30.05.2012 sm t 850 -23 1 of 3 sm t 8 5 0 - 23 technical data infrared led , smd al ga as sm t 8 5 0 - 23 is a alga as led, mounted on a lead frame as top led package with plastic ball lens. on forward bias, it emits a radiation of typical 22 mw at a peak wavelength of 8 5 0 nm . specifications (uni t: mm) ? structure: alga as ? peak wavelength: 850 nm ? optical output power: 22 m w ? package: smd, ppa resin lead frame die: silver plated ? lens: epoxy resin (?2.6 mm) absolute maximum ratings (t a =25c) item symbol value unit power dissipation p d 1 6 0 mw forward current i f 10 0 ma pulse forward current * 1 i fp 10 00 ma reverse voltage v r 5 v junction temperature t j 100 c thermal resistance r thja 190 k/w operating temperature t opr - 2 0 ? +80 c storage temperature t stg - 30 ? +8 0 c solderi ng temperature * 2 t sol 255 c * 1 duty = 1%, pulse width = 10 s * 2 must be completed within 3 seconds at 26 0c electro - optical characteristics item symbol condition min. typ. max. unit forward voltage v f i f = 50 ma - 1.45 1.60 v pulse forward vol tage v f p i f p = 100ma, t p = 20ms - 1.50 1.80 v reverse current i r v r = 5 v - - 10 a total radiated power p o i f = 50 ma 16 22 - mw i f p = 100ma, t p = 20ms - 44 - radiant intensity i e i f = 50 ma - 4 0 - mw/sr i f p = 100ma, t p = 20ms - 80 - peak wave length p i f = 50 ma 8 3 5 8 5 0 8 6 5 nm half width ? i f = 50 ma - 40 - nm viewing half angle 1/2 i f = 50 ma - 15 - deg. rise time t r i f = 50 ma - 15 - ns fall time t f i f = 50 ma - 1 0 - ns radiate d power is measured by photodyne #500 radiant intensity is measu red by tektronix j -6512 note: the above specifications are for reference purpose only and subjected to change without prior notice.
30.05.2012 sm t 850 -23 2 of 3 typical performance curves relative spectral emission radiati on characteristics
30.05.2012 sm t 850 -23 3 of 3 precaution for use 1. cautions ? do not look directly into the emitting area of the led during operation! ? warning: led is em itting invisible light! 2. soldering conditions ? do not apply any stress to the lead particularly when heat. ? after soldering the leds should be protected from mechanical shock or vibration until the leds return to room temperature. ? when it is necessary to cla mp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. recommended land layout soldering conditions (unit: mm) 3. static electricity ? the leds are very sensitive to static electricity and surge voltage . so it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the leds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equi pment that mounts the leds. 4. heat generation ? thermal design of the end product is of paramount importance. please consider the heat generation of the led when making the system design. the coefficient of temperature increase per input electric power is aff ected by the thermal resistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification. ? the operating c urrent should be decided after considering the ambient maximum temperature of leds. 5. storage ? the leds should be stored at 30c or less and 60%rh or less after being shipped and the storage life limits are 3 months. if the leds are stored for 3 months or mo re, they can be stored for a year in a sealed container with nitrogen atmosphere and moisture absorbent material at less than 30%rh. ? please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.
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