ct micro rev 2 proprietary & confidential page 1 jul , 2013 PDP92406BT14 smd type photo diode package outline schematic features ? small double - end package ? high reliability ? high reverse breakdown ? high sensitivity ? fast response time ? rohs compliance applications ? i nfrared sensor ? l ight barrier ? infrared touch panel solutions description the pdp9 2406bt 14 is a silicon photo diode housed in a miniature smd package . the device comes with a superior filtering for visible light by utilizing special black molding compound. cathode anode
ct micro rev 2 proprietary & confidential page 2 jul , 2013 PDP92406BT14 smd type photo diode absolute maximum rating at 25 0 c symbol parameters ratings units notes v r reverse voltage 3 3 v t opr operating temperature - 40 ~ +85 0 c t stg storage temperature - 40 ~ +100 0 c t sol soldering temperature 260 0 c 1 p d power dissipation at(or below) 25 0 c free air temperature 138 mw r thja junction to ambient thermal resistance 540 0 c/w
ct micro rev 2 proprietary & confidential page 3 jul , 2013 PDP92406BT14 smd type photo diode elec tro - optical characteristics ta = 25c (unless otherwise specified) optical characteristics symbol parameters test conditions min typ max units notes ? spectral bandwidth - 7 0 0 - 1100 nm ? p peak sensitivity - - 9 0 0 - nm 1/2 view angle at x axis v r =5v - ? 52.5 - deg 2 view angle at y axis - ? 32.5 - electrical ch aracteristics symbol parameters test conditions min typ max units notes i d dark current ee=0mw /cm 2 v r =10v - - 10 na v br reverse breakdown voltage ee=0mw /cm 2 i r =10 0ua 33 210 - v v oc open - circuit voltage ee=1mw /cm 2 ? p = 940 nm - 0.3 - v i sc short - ci rcuit current - 1.0 - a i r reverse light current ee=1mw /cm 2 ? p = 940 nm , vr=5v 1.0 1.4 7 - a c t total capacitance ee=0mw /cm 2 f=1mhz , v r = 5 v - 5.04 - pf switching characteristics symbol parameters test conditions min typ max units notes t r rise ti me v r = 10v, r l = 10k ? - 230 - ns t f fall time - 200 - notes: 1. soldering time Q 5 seconds. 2 .
ct micro rev 2 proprietary & confidential page 4 jul , 2013 PDP92406BT14 smd type photo diode typical characteristic curves
ct micro rev 2 proprietary & confidential page 5 jul , 2013 PDP92406BT14 smd type photo diode typical characteristic curves
ct micro rev 2 proprietary & confidential page 6 jul , 2013 PDP92406BT14 smd type photo diode package dimension all dimensions are in mm, unless otherwise stated recommended soldering mask all dimensions are in mm, unless otherwise stated ordering information p art number description quantity pdp9 2406bt14 tape & reel 3 000 pcs
ct micro rev 2 proprietary & confidential page 7 jul , 2013 PDP92406BT14 smd type photo diode reel dimension all dimensions are in mm, unles s otherwise stated tape dimension all dimensions are in mm, unless otherwise stated
ct micro rev 2 proprietary & confidential page 8 jul , 2013 PDP92406BT14 smd type photo diode reflow profile profile feature pb - free assembly profile temperature min. (tsmin) 150c temperature max. (tsmax) 200c time (ts) from (tsmin t o tsmax) 60 - 120 seconds ramp - up rate (t l to t p ) 3c/second max. liquidous temperature (t l ) 217c time (t l ) maintained above (t l ) 60 C 150 seconds peak body package temperature 260c +0c / - 5c time (t p ) within 5c of 260c 30 seconds ramp - down rate (t p to t l ) 6c/second max time 25c to peak temperature 8 minutes max.
ct micro rev 2 proprietary & confidential page 9 jul , 2013 PDP92406BT14 smd type photo diode disclaimer ct micro reserves the right to make changes without further notice to any products herein to improve reliability, function or design. ct micro does not as sume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. _____________________________________________________________________ _________________ ct micro are not authorized for use as critical components in life support devices or systems without express written approval of ct micro international corp oration . 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instruction for use provided in the label l ing, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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