View BD8314NUV-E2_8847010.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com 3.0v to 12v, integrated 2.5a mosfet 1ch boost converter bd8314nuv general description bd8314nuv is a hi gh -efficiency step-up switching regulator with built-in power mosfet that can output 8v or 10 v from a 4-battery voltage supply such as li1cell, li2cell, or a 5v fixed power supply line. the built - in 80m n -channel fet switch is capable of handling output current up to 2.5a (dc). this ic has a flexible phase compensation system and a switching frequency of 1.2mhz allowing the use of smaller external output inductor and capacitor making the construction of a compact power supply really easy. features ? built-in 2.5a (dc)/14v n-channel fet switch ? on -chip phase compensation between input and output of error amp. ? output current: ? 600ma at 10v (3.5v to 10v input) ? 600ma at 8v (3 .0 v to 8 .0 v input) ? bui lt -in soft-start function. ? built-in timer latch system for short circuit protection function. applications portable equipment like dsc/dvc powered by 4 dry batteries or li2cell key specifications ? input voltage range: 3.0v to 12v ? output voltage range: 4. 0v to 12v ? switching frequency: 1.2mhz(typ) ? nch fet on-resistance: 8 0m (typ) ? standby current: 0 a ( t yp ) ? operating temperature range: - 25 c to +85c package w (typ) x d (typ) x h (max) typical application circuit input: 3.0v to 10v, output: 10 v / 500 ma pgnd stb inv swout pgnd gnd vcc lx lx 1 3 4 5 2 10 8 7 6 9 on /off vreg 10v/500ma 10p f 200k 10k 100k 22k 22f grm32eb31c226ke16 (murata) rsx201l- 30 (rohm) 4.7h de3518e(toko) 3.0 to 10 v 10f grm31cb31e106ka75l(murata) 1f grm21bb11c105ka01(murata) 1f grm188b11a105ka61(murata) 3.0 to 1 0v lx lx figure 1. typical application circuit vson010v3030 3.00mm x 3.00mm x 1.00mm datashee t downloaded from: http:///
2/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv pin configuration pin description pin no. pin name function 1 gnd ground pin 2 vcc supply voltage input pin 3 vreg 5v output terminal of regulator for internal circuit 4 , 5 lx power switch terminal for coil 6 , 7 pgnd power transistor ground pin 8 stb on/off terminal 9 inv error amp input pin 10 swout stbsw for split resistance block diagram figure 2. pin configuration lx gnd vreg vcc pgnd inv swout stb pgnd lx (top view) figure 3. block diagram lx downloaded from: http:///
3/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv description of blocks (1) vref this block generates the 1.0v internal reference voltage of the erro r amp. (2) uvlo this circuit prevents low voltage malfunction of the in ternal circuit during activation of the power supply voltag e or during low power supply voltage. it monitors the vreg pin voltage, turns off all output fet and dc/dc converter output, and resets the timer latch of the internal scp circuit and soft-start circuit when vreg voltage becomes lower than 2.4v. typical uvlo hysteresis is 100 mv. (3) scp scp is a timer latch system for short circuit protection. when the inv p in is set at 1.0v or lower, the internal scp circuit starts counting. the internal counter is in-sync with osc so that the latch circuit activates after a lapse of 13.3 msec or after the counter counts about 16000 oscillations, and then the dc/dc converter output is turned off. t o reset the latch circuit, turn off the stb pin once. then, turn it on again or turn on t he power supply voltage again. (4) osc osc block produces saw tooth waveform signal with operating frequen cy fixed at 1.2 mhz. (5) error amp the error amplifier detects the output signal and outputs pwm control signals. the internal reference voltage is set at 1.0 v. a primary phase compensation device of 200 pf, 6 2 k is built - in between the inverting input terminal and the output terminal of this error amp. (6) pwm comp pwm comp is the voltage- to -pulse-width converter for controlling the output voltage corresp onding to input voltage. it compares the internal slope waveform with the error amp output vo ltage, then, controls the pulse width of the output to the driver. maximum duty is set at 85%. (7) soft start the soft-start block prevents inrush current during startup by gradually increasing the output voltage of the dc/dc converter. soft-start time is in-sync with the internal osc so tha t the output voltage of the dc/dc converter reaches the set voltage after about 10000 oscillations. (8) pre driver cmos inverter circuit for driving the built-in nch fet. (9) stby_io voltage applied on stb pin (8 pin) controls the on/off sta te of the ic. the ic turns on when a voltage of 2.5v or hig her is applied and turns off when the terminal is open o r 0v is applied. a pull- down resistor approximately 400 k is built- in. (10) nch fet sw this is an internal fet switch that powers the output through the coil of the dc/dc converter . it is an 8 0 m nch fet sw that is capable of withstanding up to 14v across. since the c urrent rating of this fet is 2.5 a(dc), it should be used within 3 .5 a including the dc current ( less than 2.5a) and ripple current o f the coil. downloaded from: http:///
4/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv absolute maximum ratings parameter symbol rating unit maximum applied power voltage v cc , v lx 14 v maximum input voltage v swout , v i nv 14 v maximum input current i inmax 3 .5 a power dissipation pd 0.70 (note 1) w operating temperature range topr - 25 to +85 c storage temperature range tstg - 55 to +150 c junction temperature tjmax +150 c (note 1) when used at ta = 25c or more installed on a 74.2 x 74 .2 x 1.6 t mm board, the rating is reduced by 5. 6 mw/c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the interna l circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (t a = 25c) parameter symbol rating unit power s upply voltage v cc 3.0 to 12 v output voltage v out 4.0 to 12 v maximum input current (dc) i maxdc 2.5 v electrical characteristics (unless otherwise specified, ta = 25c, v cc = 7.4v) parameter symbol limit unit conditions min typ max [low input voltage malfunction prevention circuit] detection threshold voltage v uv - 2.4 2.6 v vreg monitor hysteresis range v uvhy 50 100 200 mv [oscillator] oscillation frequency f osc 1.1 1.2 1.3 mhz [regulator] output voltage v reg 4.65 5.0 5.35 v [error amp] inv threshold voltage v inv 0.99 1.00 1.01 v input bias current i inv - 50 0 +50 na v cc =11.0v , v inv =5.5v soft-start time t ss 5.3 8.8 12.2 msec [pwm comparator] lx max duty d max1 77 85 93 % [swout] on -resistance r onswout - 50 100 [output] lx nmos on-resistance r on - 80 150 m lx leak current i leak -1 0 +1 a [stb] stb p in control voltage operation v stbh 2.5 - v cc v no -operation v stbl -0.3 - +0.3 v stb p in p ull -down resistance r stb 250 400 700 k [circuit current] standby current vcc i stb - - 1 a circuit current at operation vcc i cc - 600 900 a v inv =1.2v downloaded from: http:///
5/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv typical performance curves ( un less otherwise specified, ta = 25c, v cc = 7.4v) figure 6. v reg voltage vs temperature temperature [ c] v reg voltage [v] 4.7 4.8 4.9 5.0 5.1 5.2 5.3 -40 0 40 80 120 figure 7. v reg vs v cc v cc [v] v reg [v] 0 1 2 3 4 5 6 7 8 0 2 4 6 8 10 12 14 figure 4. inv threshold vs temperature temperature [ c] inv threshold [v] 0.98 0.99 1.00 1.01 1.02 -40 -20 0 20 40 60 80 100 120 figure 5. inv threshold vs v cc v cc [v] inv threshold [v] 0.98 0.99 1.00 1.01 1.02 0 5 10 15 downloaded from: http:///
6/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv typical performance curves - continued figure 8. frequency vs temperature figure 9. frequency vs v cc v cc [v] frequency [mhz] 1.0 1.1 1.2 1.3 1.4 0 3 6 9 12 15 0 20 40 60 80 100 120 140 160 -40 0 40 80 120 i d =500ma figure 11. on-resistance vs temperature temperature [ c] on -resistance [m ] temperature [ c] frequency [mhz] 1.0 1.1 1.2 1.3 1.4 -40 0 40 80 120 figure 10. uvlo threshold voltage vs temperature temperature [ c] uvlo threshold voltage [v] hysteresis : vhys [v] 0.00 0.05 0.10 0.15 0.20 0.25 120 100 85 50 25 0 -25 -35 2.0 2.1 2.2 2.3 2.4 2.5 2.6 uvlorelease voltage uvlodetection uvlo hysteresis width downloaded from: http:///
7/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv typical performance curves - continued 0 20 40 60 80 100 120 3 6 9 12 15 i d =500ma figure 12. on-resistance vs v cc v cc [v] on -resistance [m ? ] 0 20 40 60 80 100 -40 0 40 80 120 i d =1ma temperature [ c] swout on-resistance [ ? ] 0 20 40 60 80 100 3 6 9 12 15 i d =1ma figure 1 5. swout on-resistance vs v cc v cc [v] swout on-resistance [ ? ] figure 14 . swout on-resistance vs temperature figure 1 3. stb voltage vs temperature temperature [ c] stb voltage [v] 1.0 1.5 2.0 2.5 -50 0 50 100 150 on off downloaded from: http:///
8/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv typical performance curves - continued figure 1 6. lx max duty vs temperature temperature [ c] lx max duty [%] 75 80 85 90 95 -40 0 40 80 120 figure 1 7. lx max duty vs v cc v cc [v] lx max duty [%] 75 80 85 90 95 3 6 9 12 15 figure 1 9. i cc vs v cc v cc [v] i cc [ a] 0 100 200 300 400 500 600 700 800 900 1000 0 5 10 15 figure 1 8. i cc vs temperature temperature [ c] i cc [ ua ] 0 100 200 300 400 500 600 700 800 900 1000 -40 0 40 80 120 downloaded from: http:///
9/ 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv application information ? example of application in put: 3.0v to 10v, output: 10v / 500ma ? reference application data 1 pgnd stb inv swout pgnd gnd vcc lx lx 1 3 4 5 2 10 8 7 6 9 on/off vreg 10v/500ma 10p f 200k 10 k 100k 22k 22f grm32eb31c226ke16 (murata) rsx201l- 30 (rohm) 4.7h de3518e(toko) 3.0 10 v 10f grm31cb31e106ka75l(murata) 1f grm21bb11c105ka01(murata) 1f grm188b11a105ka61(murata) 3. 0 1 0v lx lx figure 20 . reference application diagram figure 21 . power conversion efficiency 1 figure 22 . power conversion efficiency 2 0 20 40 60 80 100 1 10 100 1000 10000 output current [ma] efficiency [%] v cc =10v v cc =8.4v v cc =7.4v output current [ma] efficiency [%] 0 20 40 60 80 100 1 10 100 1000 10000 output current [ma] efficiency [%] v cc =6.0v v cc =4.8v output current [ma] efficiency [%] downloaded from: http:///
10 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv reference application data 1 - continued figure 23 . power conversion efficiency 3 0 20 40 60 80 100 1 10 100 1000 10000 output current [ma] efficiency [%] v cc =4.0v v cc =3.5v output current [ma] efficiency [%] figure 24 . line regulation figure 25 . load regulation 1 figure 26 . load regulation 2 9.5 9.7 9.9 10.1 10.3 10.5 10.7 10.9 0 5 10 15 input voltage [v] output voltage [v] io=100ma io=500ma input voltage [v] output voltage [v] 9.5 9.6 9.7 9.8 9.9 10.0 10.1 10.2 10.3 10.4 10.5 1 10 100 1000 10000 output current [ma] output voltage [v] v cc =10v v cc =6.0v v cc =7.4v v cc =8.4v output current [ma] output voltage [v] v cc =3.5v v cc =4.0v v cc =4.8v output current [ma] output voltage [v] downloaded from: http:///
11 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv reference application data 1 - continued figure 30 . frequency response property 4 (v cc = 3.0 v, i o = 500 ma) frequency [hz] gain [db] phase [deg] - 60 - 40 - 20 0 20 40 60 - 180 - 120 - 60 0 60 120 180 100 1k 10k 100k 1m phase gain figure 29 . frequency response property 3 (v cc = 8.4 v, i o = 200 ma) gain [db] phase [deg] 60 40 20 0 - 20 - 40 - 60 180 120 60 0 - 60 - 120 - 180 frequency [hz] 100 1k 10 k 100k 1m phase gain figure 27 . frequency response property 1 (v cc = 3.0v, i o = 200 ma) 60 40 20 0 - 20 - 40 - 60 frequency [hz] gain [db] phase [deg] 100 1k 10 k 100k 1m phase [deg] 180 120 60 0 - 60 - 120 - 180 phase gain figure 28 . frequency response property 2 (v cc = 6.0v, i o = 200 ma) phase [deg] gain [db] frequency [hz] 100 1k 10 k 100k 1m 60 40 20 0 - 20 -40 - 60 180 120 60 0 - 60 - 120 - 180 phase gain downloaded from: http:///
12 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv reference application data 1 - continued ? reference board pattern the heat sink on the rear should be a gnd plane of low impedance i n same potential with the pgnd plane. it is recommended to install a gnd pin in a system as shown i n the drawing without connecting it directly to this pgnd. vout gnd vbat lx 100 1000 10000 100000 1000000 100 1k 10 k 100k 1m frequency [hz] gain [db] 60 40 20 0 - 20 - 40 - 60 180 120 60 0 - 60 - 120 - 180 phase [deg] phase gain figure 31 . frequency response property 5 (v cc = 6.0 v, i o = 500 ma) fig ur e 32 . frequency response property 6 (v cc = 8.4 v, i o = 500 ma) gain [db] phase [deg] 60 40 20 0 - 20 - 40 - 60 100 1k 10 k 100k 1m 180 120 60 0 - 60 - 120 - 180 phase gain frequency [hz] downloaded from: http:///
13 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv ? limits of the lowest power supply voltage to start up in case the output voltage of the dc/dc converter is used as input to v cc to supply power to the ic, the actual voltage at v cc upon startup will drop by v f voltage of the external diode. the worst condition is shown as below. v cc terminal voltage - v f voltage of external diode the worst voltage of uvlo reset voltage (=2.8v) please use this ic with caution considering the needed start u p voltage and load current. ? selection of part for applications (1) inductor a shielded inductor with low dcr (direct resistance component) that satisfies the current rating (current value, ipeak as shown in the equation below) is recommended. inductor values affect inductor ripple current, which will caus e output ripple. ripple current can be reduced by increasing the coil l value and/or increasing the switching frequency ??? (1) ??? (2) where: is the efficiency ? i l is the output ri pple current f is the switching frequency as a guide, inductor ripple current should be set at about 20% to 5 0% of the maximum input current. note: current flowing in the coil that is larger than the coil rating brings it into magnetic saturation, which may lead to lower efficiency or output oscillation. select an indu ctor with an adequate margin so that the peak current does n ot exceed the rated current of the coil. (2) output capacitor a ceramic capacitor with low esr is recommended for output in order to red uce output ripple. there must be an adequate margin between the maximum rating an d output voltage of the capacitor, taking the dc bias property into consideration. output ripple voltage is obtained by the following equation. ??? (3) setting must be performed so that output ripple is within the allo wable ripple voltage. (3) output voltage setting i l figure 34 . inductor current 2.2 2.4 2.6 2.8 3.0 3.2 0.1 1.0 10.0 100.0 io [ma] vbat [ v ] fig ure 33 . start- up voltage v s l oad c urrent v out =10v, typ - 35 c 85 c 25 c l o [ma] ? ? a i v v i i l in out out peak 2/ / ?? ? ?? ? ? ?? ? ? ? ? ? a f v v v l v i out in out in l 1 ? ? ? ? ? ? ? v r i v c f v v i v esr out out o in out out pp ? ? ? ? ? ? ? i l downloaded from: http:///
14 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv the internal reference voltage of the error amp is 1.0 v. ou tput voltage is obtained by equation (4) of figure 35, but it should be designed taking into consideration the nmo s on-resistance of swout (about 50 ). ??? (4) (4) dc/dc converter frequency response adjustment system condition for stable application the condition for feedback system stability under negat ive feedback is that the phase delay is 135 or less wh en gain is 1 (0 db). since dc/dc converter application is sampled according to the switching frequency, the bandwidth g bw of the whole system (frequency at which gain is 0 db) must be controlled to be equal to or lower than 1/10 of the switching frequency. in summary, the conditions necessary for the dc/dc converter are: - phase delay must be 135or lower when gain is 1 (0 db). - bandwidth g bw (frequency when gain is 0 db) must be equal to or lower than 1 /10 of the switching frequency. to satisfy above two items, r 1 , r 2 , r 3 , c s and r s in figure 36 should be set as follows. (a) r 1 , r 2 , r 3 bd8314nuv incorporates phase compensation devices of r 4 =62k and c 2 =200pf. these c 2 and r 1 , r 2 , and r 3 values decide the primary pole that determines the bandwidth of dc/dc converter. primary pole point frequency ??? (5) dc/dc converter dc gain ??? (6) figure 35 . setting of voltage feedback resistance figure 36 . example of phase compensation setting fb v out c 2 r 1 r 2 rs r 4 cs r 3 inside of ic where: a is the error amp gain about 100db = 10 5 b is the oscillator amplification = 0.5 v in is the input voltage v out is the output voltage ? ? ? ? v r r r v o 0.1 2 2 1 ? ? ? ?? ?? ? ?? ?? ? ? ? ?? ? ? ?? ? ? ? ? ? ? 2 3 2 1 2 1 2 1 c r r r r r a f p ? in out out v v v b a gain dc ? ? ? ? 1 vref 1.0 v vout error amp r1 r2 inv stb swout v out v ref 1.0v r 1 r 2 downloaded from: http:///
