1. 2. 3. material content data sheet sales product name tld2310el issued 16. september 2015 ma# MA001173206 package pg-ssop-14-5 weight* 82.77 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.376 1.66 1.66 16628 16628 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 416 non noble metal iron 7439-89-6 0.689 0.83 8324 non noble metal copper 7440-50-8 27.978 33.80 34.68 338007 346851 wire non noble metal copper 7440-50-8 0.075 0.09 0.09 906 906 encapsulation organic material carbon black 1333-86-4 0.101 0.12 1217 plastics epoxy resin - 4.634 5.60 55987 inorganic material silicondioxide 60676-86-0 45.637 55.14 60.86 551354 608558 leadfinish non noble metal tin 7440-31-5 0.988 1.19 1.19 11940 11940 plating noble metal silver 7440-22-4 0.768 0.93 0.93 9274 9274 glue plastics epoxy resin - 0.121 0.15 1461 noble metal silver 7440-22-4 0.363 0.44 0.59 4382 5843 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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