? semiconductor components industries, llc, 2013 june, 2013 ? rev. 1 1 publication order number: nsr0340v2t1/d nsr0340v2 schottky barrier diode schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc ? dc converter, clamping and protection applications in portable devices. nsr0340v2 in a sod ? 523 miniature package enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. features ? very low forward voltage drop ? 410 mv @ 100 ma ? low reverse current ? 0.5 a @ 25 v v r ? 250 ma of continuous forward current ? power dissipation of 200 mw with minimum trace ? very high switching speed ? low capacitance ? c t = 6 pf ? this is a pb ? free device typical applications ? lcd and keypad backlighting ? camera photo flash ? buck and boost dc ? dc converters ? reverse voltage and current protection ? clamping & protection markets ? mobile handsets ? mp3 players ? digital camera and camcorders ? notebook pcs and pdas ? gps maximum ratings rating symbol value unit reverse voltage v r 40 vdc forward continuous current (dc) i f 250 ma non ? repetitive peak forward surge current i fsm 1.0 a esd rating: human body model machine model esd class 2 class a stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 40 volt schottky barrier diode device package shipping ? ordering information 1 cathode 2 anode nsr0340v2t1g sod ? 523 (pb ? free) 3000 / tape & reel http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. sod ? 523 case 502 marking diagram 1 2 12 ad = device code m = date code* = pb ? free package *date code orientation position may vary depending upon manufacturing location. (note: microdot may be in either location) ad m NSR0340V2T5G sod ? 523 (pb ? free) 8000 / tape & reel
nsr0340v2 http://onsemi.com 2 thermal characteristics characteristic symbol max unit thermal resistance junction ? to ? ambient (note 1) total power dissipation @ t a = 25 c r ja p d 600 200 c/w mw thermal resistance junction ? to ? ambient (note 2) total power dissipation @ t a = 25 c r ja p d 300 400 c/w mw junction and storage temperature range t j , t stg ? 55 to +150 c 1. mounted onto a 4 in square fr ? 4 board 10 mm sq. 1 oz. cu 0.06? thick single ? sided. operating to steady state. 2. mounted onto a 4 in square fr ? 4 board 1 in sq. 1 oz. cu 0.06? thick single ? sided. operating to steady state. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse leakage (v r = 10 v) (v r = 25 v) (v r = 40 v) i r 0.2 0.5 1.5 1.0 3.0 6.0 a forward voltage (i f = 10 ma) (i f = 100 ma) (i f = 200 ma) v f 310 410 470 350 450 510 mv total capacitance (v r = 10 v, f = 1 mhz) ct 6.0 pf reverse recovery time (i f = i r = 10 ma, i r = 1.0 ma) t rr 5.0 ns 1. dc current source is adjusted for a forward current (i f ) of 10 ma. 2. pulse generator output is adjusted for a peak reverse recovery current i rm of 10 ma. 3. pulse generator transition time << t rr . 4. i r(rec) is measured at 1 ma. typically 0.1 x i rm or 0.25 x i rm . 5. t p ? t rr r l = 50 current transformer dut 750 h 0.1 f 50 output pulse generator t r t p 10% 90% i f i rm t rr i r(rec) = 1 ma output pulse (i f = i rm = 10 ma; measured at i r(rec) = 1 ma) i f pulse generator output figure 1. recovery time equivalent test circuit 50 input oscilloscope 0.1 f 0 v v r dc current source adjust for i rm + ?
nsr0340v2 http://onsemi.com 3 figure 2. forward voltage figure 3. leakage current v f , forward voltage (v) v r , reverse voltage (v) figure 4. total capacitance v r , reverse voltage (v) i f , forward current (ma) i r , reverse current ( a) c t , total capacitance (pf) 150 c 125 c ? 40 c 85 c 25 c 150 c 125 c ? 40 c 85 c 25 c t a = 25 c 0.01 0.1 1 10 100 1000 0 0.1 0.2 0.3 0.4 0.5 0.6 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 0 5 10 15 20 25 30 35 40
nsr0340v2 http://onsemi.com 4 package dimensions sod ? 523 case 502 issue e notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, pro- trusions, or gate burrs. e d ? x ? ? y ? b 2x m 0.08 x y a h c dim min nom max millimeters d 1.10 1.20 1.30 e 0.70 0.80 0.90 a 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 l 0.30 ref h 1.50 1.60 1.70 12 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e e recommended top view side view 2x bottom view l2 l 2x 2x 0.48 0.40 2x 1.80 dimension: millimeters package outline l2 0.15 0.20 0.25 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nsr0340v2t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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