15 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv using equations (5) and (6), the frequency f sw of point 0 db under limitation of the bandwidth of the dc ga in at the primary pole point is as shown below. ???? (7) it is recommended that f sw should be approximately 10khz. when load response is d ifficult, it may be set at approximately 20khz. by this setting, r 1 and r 2 , which determine the voltage value, will be in the orde r of several hundred k. t herefore, if an appropriate resistance value is not avail able and if routing may cause noise, the use of r 3 enables easy setting. (b) cs and rs setting in the step-up dc/dc converter, the secondary pole point is ca used by the coil and capacitor as expressed by the following equation. ???? (8) cout : output capacitor this secondary pole causes a phase rotation of 180. to secure the stability of the system, put zero points in 2 places to perform compensation. zero point by built-in cr khz c r fz 13 2 1 24 1 ? ? ??? (9) zero point by cs ? ? s c r r fz 3 1 2 2 1 ? ? ??? ( 10 ) setting f z2 frequency to be half to 2 times as large as f lc provides an appropriate phase margin. it is desirable to set rs at about 1/20 of (r 1 +r 3 ) to cancel any phase boosting at high frequencies. th ese pole points are summarized in the figure below. t he actual frequency property is different from the ideal calculation because of part constants. if possible, check the phase margin with a frequency analyzer or network analyzer, etc.. otherwise, check for the presence or absence of ringing by load response waveform and also check for the presence or absence of oscillation under a load of an ad equate margin. figure 37 . example of dc/dc converter frequency property (measured with fra5097 by nf corporation) d : (9) (10) (8) (7) in out out sw v v v b r r r r r c gain dc fp f ? ? ? ?? ? ?? ? ? ? ? ? ? ? ? 1 2 2 1 3 2 1 2 1 ? ? lcout d f lc ? 2 1 ? ? ? ? out in out v v v duty on / ? ? downloaded from: http:///
16 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv i/o equivalent circuit fb inv vreg swout stb lx, pgnd vreg vreg fb vcc stb vcc vreg vcc inv vcc vreg vcc swout vcc lx pgnd lx downloaded from: http:///
17 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the exp ected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
18 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 38. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rat ing. if however the rating is exceeded for a continued per iod, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from he at damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
19 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv ordering information b d 8 3 1 4 n u v - e 2 part number package nuv : v so n010v3030 packaging and forming specification e2 : embossed tape and reel marking diagram vson010v3030 (top view) 314 part number marking lot number 1pin mark bd8 downloaded from: http:///
20 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv physical dimension, tape and reel information package name vson010v3030 downloaded from: http:///
21 / 21 tsz02201-0q3q0nz00380-1-2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd8314nuv revision history date revision changes 26 .nov.2014 001 new release 17.feb.2015 002 correction of the writing. downloaded from: http:///
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD8314NUV-E2

	To Download BD8314NUV-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .