View MT5470A-LWT_8043146.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

specification part no. : MT5470A-LWT 5.2x4.6mm oval led lamp observe precaution for handling electro static sensitive devices attention 3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com
MT5470A-LWT 5.24.6mm oval led lamp ver.: 01 date: 2008/03/12 page: 1 /5 description this white lamp is made with ingan/sapphire chip and water clear epoxy resin. notes: 1. all dimensions are in mm. 2. tolerance is ? 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color MT5470A-LWT ingan/sapphire white w ater clear ak 1.5 typ. 4.6 5.2 7.8 24.0 min. 2.540.1
MT5470A-LWT 5.24.6mm oval led lamp ver.: 01 date: 2008/03/12 page: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 108 mw reverse voltage v r 5 v d.c. forward current if 30 ma reverse (leakage) current ir 50 ?a peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -25 to +85
storage temperature range tstg. -40 to +100
soldering temperature(1.6mm from body) tsol. dip soldering : 260 for
5 sec. hand soldering : 350 for 3 sec.
electrostatic discharge esd. 6000 v electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 2130 5860 m cd forward voltage vf if=20ma 3.0 3.6 v correlated colour temperature cct if=20ma 4500 5500 o k reverse (leakage) current ir vr=5v 50 a vertical 21/2 if=20ma 40 viewing angle horizontal 2 1/2 if=20ma 70 deg notes: the datas tested by is tester. 2. customers special requirements are also welcome.
MT5470A-LWT 5.24.6mm oval led lamp ver.: 01 date: 2008/03/12 page: 3 /5 typical electrical / optica l characteristics curves : white led spectrum vs. wavelength relative response wavelength(nm) applied voltage (v) forward current vs.applied voltage forward current if(ma) 10 20 40 30 50 2.02.63.03.43.84.2 20.0 forward current (ma) forward current vs. luminous intensity relative luminous intensity 10.0 0 1000 2000 4000 3000 5000 30.0 0.0 temperature( f c) 0 20 40 60 10080 forward current if(ma) 10 20 40 30 50 forward current vs. ambient temperature 10 0.2 0.8 0.7 0.3 0.5 0.1 0.9 1.0 0 80 70 90 0.4 0.6 40 60 50 30 20 horizontal vertical radiation diagram
MT5470A-LWT 5.24.6mm oval led lamp ver.: 01 date: 2008/03/12 page: 4/5 specifications for bin grading: iv(mcd) bin min. max. v 2130 3000 w 3000 4180 x 4180 5860 specifications for vf group: vf(v) group min. max. v8 3.0 3.2 v9 3.2 3.4 v10 3.4 3.6 specifications for c olour temperature group: cct ( o k ) @20ma min . max. 4500 4750 4750 5000 5000 5250 5250 5500
MT5470A-LWT 5.24.6mm oval led lamp ver.: 01 date: 2008/03/12 page: 5 /5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at h igh temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering : pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. ( 3) h and soldering: 350
max. (temperature of soldering iron tip), within 3 seconds. 3. insertion pitch of the led leads and pitch of mounting holes need to be same. 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make s ure not to apply external force, stress, and excessive vibration to the led and follow the con ditions below. ba king temperature: 120
max. bak ing time: within 60 seconds. if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature.

▲Up To Search▲

Price & Availability of MT5470A-LWT

	To Download MT5470A-LWT Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .