 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| AP7176B document number: ds35818 rev.3 - 2 1 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b 3a ultra low dropout linear regulator with enable description the AP7176B is a 3.0a ultra low-dr opout (ldo) linear regulator that features an enable input and a power-good output. the enable input and power-good output allow users to configure power management solutions that can meet the sequencing requirements of fpgas, dsps, and ot her applications with different start-up and power-down requirements. the AP7176B features two supply inputs, for power conversion supply and control. with the separation of the control and the power input very low dropout voltages can be reached and power dissipation is reduced. a precision reference and feedback control deliver 1.5% accuracy over load, line, and operating temperature ranges. the AP7176B is available in so-8ep, msop-8ep and u-dfn3030- 10 package with an exposed pad to reduce the junction to case resistance and extend the temperature range it can be used in. features ? v in range: 1.2v to 3.65v v cntl 3.0v to 5.5v ? adjustable output voltage ? continuous output current i out = 3a ? fast transient response ? power on reset monitoring on v cntl and v in ? internal soft-start ? stable with low esr mlcc capacitors ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) pin assignments applications ? notebook ? pc ? netbook ? wireless communication ? server ? motherboard ? dongle ? front side bus vtt (1.2v/3.3a) notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. u-dfn3030-10 vcntl vin vin vin en vout vout fb pg 1 2 3 4 5 10 9 8 7 6 vout gnd 11 (top view)
AP7176B document number: ds35818 rev.3 - 2 2 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b typical applications circuit figure 1 typical application circuit pin descriptions pin name pin number function so-8ep msop-8ep u-dfn3030-10 pg 1 1 5 power good.output open drain to indicate the status of v out via monitoring the fb pin. this pin is pulled low when the voltage is outside the limits, during thermal shutdown and if either v cntl or v in go below their thresholds. en 2 2 6 enable pin. driving this pin low will disable the part. when left floating an internal current source will pull this pin high and enable it. vin 3 3 7,8,9 power input pin for current supply. connect a decoupling capacitor ( 10f) as close as possible to the pin for noise filtering vcntl 4 4 10 bias supply for the controller, recomm ended 5v. connect a decoupling capacitor ( 1f) as close as possible to the pin for noise filtering. nc 5 5 no connection v out 6 6 1,2,3 power output pin fb 7 7 4 feedback to set the output voltage via an external resistor divider between v out and gnd gnd 8 8 11 ground pad ep ep ep exposed pad connected to gnd for good thermal conductivity functional block diagram AP7176B document number: ds35818 rev.3 - 2 3 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b absolute maximum ratings (note 4) (@t a = +25c, unless otherwise specified.) symbol parameter rating unit v in v in supply voltage (v in to gnd) -0.3 to +4.0 v v cntl v cntl supply voltage (v cntl to gnd) -0.3 to +7.0 v v out v out to gnd voltage -0.3 to v in +0.3 v pg to gnd voltage -0.3 to +7.0 v en, fb to gnd voltage -0.3 to v cntl +0.3 v p d power dissipation (so-8ep) 1.7 w power dissipation (msop-8ep) 1.5 power dissipation (u-dfn3030-10) 1.9 t j maximum junction temperature 150 c t stg storage temperature -65 to +150 c t sdr maximum lead soldering temperature, 10 seconds 260 c note: 4. stresses greater than the 'absolute maximum ratings' sp ecified above, may cause permane nt damage to the device. these are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. recommended operating conditions (@t a = +25c, unless otherwise specified.) symbol parameter test condition range unit v cntl v cntl supply voltage 3.0 to 5.5 v v in v in supply voltage 1.2 to 3.65 v v out v out output voltage (when v cntl - v out >1.9v) 0.8 to v in ? v drop v i out v out output current 0 to 3 a c out v out output capacitance i out = 3a at 25% nominal v out 8 to 1100 f i out = 2a at 25% nominal v out 8 to 1700 i out = 1a at 25% nominal v out 8 to 2400 e srcout esr of v out output capacitor 0 to 200 m ? t a ambient temperature -40 to +85 c t j junction temperature -40 to +125 c electrical characteristics (specifications apply over v cntl = 5v, v in = 1.8v, v out = 1.2v and t a = -40c to +85c, typical values @t a = +25c, unless otherwise specified.) symbol parameter conditions AP7176B unit min typ max supply current iv cntl v cntl supply current en = v cntl , i out = 0a ? 1.0 1.5 ma i sd v cntl supply current at shutdown en = gnd ? 15 30 a v in supply current at shutdown en = gnd, v in = 3.65v ? ? 1 a power-on-reset (por) rising v cntl por threshold 2.50 2.70 2.95 v v cntl por hysteresis ? 0.4 ? v rising v in por threshold 0.8 0.9 1.0 v v in por hysteresis ? 0.5 ? v AP7176B document number: ds35818 rev.3 - 2 4 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b electrical characteristics (cont.) (specifications apply over v cntl = 5v, v in = 1.8v, v out = 1.2v and t a = -40c to +85c, typical values @t a = +25c, unless otherwise specified.) symbol parameter conditions AP7176B unit min typ max output voltage v ref reference voltage fb=v out ? 0.8 ? v output voltage accuracy v cntl = 3.0 ~ 5.5v, i out = 0~3a, t j = -40 to +125c -1.5 ? +1.5 % load regulation i out =0a to 3a ? 0.06 0.25 % line regulation i out =10ma, v cntl = 3.0 to 5.5v -0.15 ? +0.15 %/v v out pull-low resistance v cntl = 3.3v, v en = 0v, v out <0.8v ? 10 ? ? fb input current v fb = 0.8v -100 ? +100 na dropout voltage v drop v in -to-v out dropout voltage (note 5) v cntl = 5.0v, i out = 3a v out = 2.5v t j = 25c ? 0.33 0.38 v t j = -40c to +125c ? 0.53 v out = 1.8v t j = +25c ? 0.31 0.36 t j = -40c to +125c ? 0.50 v out = 1.2v t j = +25c ? 0.30 0.35 t j = -40c to +125c ? ? 0.48 i lim current-limit level t j = +25c, v out = 80% v nominal 4.5 5.7 6.7 a t j = -40c to +125c 4.2 ? ? a protections i short short current-limit level v fb < 0.2v ? 1.1 ? a t sd thermal shutdown temperature t j rising ? 170 ? c thermal shutdown hysteresis ? 50 ? c enable and soft-start en logic high threshold voltage v en rising 0.5 0.8 1.1 v en hysteresis ? 0.1 ? v en pull-high current en = gnd ? 5 ? a t ss soft-start interval 0.3 0.6 1.2 ms turn on delay from being enabled to v out rising 10% 200 350 500 s power-good and delay v thpg rising pg threshold voltage v fb rising 90 92 95 % pg threshold hysteresis ? 8 ? % pg pull-low voltage pg sinks 5ma ? 0.25 0.4 v pg debounce interval v fb < falling pg voltage threshold ? 10 ? s pg delay time from v fb = v thpg to rising edge of the v pg 1 2 4 ms thermal characteristic ja thermal resistance junction-to- ambient so-8ep (note 6) ? 70 ? c/w msop-8ep (note 7) ? 80 ? c/w u-dfn3030-10 (note 6) ? 60 ? c/w jc thermal resistance junction-to- ambient so-8ep (note 6) ? 30 ? c/w msop-8ep (note 7) ? 30 ? c/w u-dfn3030-10 (note 6) ? 20 ? c/w notes: 5. dropout voltage is the voltage diff erence between the input and th e output at which the output voltage drops 2% below its nominal value. 6. device mounted on 2"*2" fr-4 substrate pc board, 2oz copper, wi th minimum recommended pad on top layer and thermal vias to bott om layer ground plane. 7. device mounted on 2"*2" fr-4 substrate pc board, 2oz copper,wit h minimum recommended pad layout. AP7176B document number: ds35818 rev.3 - 2 5 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b typical characteristics AP7176B document number: ds35818 rev.3 - 2 6 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b typical characteristics (cont.) AP7176B document number: ds35818 rev.3 - 2 7 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b typical characteristics (cont.) AP7176B document number: ds35818 rev.3 - 2 8 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b operating waveforms (test conditions v in = 1.8v, v cntl = 5v, v out 1.2v, t a = +25c unless otherwise specified.) enable c out = 10f, c in = 10f, r l = 0.4 ? ch1: v en , 5v/div, dc ch2: v out , 1v/div, dc ch3: v pg , 5v/div, dc ch4: i out , 2a/div, dc time: 1ms/di v v e n v out v pg i out shutdown c out = 10f, c in = 10f, r l = 0.4 ? ch1: v en , 5v/div, dc ch2: v out , 1v/div, dc ch3: v pg , 5v/div, dc ch4: i out , 2a/div, dc time: 4 s/di v v en v out v p g i out over current protection c out = 10f, c in = 10f, i out = 2a to 5.6a ch1: v out , 0.5v/div, dc ch4: i out , 2a/div, dc time: 0.2ms/div v ou t i ou t load transient response i out = 10ma to 3a to10ma (rise / fall time = 1s) c out = 10f, c in = 10f ch2: v out , 50mv/div, ac ch4: i out , 1a/div, dc time: 50s/div v ou t i ou t power of f c out = 10f, c in =10f, r l = 0.4 ? ch1: v cntl , 5v/div, dc ch2: v in , 1v/div, dc ch3: v out , 1v/div, dc ch4: v pg , 5v/div, dc time: 2ms/di v v in v c ntl v out v p g power on c out =10f, c in =10f, r l = 0.4 ? ch1: v cntl , 5v/div, dc ch2: v in , 1v/div, dc ch3: v out , 1v/div, dc ch4: v pg , 5v/div, dc time: 2ms/di v v in v c ntl v ou t v p g AP7176B document number: ds35818 rev.3 - 2 9 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b application information power good and delay AP7176B monitors the feedback voltage v fb on the fb pin. an internal delay timer is started after the pg voltage threshold (v thpg ) on the fb pin is reached. at the end of the delay time an internal nmos of the pg is turned off to indicate that the power at the output is g ood (pg). this monitoring function is cont inued during operation and if v fb falls 8% (typ) below v thpg , the nmos of the pg is turned on after a delay time of typical 10s to avoid oscillating of the pg signal. power on reset AP7176B monitors both supply voltages, v cntl and v in to ensure operation as intended. a soft-star t process is initiated after both voltages exceed their por threshold during power on. during operation the por component continues to monitor the supply voltage and pull s the pg low to indicate an out of regulation supply. this functi on will engage without regard to the status of the output. soft-start AP7176B incorporates an internal soft-start function. the output voltage rise is controlled to limit the current surge during s tart-up. the typical soft-start time is 0.6ms current-limit protection AP7176B monitors the current flow through the nmos and limits the maximum current to avoid damage to the load and AP7176B durin g overload conditions. short circuit current-limit protection AP7176B incorporates a current limit function to reduce the maximu m current to 1.1a (typ) when the voltage at fb falls below 0. 2v (typ) during an overload or short circuit situation. during start-up period, this function is dis abled to ensure successful heavy load start-up. enable control if the enable pin (en) is left open, an internal current source of ~5a pulls the pin up and enables the AP7176B. this will red uce the bill of material saving an external pull up resistor. driving the enabl e pin low disables the device. driving the pin high subsequently initiates a new soft- start cycle. output voltage regulation output voltage is set by resistor divider from v out via fb pin to gnd. internally v fb is compared to a 0.8v temperature compensated reference voltage and the nmos pass element regulates the output voltage while delivering current from v in to v out . setting the output voltage a resistor divider connected to fb pin programs the output voltage. v 2 r 1 r 1 v v ref out ? ? ? ? ? ? + ? = r1 is connected from v out to fb with kelvin sensing connecti on. r2 is connected from fb to gnd. to improve load transient response and stability, a bypass capacitor can be connected in parallel with r1. (optional in ty pical application circuit) power sequencing AP7176B requires no specific sequencing between v in and v cntl . however, care should be taken to avoid forcing v out for prolonged times without the presence of v in . conduction through internal parasitic diode (from v out to v in ) could damage AP7176B. thermal shutdown the pcb layout and power requirements for AP7176B under normal operation condition should allow enough cooling to restrict the junction temperature to +125c. the packages for AP7176B have an exposed pad to support this. these pack ages provide better connection t o the pcb and thermal performance. refer to the layout considerations. if AP7176B junction temperature reaches +170 c a thermal protection block disables t he nmos pass element and lets the part cool down. after its junction temperature drops by 50c (typ), a new soft-start cycle will be initiated. a new thermal protection will start, if the load or ambient conditions continue to raise the junction te mperature to +170c. this cycle will repeat until normal operation temperature is m aintained again. AP7176B document number: ds35818 rev.3 - 2 10 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b application information (cont.) output capacitor an output capacitor (c out ) is needed to improve transi ent response and maintain stability. the esr (equivalent series resistance) and capacitance drives the selection. care needs to be taken to cover the entire operating temperature range. the output capacitor can be an ultra-low-esr ceramic chip capacit or or a low esr bulk capacitor like a solid tantalum, poscap o r aluminum electrolytic capacitor. c out is used to improve the output stability and reduces the changes of the output voltage during load transitions. the slew rate o f the current sensed via the fb pin in AP7176B is reduc ed. if the application has large load variat ions, it is recommended to utilize low-esr bulk capacitors. it is recommended to place ceramic capacitor s as close as possible to the load and t he ground pin and care should be taken to r educe the impedance in the layout. input capacitor to prevent the input voltage from dropping during load st eps it is recommended to utilize an input capacitor (c in ). as with the output capacitor the following are acceptable, ultra-low-esr ceramic chip capacitor or low esr bulk capacitor like a solid tantalum, poscap or a luminum electrolytic capacitor. typically it is recommended to utilize an capacitance of at least 10f to avoid output voltage drop due to reduced input voltage. the value can be lower if v in changes are not critical for the application. layout consideration for good ground loop and stability, the input and output capacitor s should be located close to the input, output, and ground pi ns of the device. no other application circuit is connected wi thin the loop. avoid using vias within ground loop. if vias must be used, multiple vias should be used to reduce via inductance. the regulator ground pin should be connected to the external circuit ground to reduce voltage drop caused by trace impedance. g round plane is generally used to reduce trace impedance. wide trace should be used for large current paths from v in to v out , and load circuit. place the r1, r2, and c1 (optional) near the ldo as close as possible to avoid noise coupling. r2 is placed close to device ground. connect the ground of the r2 to the gnd pin by using a dedicated trace. connect the pin of the r1 directly to the load for kelvin sensing. no high current should flow through the ground trace of feedback loop and affect reference voltage stability. for the packages with exposed pads, heat sinking is accomplis hed using the heat spreading capability of the pcb and its copper traces. suitable pcb area on the top layer and thermal vias (0.3mm drill si ze with 1mm spacing, 4 to 8 vias at least) to the v in power plane can help to reduce device temperature greatly. reference layout plots: top layer bottom layer gnd vcntl vout en cin cout fb r1 r2 pg 1 c1 ccntl vin vcntl gnd gnd AP7176B document number: ds35818 rev.3 - 2 11 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b ordering information part number package code packaging 13? tape and reel quantity part number suffix AP7176Bsp-13 sp so-8ep 2500/tape & reel -13 AP7176Bmp-13 mp msop-8ep 2500/tape & reel -13 AP7176Bfn-7 fn u-dfn3030-10 3000/tape & reel -7 marking information (1) so-8ep (2) msop-8ep (3) u-dfn3030-10 ( top view ) y w x xx xx : identification code x : a~z : green y : year : 0~9 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part no. package identification code AP7176B u-dfn3030-10 a7 AP7176B document number: ds35818 rev.3 - 2 12 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (1) so-8ep (2) msop-8ep so-8ep (sop-8l-ep) dim min max typ a 1.40 1.50 1.45 a1 0.00 0.13 - b 0.30 0.50 0.40 c 0.15 0.25 0.20 d 4.85 4.95 4.90 e 3.80 3.90 3.85 e0 3.85 3.95 3.90 e1 5.90 6.10 6.00 e - - 1.27 f 2.75 3.35 3.05 h 2.11 2.71 2.41 l 0.62 0.82 0.72 n - - 0.35 q 0.60 0.70 0.65 all dimensions in mm msop-8ep dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 d1 1.60 2.00 1.80 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e2 1.30 1.70 1.50 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm gauge plane seating plane e1 e n e b a 45 e0 h f exposed pad bottom view l q c 7 4 3 9 (all sides) a1 d 14 85 1 d a a1 a2 e e y x seating plane gauge plane l d 8xb see detail c detail c c a e1 e3 a3 e2 4 x 1 0 4 x 1 0 0.25 d1 AP7176B document number: ds35818 rev.3 - 2 13 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b package outline dimensions (cont.) (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (3) u-dfn3030-10 suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (1) so8-ep (2) msop-8ep u-dfn3030-10 dim min max typ a 0.57 0.63 0.60 a1 0 0.05 0.02 a3 ? ? 0.15 b 0.20 0.30 0.25 d 2.90 3.10 3.00 d2 2.30 2.50 2.40 e ? ? 0.50 e 2.90 3.10 3.00 e2 1.50 1.70 1.60 l 0.25 0.55 0.40 z ? ? 0.375 all dimensions in mm dimensions value (in mm) c 1.270 x 0.802 x1 3.502 x2 4.612 y 1.505 y1 2.613 y2 6.500 dimensions value (in mm) c 0.650 g 0.450 x 0.450 x1 2.000 y 1.350 y1 1.700 y2 5.300 g x c y y2 y1 x1 seating plane a 3 a a1 pin#1 id l e e2 d d2 b e z c y1 x1 x y y2 x2 AP7176B document number: ds35818 rev.3 - 2 14 of 14 www.diodes.com april 2014 ? diodes incorporated new product a p7176b suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (3) u-dfn3030-10 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2014, diodes incorporated www.diodes.com dimensions value (in mm) z 2.60 g 0.15 x 1.80 x1 0.60 y 0.30 c 0.50 c y z x x1 g g |
Price & Availability of AP7176B
 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |
