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austriamicrosystems ag is now ams ag the technical content of this austriamicrosystems datasheet is still valid. contact information: headquarters: ams ag tobelbaderstrasse 30 8141 unterpremstaetten, austria tel: +43 (0) 3136 500 0 e - mail: ams_sales @ams.com please visit our website at www.ams.com
as5215 programmable 360o magnetic angle encoder with buffered sine & cosine output signals www.austriamicrosystems.com/as5215 revision 1.11 1 - 26 datasheet 1 general description the as5215 is a redundant, contactless rotary encoder sensor for accurate angular measurement over a full turn of 360o and over an extended ambient temperature range of -40oc to +150oc. based on an integrated hall element array, the angular position of a simple two-pole magnet is translated into analog output voltages. the angle information is provided by means of buffered sine and cosine voltages. this approach gives maximum flexibility in system design, as it can be directly integrated into existing architectures and optimized for various applications in terms of speed and accuracy. with two independent dies in one package, the device offers true redundancy. usually the bottom die, which is exposed to slightly less magnetic field is employed for plausibility check. an ssi interface is implemented for signal path configuration as well as a one time programmable register block (otp), which allows the customer to adjust the signal path gain to adjust for different mechanical constraints and magnetic field. figure 1. as5215 block diagram 2 key features contactless angular position encoding high precision analog output buffered sine and cosine signals ssi interface low power mode two programmable output modes: differential or single ended wide magnetic field input range: 20 ? 80 mt wide temperature range: -40oc to +150oc fully automotive qualified to aec-q100, grade 0 thin punched 32-pin qfn (7x7mm) package 3 applications the as5215 is ideal for electronic power steering systems and general purpose for automotive or industrial applications in microcontroller-based systems. vdd vss sinp/sinn sinn/sinp/cm_sin cosp/cosn cosn/cosp/cm_cos hall array & frontend amplifier cs dclk dio power management buffer stage buffer stage otp register digital part ssi interface as5215 prog note: this block diagram presents only one die. ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 2 - 26 as5215 datasheet - contents contents 1 general description ......................................................................................................... ......................................................... 1 2 key features................................................................................................................ ............................................................. 1 3 applications................................................................................................................ ............................................................... 1 4 pin assignments ....................................................................................................................................................................... 3 4.1 pin descriptions.................................................................................................................................................................................... 3 5 absolute maximum ratings .................................................................................................... .................................................. 5 6 electrical characteristics.................................................................................................. ......................................................... 6 6.1 timing characteristics .................................................................................................... ...................................................................... 7 7 detailed description........................................................................................................ .......................................................... 8 7.1 magnet diameter and vertical distance ..................................................................................... .......................................................... 8 7.1.1 the linear range ........................................................................................................ ................................................................ 8 7.1.2 magnet thickness........................................................................................................ .............................................................. 11 7.1.3 axial distance (airgap) ................................................................................................. ............................................................. 12 7.1.4 angle error vs. radial and axial misalignment.......................................................................................................................... 12 7.1.5 mounting the magnet ..................................................................................................... ............................................................ 12 7.1.6 summary ................................................................................................................. .................................................................. 14 8 application information ..................................................................................................... ...................................................... 15 8.1 sleep mode ................................................................................................................ ........................................................................ 15 8.2 ssi interface....................................................................................................................................................................................... 15 8.3 device communication / programming ........................................................................................ ...................................................... 16 8.4 waveform ? digital interface at normal operation mode..................................................................... .............................................. 18 8.5 waveform ? digital interface at extended mode ............................................................................. ................................................... 18 8.6 waveform ? digital interface at analog readback of the zener diodes ....................................................... ..................................... 19 8.7 easyzapp otp content ..................................................................................................................................................................... 19 8.8 analog sin/cos outputs with external interpolator ......................................................................... ................................................... 20 8.9 otp programming and verification .................................................................................................................................................... 21 9 package drawings and markings ............................................................................................... ............................................ 23 10 ordering information....................................................................................................... ...................................................... 25 ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 3 - 26 as5215 datasheet - pin assignments 4 pin assignments figure 2. pin assignments (top view) 4.1 pin descriptions table 1. pin descriptions pin name pin number description dio_1 1 data i/o for digital interface dio_2 2 tc_1 3 test coil tc_2 4 a_tst_1 5 analog test pin a_tst_2 6 prog_1 7 otp programming pad prog_2 8 as5215 2526 2728 29 30 16 151413 12 11 24 23 22 21 20 19 1 2 3 4 5 6 7 8 18 17 31 32 10 9 vss_1 vss_2 sinp_1 / sinn_1 sinn_1 / sinp_1 / cm_sin_1 sinp_2 / sinn_2 sinn_2 / sinp_2 / cm_sin_2 cosp_1 / cosn_1 cosn_1 / cosp_1 / cm_cos_1 nc nc nc nc nc nc cosn_2 / cosp_2 / cm_cos_2 cosp_2 / cosn_2 cs_2 cs_1 dclk_2 dclk_1 vdd_2 vdd_1 nc nc dio_1 dio_2 tc_1 tc_2 a_tst_1 a_tst_2 prog_1 prog_2 ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 4 - 26 as5215 datasheet - pin assignments vss_1 9 supply ground vss_2 10 sinp_1 / sinn_1 11 switchable buffered analog output sinn_1 / sinp_1 / cm_sin_1 12 switchable buffered analog or common mode output sinp_2 / sinn_2 13 switchable buffered analog output sinn_2 / sinp_2 / cm_sin_2 14 switchable buffered analog or common mode output cosp_1 / cosn_1 15 switchable buffered analog output cosn_1 / cosp_1 / cm_cos_1 16 switchable buffered analog or common mode output cosp_2 / cosn_2 17 switchable buffered analog output cosn_2 / cosp_2 / cm_cos_2 18 switchable buffered analog or common mode output nc 19 ------ nc 20 nc 21 nc 22 nc 23 nc 24 nc 25 nc 26 vdd_1 27 digital + analog supply vdd_2 28 dclk_1 29 clock input for digital interface dclk_2 30 cs_1 31 clock input for digital interface cs_2 32 table 1. pin descriptions pin name pin number description ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 5 - 26 as5215 datasheet - absolute maximum ratings 5 absolute maximum ratings stresses beyond those listed in table 2 may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in electrical characteristics on page 6 is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. table 2. absolute maximum ratings parameter min max units comments electrical parameters supply voltage (v dd )- 0 . 37v input pin voltage (v_in) -0.3 v dd +0.3 v input current (latchup immunity), i_scr -100 100 ma norm: eia/jesd78 class ii level a electrostatic discharge electrostatic discharge (esd) 2 kv norm: jesd22-a114e continous power dissipation total power dissipation (p tot ) 275 mw package thermal resistance ( _ja) 27 oc/w velocity =0; multi layer pcb; jedec standard testboard temperature ranges and storage conditions storage temperature (t_strg) -65 150 oc package body temperature (t_body) 260 oc norm: ipc/jedec j-std-020. the reflow peak soldering temperature (body temperature) specified is in accordance with ipc/jedec j-std-020 ?moisture/reflow sensitivity classification for non- hermetic solid state surface mount devices?. the lead finish for pb-free leaded packages is matte tin (100% sn). humidity non-condensing 585% moisture sensitive level (msl) 3 represents a maximum floor time of 168h ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 6 - 26 as5215 datasheet - electrical characteristics 6 electrical characteristics unless otherwise noted all in this specification defined tolerances of parameters are assured over the whole operation conditio ns range and also over lifetime. table 3. operating conditions symbol parameter condition min typ max unit v dd positive supply voltage 4.5 5.5 v v ss negative supply voltage 0.0 0.0 v t_amb ambient temperature -40 150 oc table 4. dc/ac characteristics for digital inputs and outputs symbol parameter condition min typ max unit cmos input v_ih high level input voltage 0.7 * v dd v v_il low level input voltage 0.3 * v dd v i_leak input leakage current 1 a cmos output v_oh high level output voltage 4 ma v dd - 0.5 v v_ol low level output voltage 4 ma v ss + 0.4 v c_l capacitive load 35 pf t_slew slew rate 30 ns t_delay time rise fall 15 ns cmos output tristate i_oz tristate leakage current 1 a table 5. magnetic input specification symbol parameter condition min typ max unit two pole cylindrical magnet, diametrically magnetized: d mag diameter 4 6 mm b pp magnetic input field amplitude 200 ? 800 gauss 20 50 80 mt f rot rotational speed max 30000 rpm 0 500 hz table 6. electrical system specifications symbol parameter condition min typ max unit idd current consumption max value derived at maximum i_h (hall bias current) note: for single die only. 20 28 ma t power_on power up time 1.275 ms t prop propagation delay -40 to 150oc 18 22 30 s m magnetic sensitivity 1g = 0.1 mt 1 6 mv/g v out analog output range vss+ 0.25 vdd- 0.5 v sf=sf 25c - ( ap1_1/ ap2_1) amplitude ratio tracking accuracy over temperature -40 to 150oc -1 +1 % ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 7 - 26 as5215 datasheet - electrical characteristics 6.1 timing characteristics remark: the digital interface will be reset during the low phase of the cs signal. sf=ap1_ 1/ap2_1 amplitude ratio mismatch at room temperature -2 2 % v offset1 dc offset ratiometric to v dd 0.294 0.3 0.306 v / v dd v offset2 0.49 0.5 0.51 v / v dd dc offdrift dc offset drift -40 to 150oc -50 +50 v/oc thd total harmonic distortion 0.2 % sr slew rate 1 v/s c load capacitive load 1000 pf table 7. timing characteristics symbol parameter condition min typ max unit t1_3 chip select to positive edge of dclk 30 - ns t2_3 chip select to drive bus externally 0-n s t3 setup time command bit data valid to positive edge of dclk 30 - ns t4 hold time command bit data valid after positive edge of dclk 15 - ns t5 float time positive edge of dclk for last command bit to bus float - dclk/ 2+0 ns t6 bus driving time positive edge of dclk for last command bit to bus drive dclk/ 2+0 -ns t7 data valid time positive edge of dclk to bus valid dclk/ 2+0 dclk/ 2+30 ns t8 hold time data bit data valid after positive edge of dclk dclk/ 2+0 -ns t9_3 hold time chip select positive edge dclk to negative edge of chip select dclk/ 2+0 -ns t10_3 bus floating time negative edge of chip select to float bus -3 0n s t11 setup time data bit at write access data valid to positive edge of dclk 30 - ns t12 hold time data bit at write access data valid after positive edge of dclk 15 - ns t13_3 bus floating time negative edge of chip select to float bus -3 0n s table 6. electrical system specifications symbol parameter condition min typ max unit ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 8 - 26 as5215 datasheet - detailed description 7 detailed description the as5215 is a redundant rotary encoder sensor front end. based on an integrated hall element array, the angular position of a simple two-pole magnet is translated into analog output voltages. the angle information is provided by means of sine and cosine voltages. this approach gives maximum flexibility in system design, as it can be directly integrated into existing architectures and optimized for various ap plications in terms of speed and accuracy. with two independent dies in one package, the device offers true redundancy. usually the bottom die, which is exposed to slight ly less magnetic field is employed for plausibility check. an ssi (spi standard) protocol is implemented for internal test access to the different circuit blocks and for signal path conf iguration. a one time programmable register block (otp) allows the customer to adjust the signal path gain to adjust for different mechani cal constraints and magnetic field strengths. furthermore, for internal use, the test mode can be enabled and the system oscillator is trimmable, dc offset of the output signal can be set to either 1.5v or 2.5v. a unique chip id is stored to ensure traceability. for operating point control, a band gap circuit is implemented together with a central bias block to distribute all reference b ias currents for the analog signal conditioning. the digital signal part is based on a 2mhz system, clk derived via. divider from a 4mhz system osci llator. figure 3. typical arrangement of as5215 and magnet 7.1 magnet diameter and vertical distance note: following is just an abstract taken from the elaborate application note on the magnet. for more detailed information, please visit our homepage www.austriamicrosystems.com magnetic rotary encoders magnet application notes 7.1.1 the linear range the hall elements used in the as5000-series sensor ics are sensitive to the magnetic field component bz, which is the magnetic field vertical to the chip surface. figure 4 shows a 3-dimensional graph of the bz field across the su rface of a 6mm diameter, cylindrical ndfeb n35h magnet at an axial distance of 1mm between magnet and ic. the highest magnetic field occurs at the north and south poles, which are located close to the edge of the magnet, at ~2.8mm ra dius (see figure 5) . following the poles towards the center of the magnet, the bz field decreases very linearly within a radius of ~1.6mm. this li near range is the operating range of the magnet with respect to the hall sensor array on the chip. for best performance, the hall elements should always be within this linear range. ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 9 - 26 as5215 datasheet - detailed description figure 4. 3d-graph of vertical magnetic field of a 6mm cylindrical magnet as shown in figure 5 (grey zone), the hall elements are located on the chip at a circle with a radius of 1mm. since the difference between two opposite hall sensors is measured, there will be no difference in si gnal amplitude when the magnet is perfectly centered or if the magnet is misaligned in any direction as long as all hall elements stay within the linear range. bz [mt] bz; 6mm magnet @ z=1mm y -displacement [mm] x -displacement [mm] area of x- y-misalignment from cen- ter: 0.5mm circle of hall elements on chip ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 10 - 26 as5215 datasheet - detailed description for the 6mm magnet (shown in figure 5 ), the linear range has a radius of 1.6mm, hence this magnet allows a radial misalignment of 0.5mm (1.6mm linear range radius; 1mm hall array radius). consequently, the larger the linear range, the more radial misalignment can be tolerated. by contrast, the slope of the linear range decreases with increasing magnet diameter, as the poles are further apart. a smaller sl ope results in a smaller differential signal, which means that the magnet must be moved closer to the ic (smaller airgap) or the amplification g ain must be increased, which leads to a poorer signal-to-noise ratio. more noise results in more jitter at the angle output. a good comprom ise is a magnet diameter in the range of 5?8mm. figure 5. vertical magnetic field across the center of a cylindrical magnet small diameter magnet (<6mm) large diameter magnet (>6mm) + stronger differential signal = good signal / noise ratio, larger airgaps + wider linear range = larger horizontal misalignment area - shorter linear range = smaller horizontal misalignment area - weaker differential signal = poorer signal / noise ratio, smaller airgaps bz; 6mm magnet @ y=0; z=1mm x -displacement [mm] hall elements (side view) bz [mt] ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 11 - 26 as5215 datasheet - detailed description 7.1.2 magnet thickness figure 6 shows the relationship of the peak amplitude in a rotating system (essentially the magnetic field strength of the bz field com ponent) in relation to the thickness of the magnet. the x-axis shows the ratio of magnet thickness (or height) [h] to magnet diameter [d] and the y-axis shows the relative peak amplitude with reference to the recommended magnet (d=6mm, h=2.5mm). this results in an h/d ratio of 0. 42. figure 6. relationship of peak amplitude vs. magnet thickness as the graph in figure 6 shows, the amplitude drops significantly at h/d ratios below this value and remains relatively flat at ratios above 1.3. therefore, the recommended thickness of 2.5mm (at 6mm diameter) should be considered as the low limit with regards to magnet th ickness. it is possible to get 40% or more signal amplitude by using thicker magnets. however, the gain in signal amplitude becomes less significant for h/ d ratios >~1.3. therefore, the recommended magnet thickness for a 6mm diameter magnet is between 2.5 and ~8 mm. bz amplitude vs. magnet thickness of a cylindrical diametric magnet with 6mm diameter 0% 20% 40% 60% 80% 100% 120% 140% 160% 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 thickness to diameter [h/d] ratio relative peak amplitude [%] d= 6mm x h= 2.5mm ref. magnet: h/d = 0.42 rel. amplitude = 100% ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 12 - 26 as5215 datasheet - detailed description 7.1.3 axial distance (airgap) figure 7. sinusoidal magnetic field generated by the rotating magnet the recommended magnetic field, measured at the chip surface on a radius equal to the hall sensor array radius (typ 1mm) should be within a certain range. this range lies between 45 and 75mt or between 20 and 80mt, depending on the encoder product. linear position sensors are more sensitive as they use weaker magnets. the allowed magnetic range lies typically between 5 and 60mt. 7.1.4 angle error vs. radial and axial misalignment the angle error is the deviation of the actual angle vs. the angle measured by the encoder. there are several factors in the ch ip itself that contribute to this error, mainly offset and gain matching of the amplifiers in the analog signal path. on the other hand, there is the nonlinearity of the signals coming from the hall sensors, caused by misalignment of the magnet and imperfections in the magnetic material. ideally, the hall sensor signals should be sinusoidal, with equal peak amplitude of each signal. this can be maintained, as lon g as all hall elements are within the linear range of the magnetic field bz (see figure 5) . 7.1.5 mounting the magnet generally, for on-axis rotation angle measurement, the magnet must be mounted centered over the ic package. however, the materi al of the shaft into which the magnet is mounted, is also of big importance. magnetic materials in the vicinity of the magnet will distort or weaken the magnetic field being picked up by the hall elements and cause additional errors in the angular output of the sensor. figure 8. magnetic field lines in air figure 8 shows the ideal case with the magnet in air. no magnetic materials are anywhere nearby. 0 360o b vertical field ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 13 - 26 as5215 datasheet - detailed description figure 9. magnetic field lines in plastic or copper shaft if the magnet is mounted in non-magnetic material, such as plastic or diamagnetic material, such as copper, the magnetic field distribution is not disturbed. even paramagnetic material, such as aluminium may be used. the magnet may be mounted directly in the shaft (see figure 9) . note: stainless steel may also be used, but some grades are magnetic. therefore, steel with magnetic grades should be avoided. figure 10. magnetic field lines in iron shaft if the magnet is mounted in a ferromagnetic material, such as iron, most of the field lines are attracted by the iron and flow inside the metal shaft (see figure 10) . the magnet is weakened substantially. this configuration should be avoided! ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 14 - 26 as5215 datasheet - detailed description figure 11. magnetic field lines with spacer between magnet and iron shaft if the magnet has to be mounted inside a magnetic shaft, a possible solution is to place a non-magnetic spacer between shaft and magnet, as shown in figure 11 . while the magnetic field is rather distorted towards the shaft, there are still adequate field lines available towards the se nsor ic. the distortion remains reasonably low. 7.1.6 summary small diameter magnets (<6mm ?) have a shorter linear range and allow less lateral misalignment. the steeper slope allows large r axial distances. large diameter magnets (>6 mm ?) have a wider linear range and allow a wider lateral misalignment. the flatter slope requires s horter axial distances. the linear range decreases with airgap; best performance is achieved at shorter airgaps. the ideal vertical distance range can be determined by using magnetic range indicators provided by the encoder ics. these indic ators are named maginc, magdec, magrngn, or similar, depending on product. ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 15 - 26 as5215 datasheet - application information 8 application information 8.1 sleep mode the target is to provide the possibility to reduce the total current consumption. no output signal will be provided when the ic is in sleep mode. enabling or disabling sleep mode is done by sending the sleep or wakeup commands via. the ssi interface. analog blocks are powe red down with respect to fast wake up time. 8.2 ssi interface the setup for the device is handled by the digital interface. each communication starts with the rising edge of the chip select signal. the synchronization between the internal free running analog clock oscillator and the external used digital clock source for the di gital interface is done in a way that the digital clock frequency can vary in a wide range. table 8. ssi interface pin description port symbol function chip select cs indicates the start of a new access cycle to the device cs = lo reset of the digital interface dclk dclk clock source for the communication over the digital interface bidirectional data input output dio command and data information over one single line the first bit of the command defines a read or write access table 9. ssi interface parameter description symbol parameter notes min typ max unit f_dclk clock frequency at normal operation the nominal value for the clock frequency can be derived from a 10mhz oscillator source. no limit 5 6 mhz f_ez_rw clock frequency at easy zap read write access no limit 5 6 khz f_ez_pr og clock frequency at easy zap access program otp correct access to the programmable zener diode block needs a strict timing ? the zap pulse is exact one period. the nominal value for the clock frequency can be derived from a 10mhz oscillator source. 200 - 650 khz f_ez_ar b clock frequency at easy zap analog readback 20pf external load allowed. the nominal value for the clock frequency can be derived from a 10mhz oscillator source. no limit 156.3 162.5 khz interface genera l at normal mode protocol: 5 command bit + 16 data input output command 5 bit command: cmd<4:0> bit<21:16> data 16 bit data: data<15:0> bit<15:0> interface general at extended mode protocol: 5 command bit + 46 data input output command 5 bit command: cmd<4:0> bit<50:46> data 34 bit data: data<45:0> bit<45:0> interface modes normal read operation mode cmd<4:0> = <00xxx> 1 dclk per data bit extended read operation mode cmd<4:0> = <01xxx> 4 dclk per data bit normal write operation mode cmd<4:0> = <10xxx> 1 dclk per data bit extended write operation mode cmd<4:0> = <11xxx> 4 dclk per data bit ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 16 - 26 as5215 datasheet - application information 8.3 device communication / programming remark: 1. send en prog (command 16) in normal mode before accessing the otp in extended mode. 2. otp assignment will be defined/updated. table 10. digital interface at normal mode # command bin mode 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 23 write config 1 10111 write go2sleep gen_rst analog_sig ob_bypassed 16 en_prog 10000 write 1 0 0 0 1 1 0 0 1 0 1 0 1 1 1 0 name functionality go2sleep enter/leave low power mode (no output signals) gen_rst generates global reset analog_sig switches the channels to the test bus after the pga ob_bypassed disable and bypass output buffer for testing purpose table 11. digital interface at extended mode # command bin mode factory settings user settings <45:44> <43: 26> <25:23> <22:2 0> <19:1 8> <17:1 4> <13> <12> <11> <10> <9> <8:7> <6> <5:0> 31 write otp 11111 xt write otp test id 10biastrim vref osc lock_o tp n.c. invert_ channel cm_sin cm_cos gain dc_ offset hall_ bias 25 prog_otp 11001 xt write otp test id 10biastrim vref osc lock_o tp n.c. invert_ channel cm_sin cm_cos gain dc_ offset hall_ bias 15 rd_otp 01111 xt read otp test id 10biastrim vref osc lock_o tp n.c. invert_ channel cm_sin cm_cos gain dc_ offset hall_ bias 9 rd_otp_ana 01001 xt read name functionality otp_test dummy fuse bit used in production test id part identification n.c. not connected 10biastrim 10 bias current trim bits vref bias block reference voltage trim bits osc oscillator trimming bits lock_otp to disable the programming of the factory bits <45?14> invert_channel inverts sin and cos channel before the pga for inverted output function (0...sin/cos, 1...sinn/ cosn) cm_sin common mode voltage output enabled at sinn / cm pin (0...differential, 1...common) cm_cos common mode voltage output enabled at cosn / cm pin (0...differential, 1...common) gain pga gain setting (influences overall magnetic sensitivity), 2bit dc_offset output dc offset (0?1.5v, 1?2.5v) hall_b hall bias setting (influences overall magnetic sensitivity), 6bit ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 17 - 26 as5215 datasheet - application information figure 12. sensitivity gain settings - relative sensitivity in % the amplitude of the output signal is programmable via sensitivity (6bit) and/or gain (2bit) settings (see figure 12) . figure 13. sensitivity gain settings - sensitivity [mv/mt] magnetic sensitivity vs. otp hall current & pga gain setting 100 150 200 250 300 350 400 450 500 550 600 0 102030405060 hall current otp setting (6 bits) relative sensitivity in % m_pga_00 m_pga_01 m_pga_10 m_pga_11 magnetic sensitivity vs. otp hall current & pga gain setting 0 10 20 30 40 50 60 70 0 102030405060 hall current otp setting (6 bits) sensitivity [mv/mt] m_pga_00 m_pga_01 m_pga_10 m_pga_11 ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 18 - 26 as5215 datasheet - application information 8.4 waveform ? digital interf ace at normal operation mode figure 14. digital interface at normal operation mode 8.5 waveform ? digital in terface at extended mode in the extended mode, the digital interface needs four clocks for one data bit. during this time, the device is able to handle internal signals for special access (e.g. the easy zap interface). figure 15. digital interface at extended mode dclk cs dio dio d15 d13 d14 d0 cmd_phase data_phase t1_3 t9_3 t2_3 t5 t7 t8 t4 t3 t6 t10_3 t13_3 t12 t11 dio cmd read write cmd4 cmd3 cmd2 cmd1 cmd0 d15 d13 d14 d0 dclk cs dio dio cmd4 cmd3 cmd2 cmd1 cmd0 d45 d44 d45 d44 d0 d0 cmd_phase data_phase t1_3 t9_3 t2_3 t5 t7 t8 t4 t3 t6 t10_3 t13_3 t12 t11 dio cmd read write ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 19 - 26 as5215 datasheet - application information 8.6 waveform ? digital interface at an alog readback of the zener diodes to be sure that all zener-diodes are correctly burned, an analog readback mechanism is defined. perform the ?read otp ana? sequ ence according to the command table and measure the value of the diode at the end of each phase. figure 16. digital interface at analog readback of zener diodes 8.7 easyzapp otp content each as5215 die has an integrated 32-bit otp rom (easyzapp) for tr imming and configuration purposes. the prom can be programmed via. the serial interface. for irreversible programming, an external programming voltage at prog pin is needed. for security reasons , the factory trim bits can be locked by a lock bit. remark: otp assignment will be defined/updated. table 12. serial bit sequence (16-bit read / write) write command read / write data c4 c3 c2 c1 c0 d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 name bit count otp start otp end access comments hall bias 6 0 5 user sets overall sensitivity dc offset 1 6 6 user output dc offset setting gain 2 7 8 user programmable gain amplifier setting lock 1 13 13 austriamicrosystems set in production test invert_channel 1 11 11 user inverts sin and cos channel before the pga for inverted output function cm_sin 1 10 10 user common mode voltage output enabled at sinn / cm pin cm_cos 1 9 9 user common mode voltage output enabled at cosn / cm pin cmd0 cmd1 cmd2 cmd3 cmd4 ext d45 ext d44 ext d1 ext d0 cmd_phase data_phase_extended perform analog measurements at prog otp d45 otp d44 otp d43 otp d0 dclk cs dio prog ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 20 - 26 as5215 datasheet - application information 8.8 analog sin/cos outputs wi th external interpolator figure 17. sine and cosine outputs for external angle calculation the as5215 provides analog sine and cosine outputs (sinp, cosp) of the hall array front-end for test purposes. these outputs al low the user to perform the angle calculation by an external adc + c, e.g. to compute the angle with a high resolution. the output driver c apability is 1ma. the signal lines should be kept as short as possible, longer lines should be shielded in order to achieve best noise performanc e. through the programming of one bit, you have the possibility to choose between the analog sine and cosine outputs (sinp, cosp) and their inverted signals (sinn, cosn). furthermore, by programming the bits <9:10> you can enable the common mode output signals of sin and cos. the dc bias voltage is 1.5 or 2.5 v. vdd vss micro controller as5130 100n vss +5v vdd vdd sinp_1/sinn_1 sinn_1/sinp_1/cm_sin_1 sinn_2/sinp_2/cm_sin_2 vss as5215 d da a d da a cosp_1/cosn_1 cosn_1/cosp_1/cm_cos_1 cosn_2/cosp_2/cm_cos_2 sinp_2 / sinn_2 cosp_2/cosn_2 prog 100k notes: 1. we recommend to use a 100k pull-up resistance. 2. default conditions for unused pins are: dclk_1/2, cs_1/2, dio_1/2, tc_1/2, a_tst_1/2, tbo_1/2, tb1_1/2, tb2_1/2, tb3_1/2 connect to vss ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 21 - 26 as5215 datasheet - application information 8.9 otp programming and verification figure 18. otp programming connection for programming of the otp, an additional voltage has to be applied to the pin prog. it has to be buffered by a fast 100nf capa citor (ceramic) and a 10f capacitor. the information to be programmed is set by command 25. the otp bits 16 until 45 are used for ams factory trimming and cannot be overwritten. after programming, the programmed otp bits must be verified in two ways: by digital verification: this is simply done by sending a read otp command (#15). the structure of this register is the same as for the otp prog or otp write commands. symbol parameter min max unit note v dd supply voltage 5 5.5 v gnd ground level 0 0 v v_zapp programming voltage 8 8.5 v at pin prog t_zapp temperature 0 85 oc f_clk clk frequency 100 khz at pin dclk v dd v ss micro controller as5130 100n v ss +5v v dd cs v dd dclk dio prog v ss as5215 + - 10f 100n 8.0 - 8.5v v dd v supply prog gnd c1 c2 100nf 10f v zapp v prog prom cell maximum parasitic cable inductance l<50nh i/o output output ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 22 - 26 as5215 datasheet - application information by analog verification: by switching into extended mode and sending an analog otp read command (#9), pin prog becomes an output, sending an analog voltage with each clock representing a sequence of the bits in the otp register (starting with d45). a voltag e of <500mv indicates a correctly programmed bit (?1?) while a voltage level between 2v and 3.5v indicates a correctly unprogrammed bit (?0 ?). any voltage level in between indicates incorrect programming. figure 19. analog otp verification v dd v ss micro controller as5130 100n v ss +5v v dd cs v dd dclk dio prog v ss as5215 i/o output output v ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 23 - 26 as5215 datasheet - package drawings and markings 9 package drawings and markings the devices are available in a 32-pin qfn (7x7mm) package. figure 20. package drawings and dimensions notes: 1. dimensions and tolerancing conform to asme y14.5m-1994 . 2. all dimensions are in millimeters. angles are in degrees. 3. bilateral coplanarity zone applies to the exposed pad as well as the terminal. 4. radius on terminal is optional. 5. n is the total number of terminals. marking: yywwvzz. yy ww v zz last two digits of the manufacturing year manufacturing week plant identifier assembly traceability code symbol min nom max a 0.80 0.90 1.00 a1 0 0.02 0.05 a2 - 0.65 1.00 a3 0.20 ref l 0.50 0.60 0.75 0o - 14o b 0.23 0.28 0.35 d 7.00 bsc e 7.00 bsc e 0.65 bsc d1 6.75 bsc e1 6.75 bsc d2 4.70 4.80 4.90 e2 4.70 4.80 4.90 aaa - 0.15 - bbb - 0.10 - ccc - 0.10 - ddd - 0.05 - eee - 0.08 - fff - 0.10 - n3 2 as5215om yywwvzz 18085-002 b2p0 ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 24 - 26 as5215 datasheet - revision history revision history note: typos may not be explicitly mentioned under revision history. revision date owner description 1.0 april 29, 2008 apg initial revision july 03, 2008 redundancy coding topic deleted. 1.1 july 15, 2008 updated key features, table 1 - pin descriptions, figure 1 and figure 17 . 1.2 july 14, 2009 updated min, typ, max values for ?power up time? parameter in table 6 . 1.3 july 31, 2009 updated the following parameters in table 6 : - values and conditions updated for 1. propagation delay 2. amplitude ratio tracking accuracy over temperature 3. dc offset drift - deleted the ?output offset? parameter from the table. aug 24, 2009 updated following bits related information on page 16 - invert_channel, cm_sin, cm_cos, gain, dc_offset, hall_b 1.4 aug 26, 2009 inserted figure 12 and updated applications and figure 17 . 1.5 sept 01, 2009 inserted figure 13 , added a note in revision history. 1.6 sept 02, 2009 deleted ?displacement? parameter from table 5 . 1.7 nov 26, 2009 hall array radius value updated from 1.1mm to 1mm updated figure 13 1.8 dec 11, 2009 updated values for ?magnetic sensitivity? parameter in table 6 . dec 15, 2009 ordering code updated. 1.9 jan 27, 2010 updated ?interface general at extended mode? (see table 9) feb 10, 2010 updated values for ?power up time? parameter in table 6 . mar 19, 2010 added ?current consumption? parameter in table 6 . 1.10 sep 06, 2010 updated package drawings and markings (page 23) and ordering information (page 25) . 1.11 jun 27, 2011 mub updated absolute maximum ratings (page 5) , table 4, otp programming and verification (page 21) , package drawings and markings (page 23) . ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 25 - 26 as5215 datasheet - ordering information 10 ordering information the devices are available as the standard products shown in table 13 . note: all products are rohs compliant and austriamicrosystems green. buy our products or get free samples online at icdirect: http://www.austriamicr osystems.com/icdirect technical support is available at http://www.austriamicrosystems.com/technical-support for further information and requests, please contact us mailto: sales@austriamicrosystems.com or find your local distributor at http://www.austriamicros ystems.com/distributor table 13. ordering information ordering code description delivery form package as5215om-hmfp sine and cosine analog output magnetic rotary encoder tape & reel 32-pin qfn (7x7mm) ams ag technical content still valid www.austriamicrosystems.com/as5215 revision 1.11 26 - 26 as5215 datasheet - copyrights copyrights copyright ? 1997-2011, austriamicrosystems ag, tobelbaderstrasse 30, 8141 unterpremstaetten, austria-europe. trademarks registe red ?. all rights reserved. the material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. all products and companies mentioned are trademarks or registered trademarks of their respective companies. disclaimer devices sold by austriamicrosystems ag are covered by the warranty and patent indemnification provisions appearing in its term of sale. austriamicrosystems ag makes no warranty, express, statutory, implied, or by description regarding the information set forth he rein or regarding the freedom of the described devices from patent infringement. austriamicrosystems ag reserves the right to change specificatio ns and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with austriamic rosystems ag for current information. this product is intended for use in normal commercial applications. applications requiring extended temper ature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by austriamicrosystems ag for each application. for shipments of les s than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. the information furnished here by austriamicrosystems ag is believed to be correct and accurate. however, austriamicrosystems ag shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems ag rendering of technical or other services. contact information headquarters austriamicrosystems ag tobelbaderstrasse 30 a-8141 unterpremstaetten, austria tel: +43 (0) 3136 500 0 fax: +43 (0) 3136 525 01 for sales offices, distributors and representatives, please visit: http://www.austriamicrosystems.com/contact ams ag technical content still valid |
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