 20110421 product data sheet - -
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 17 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
nx3dv221 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 19 june 2013 18 of 19 nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors nx3dv221 high-speed usb 2.0 switch with enable ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 19 june 2013 document identifier: nx3dv221 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 functional description . . . . . . . . . . . . . . . . . . . 3 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 recommended operating conditions. . . . . . . . 4 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 11.1 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11.2 on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11.3 on resistance test circuit and waveforms . . . . 6 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12.1 waveforms, test circuit and graphs . . . . . . . . . 8 12.2 additional dynamic characteristics . . . . . . . . . 12 12.3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 17 contact information. . . . . . . . . . . . . . . . . . . . . 18 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

▲Up To Search▲

Price & Availability of NX3DV221TK

	To Download NX3DV221TK Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .