1. 2. 3. material content data sheet sales product name bso615c g issued 29. august 2013 ma# MA000982388 package pg-dso-8-7 weight* 81.34 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.490 3.06 3.06 30612 30612 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 114 non noble metal zinc 7440-66-6 0.037 0.05 456 non noble metal iron 7439-89-6 0.742 0.91 9118 non noble metal copper 7440-50-8 30.114 37.02 37.99 370248 379936 wire noble metal gold 7440-57-5 0.432 0.53 0.53 5305 5305 encapsulation organic material carbon black 1333-86-4 0.226 0.28 2778 inorganic material antimonytrioxide 1309-64-4 0.904 1.11 11112 plastics brominated resin - 0.904 1.11 11112 plastics epoxy resin - 5.197 6.39 63895 inorganic material silicondioxide 60676-86-0 37.960 46.67 55.56 466710 555607 leadfinish non noble metal tin 7440-31-5 0.814 1.00 1.00 10006 10006 plating noble metal silver 7440-22-4 0.541 0.67 0.67 6656 6656 glue plastics epoxy resin - 0.169 0.21 2079 noble metal silver 7440-22-4 0.797 0.98 1.19 9799 11878 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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