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anaren integrated radio air b oosterpack user s manual a 2530 r 24 a a25 3 0 e 24a release date 11/2/12
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iii user s manual air boosterpack contents 1. air boosterpack overview ................................ ................................ ................................ ........................... 5 1.1. overview ................................ ................................ ................................ ................................ .................... 5 1.2. kit contents ................................ ................................ ................................ ................................ ............... 6 2. getting started with the air boosterpack ................................ ................................ ................................ ... 7 2.1. hardware installation ................................ ................................ ................................ ............................... 9 2.1.1. air boosterpack with msp430 launchpad ................................ ................................ ....................... 9 2.1.2. air boosterpack with stellaris launchpad ................................ ................................ ...................... 11 2.2 . usb driver installation ................................ ................................ ................................ ........................... 13 2.3. programming the demo application on stellaris ................................ ................................ ............... 17 2.4. important: required radio setup ................................ ................................ ................................ .. 19 2.5. using the demo application ................................ ................................ ................................ ................. 20 2.6. air a2530 wiki ................................ ................................ ................................ ................................ ....... 20 3. air boosterpack hardware ................................ ................................ ................................ ......................... 21 3.1. electrical characteristics ................................ ................................ ................................ ........................ 21 3.1.1. absolute maximum ratings ................................ ................................ ................................ ............. 21 3.1.2. recommended o perating conditions ................................ ................................ ................................ 21 3.2. functional description ................................ ................................ ................................ ........................... 22 3.2.1. a2530 radio module (u6) ................................ ................................ ................................ ................ 23 3.2.2. mcu & socket (u5) ................................ ................................ ................................ ......................... 23 3.2.3. sensors ................................ ................................ ................................ ................................ .............. 23 3.2.4. serial eeprom (u1) ................................ ................................ ................................ ....................... 24 3.2.5. led indicators ................................ ................................ ................................ ................................ .. 24 3.2.6. switches ................................ ................................ ................................ ................................ ............. 25 3.2.7. jumpers ................................ ................................ ................................ ................................ .............. 28 3.2.8. connectors ................................ ................................ ................................ ................................ ......... 31 3.3. schematics ................................ ................................ ................................ ................................ ................ 35 3.4. pcb layout ................................ ................................ ................................ ................................ .............. 37 3.5. bill of materials (bom) ................................ ................................ ................................ ........................... 41
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air boosterpack C users manual page 5 of 45 release date 11/2/12 1. air boosterpack overview 1.1. overview the air boosterpack is a low - power wireless transceiver extension module for use with the texas instruments msp - exp430g2 and ek - lm4f120xl launchpad development kit s . the boosterpack is available in various configurations, each of which contains an air radio module with integrated antenna. see table 1 for a listing of the suppor ted boosterpacks and their operating bands. the included air booster p ack software application s d emonstrate example sensor network s, as well as providing basic examples for communicating with the radio module . table 1 - air boosterp ack models model operating band range extender a2530r24a 2400 - 2483.5mhz ism band (fcc/ic, etsi) no A2530E24A 2400 - 2483.5mhz ism band (fcc/ic, etsi) yes figure 1 - air boosterpack w ith msp430 launchpad
page 6 of 45 air boosterpack C users manual release date 11/2/12 air boosterpack hardware features: ? 2.7v to 3.6 v operation (2.2v min when rgb light sensor power disabled) ? low p ower c onsumption ? spi i nterface to r adio module ? ir temperature sensor (ti tmp006) ? rgb light sensor (taos tcs3414) ? eeprom (16k x 8) ? analog current monitor ? tri - color led with pwm control ? accessible test points for all mcu ports plus four radio module p orts ? 8 d ip switches for b oard c onfiguration and u ser i nput ? 20 - pin dip socket for operation with or without msp430 microcontroller (mcu removed when used with th e stellaris launchpad) ? rohs c ompliant ? see air module user s manual for radio specific features air booster p a ck software features: ? texas instruments znp protocol ? mesh network topology with one coordinator, one or more routers, and one or more end point s 1.2. kit contents the air boosterpack kit includes the following : ? three air boosterpack s ( each with msp430g2553 device preinstalled and preloaded with a sample program) ? one aa battery pack with on/off switch and jst style connector ? quick start guide for use with msp430 launchpad ? quick start guide for use with stellaris launchpad ? regulatory guide ? cd containing air booster p ack demo application s , usb uart device driver s , board design files, and supporting documentation
air boosterpack C users manual page 7 of 45 release date 11/2/12 2. getting started with the air b oosterpack the following sections describe the necessary steps to get the air boosterpack hardware and software up and running with the launchpad. figure 2 - air boosterpack overview air radio module (u6) . radio gpio test points (j5) . radio gpio dip switches (s4) . j2 test point solder jumpers . sensor/led dip switches (s3) . mcu (msp430) reset pushbutton switch (s1) . duplicate of s1 on msp430 launch p ad . yellow led (d3) . green led (d2) . duplicate of led2 on msp430 launch p ad . red led (d1) . duplicate of led1 on msp430 launch p ad . pushbutton switch (s2) . duplicate of s2 on msp430 launch p ad . j1 test point solder jumpers . 1 2 3 4 5 6 7 8 7 3 8 5 1 6 4 2 9 10 11 9 10 11 12 13 14 15 17 19 20 21 22 23 25 26 27 28 18 16 24
page 8 of 45 air boosterpack C users manual release date 11/2/12 ir temperature sensor (u1) . rgb light sensor (u2) . 128kb (16k x 8) serial eeprom ( u1 ) . rgb led (d4) . j1 launchpad connector . j1 test points . current sense amplifier (u4) . current sense select jumper (jp1) . current sense disconnect jumper (jp2) . 20 - pin dip socket + msp430g2553 (u5) . spi/i 2 c test points (j3) . j2 test points . j2 launchpad connector . optional radio reset pushbutton switch (s5) . option radio cc debugger header (j4) . red led (d8) . yellow led (d9) . 12 13 14 15 17 18 19 20 21 22 23 25 26 27 28 16 24
air boosterpack C users manual page 9 of 45 release date 11/2/12 2.1. hardware installation 2.1.1. air boosterpack with msp430 launchpad the following steps need to be performed on each launchpad / boosterpack: 1) if not already populated, solder both 10 - pin male headers provided in the launchpad kit onto the launchpads j1 and j2 breakout connections. 2) configure uart jumper settings on the launchpad. a. for launchpad rev1.4 and earlier, r emove jumpers txd and rxd from j3 and i nstall crossover jumpers (not included) onto the same group of pins to make the following connections: i. connect j3.3 to j3.6 ii. connect j 3.5 to j3.4 b. for launchpad rev1.5 and later, change the orientation of the j3 txd and rxd jumpers to use the hw uart. 3) ensure the vcc jumper i s p opulated on j3 . jumpers rst and test also need to be installed when programming the microcontroller or when deb ugging software. 4) remove the existing msp430 device on the launchpad as the boosterpack comes with a microcontroller already installed. alternatively, the provided microcontroller may be installed in the launchpad s socket. in either case, only one device should be installed at any given time. see figure 4 and figure 5 which show the two options for msp430 location. 5) install the air boosterpack onto the launchpad board. ensure the boosterpack is oriented correctly. j1 of the boosterpack must connect to j1 of the launchpad. the same is true for j2. figure 3 C installed boosterpack (msp430 launchpad )
page 10 of 45 air boosterpack C users manual release date 11/2/12 figure 4 - standard installation (msp430 on boosterpack) figure 5 - alternate installation (msp430 on launchpad)
air boosterpack C users manual page 11 of 45 release date 11/2/12 2.1.2. air boosterpack with stellaris launchpad the following steps need to be performed on each launchpad/ boosterpack: 1) remove the provided msp430 device on the boosterpack. 2) install the air boosterpack onto the launchpad board. ensure the boosterpack is oriented correctly. j1 of the boosterp ack must connect to j1 of the launchpad. the same is true for j2. figure 6 C installed boosterpack (stellaris launchpad) optional: the default boosterpack configuration utilizes a software i 2 c controller (i.e. bit - banged) to maintain compatibil i ty with both launchpad types (i.e. msp430 and stellaris). since the stellaris microcontroller supports using uart, spi, and i 2 c at the same time (compared to the msp430 g2553 which only h as two uscis), the boosterpack may be configured to use the hardware i 2 c controller instead of the bit - banged controller. the following steps need to be performed on each launchpad/boosterpack: 1) install 10 - pin connector (not included) at boosterpack j1 tes t points location. this corresponds to the launchpad j3 connector (see figure 7 ). the same can be done for boosterpack j2 test points (launchpad j4), although this is optional. only launchpad pins j3.3 and j3.4 are utilized by the boosterpack. the remaining j3 and j4 launchpad signals are simply pass - thru. 2) remove r9 and r10 from the launchpad . s ee figure 8 for the location of these resistors .
page 12 of 45 air boosterpack C users manual release date 11/2/12 figure 7 C boosterpack with additional connectors installed figure 8 C stellaris launchpad figure 9 C installed boosterpack (with additional connectors, stellaris launchpad)
air boosterpack C users manual page 13 of 45 release date 11/2/12 2.2. usb driver installation system requirements - microsoft windows xp sp3 or later operat ing system (32 - bit and 64 - bit supported) - cd drive many of the provided firmware examples require using a virtual com port via the launchpads usb interface. if the necessary usb drivers have not already been installed on the pc/laptop, follow one of the following procedures. please note that the msp430 and stellaris launchpad boards each require different drivers. 1) install drivers using the instructions provided with the launchpad kit. C or C 2) install drivers provided on the cd in the a2530 boosterpack kit following the steps below. these drivers are t he same as those provided by ti; anaren has simply provided a gui to install them. a. insert the booserpack cd in the cd drive. the air a2530 boosterpack installation gui should automatically start. if it does not, navigate to the cd drive using windows exp lorer and then double click the autorun.exe icon.
page 14 of 45 air boosterpack C users manual release date 11/2/12 b. select which launchpad board will be used with the boosterpack by clicking either the msp430 button or stellaris button. c. c lick on the install launchpad usb driver button.
air boosterpack C users manual page 15 of 45 release date 11/2/12 when installing stellaris drivers, a message will pop up indicating that later steps may warn about drivers not being signed. the installation may be cancelled at this point if you do not want to install unsigned drivers, however the usb virtual com will be unusable. cli ck ok to continue with the installation if you agree with installing unsigned drivers. d. click next to continue the installation.
page 16 of 45 air boosterpack C users manual release date 11/2/12 for stellaris, windows may provide a security warning due to the drivers not being signed. click on install this dr iver software anyway to continue installation. there may be up to three of these messages due to there being three separate drivers installed. click finish when the installation is complete.
air boosterpack C users manual page 17 of 45 release date 11/2/12 2.3. programming the demo application on stellaris follow these steps to load the simple a pplication demo on each of the stellaris launchpads . 1) plug in one of the stellaris launchpads to a usb port. 2) run the texas instruments lm flash programmer utility available on the ti website . 3) in the configuration tab, select lm4f120 launchpad from the quick set pull - down.
page 18 of 45 air boosterpack C users manual release date 11/2/12 4) in the program tab, browse to the firmware \ factorydefault \ stellaris folder on the boosterpack cd and select simple application coordinator .bin. then click program. 5) unplug the launchpad from the usb port. 6) repeat steps 1 thru 5 above for the simple application router.bin file. 7) repeat steps 1 thru 5 above for the simple application end device.bin file. alternatively, the launchpads may be programmed using code composer studio (ccs). the ccs projects are located in the firmware \ zm examples \ ccs_stellaris folder on the boosterpack cd. continue to section 2.4 for information on using the demo application.
air boosterpack C users manual page 19 of 45 release date 11/2/12 2.4. important: required radio setup the air boosterpack must b e operated in acc ordance with local regulations. the firmware preloaded in the msp430g2553 devices provided with the air boosterpack kit (or loaded into the stellaris devices as described in s ection 2.3 ) offers two radio operation options; fcc/ic for use in us/canada (default) and etsi for use in europe . if your location is not covered by either fcc/ic or etsi then you must check local regulatory codes for how to obtain permission to operate the modules prior to using them. if covered under etsi regulations , you must first change s4 - 1 to the off position as shown in figure 10 . f igure 10 C boosterpack configured f or u se i n europe (etsi)
page 20 of 45 air boosterpack C users manual release date 11/2/12 2.5. using the demo application the simple application demo is an example sensor network that passes measured data from the router(s) and/or end point (s) to the coordinator. all nodes configured as a router periodically (about every 1.5 seconds) read the onboard ir temperature sensor a nd transmit the value to the coordinator . to change the sensor readings, simply place a warm (e.g. palm of your hand) or cold (e.g. soda can) object a few inches from the sensor. there is no need to have physical contact between the sensor and the object . similarly, all nodes configured as an end point periodically (about every 3 seconds) read the onboard rgb light sensor and transmit the value to the coordinator. to change the sensor readings, shine a different color light at the sensor. after applying power to the nodes they should start communicating within a minute. when communicating, each node blinks an led. - coordinator flashes red led d1 - router rgb led normally green, flashes blue - end point rgb led normally off, flashes blue the coordinator displ ays the received data from the router(s) and end point (s) in two ways. 1) the data is sent out the uart. all messages received are displayed with details of the data transfer in addition to the actual measurements. the information may be viewed on a terminal emulator connected to the launchpad usb virtual com port. the port must be configured as 9600,8,n,1 for msp430 and 115200,8,n,1 for stellaris. 2) the measurements are displayed graphically via the onboard rgb led (boosterpack led for msp430, launchpad led for stellaris). a. router ir temperature values are displayed as follows : ? blue = cold ? green = warm (room) ? red = hot to select this mode, press the s2 pushbutton (sw1 on the stellaris launchpad) one time on the coord inator. red led d8 should be o ff and yellow led d9 should be o n . b. the color of light detected by the endpoint rgb light sensor is displayed. to select this mode, press the s2 pushbutton (sw1 on the stellaris launchpad) a second time on the coordinator. red led d8 should be on and yellow led d9 should be o ff . 2.6. air a2530 wiki please visit the air a2530 wiki ( http://www.anaren.com/air - wiki - zigbee ) on the anaren website for details regarding the example applications, module interface specification (i.e. api), and general zigbee ? information.
air boosterpack C users manual page 21 of 45 release date 11/2/12 3. air boosterpack hardware 3.1. electrical characteristics 3.1.1. absolute maximum ratings under no circumstances shall the absolute maximum ratings given in table 2 be violated. stress exceeding one or more of the limiting values may cause permanent damage to the device. table 2 - absolute maximum ratings parameter min max unit condition supply voltage - 0.3 3. 8 v voltage on any digital pin - 0.3 vdd + 0.3 max 3. 8 v input rf level +10 dbm storage temperature range - 4 0 85 c esd <2000 v according to jedec std 22, method a114, human body model (hbm) <500 v according to jedec std 22, c101c,charged device model (cdm) 3.1.2. recommended operating conditions table 3 C recommended operating conditions parameter min max unit condition operating supply voltage 2.7 3.6 v rgb light sensor powered 2.2 3.6 v rgb light sensor disconnected operating temperature - 40 85 c caution ! esd sensitive device. precaution should be used when handling the device in order to prevent permanent damage.
page 22 of 45 air boosterpack C users manual release date 11/2/12 3.2. functional description figure 11 C hardware block diagram
air boosterpack C users manual page 23 of 45 release date 11/2/12 3.2.1. a2530 radio module (u6) the anaren a2530 module is a 2.4ghz ieee 802.15.4 compliant radio running the texas instruments znp protocol. for details regarding the radio module, refer to the a2530e24x and a2530r24x users manuals located on the cd provided in the boosterpack kit. 3.2.2. mcu & socket (u5) the boosterpack has a 20 - pin dip socket with a msp430g2553 mcu pre - installed. this allows f or operation of the boosterpack while installed on a launchpad board or standalone. please refer to the msp430g2x53 datasheet and msp430x2xx family users guide on the ti website for further info regarding this device. 3.2.3. sensors ? rgb light sensor (u2) the t aos tcs3414 digital color sensor (i 2 c) measures the color of ambient light and reports the measurements in 16 - bit rgbc (red/green/blue/clear) format. please refer to the tcs3414 datasheet on the taos website for further info regarding this device. the i 2 c bus address of this device is 0x39. ? ir temperature sensor (u3) the texas instruments tmp006 infrared thermopile sensor (i 2 c) measures the temperate of an object without the need to make contact with the object ( - 40c to +125c operating range) . please refer to the tmp006 datasheet on the ti website for further info regarding this device. please note the boosterpack itself is rated to +85c and should not be subjected to ambient temperatures above this limit. the i 2 c bus address of this device is 0x40. ? current sensor (u4) the texas instruments ina216a2 current shunt monitor (analog) amplifies the voltage across a current sense resistor with a gain of 50. please refer to the ina216 datasheet on the ti website for further info regarding this device. t he sensors analog output is routed to msp430 pin p1.4 where it can be sampled using the mcus internal adc. the measured voltage can be used to calculate the current draw of the a2530 only or that of the entire board . the selection is made by setting jumper jp1 to the desired position (see section 3.2.7 for information on setting the jumper). to calculate current flowing through the 0.2 sense resistor, simply divide the measured voltage by 10 (i shunt = v shunt / r shunt , where r shunt = 0.2 and v shunt = v meas / 50).
page 24 of 45 air boosterpack C users manual release date 11/2/12 3.2.4. serial eeprom (u1) a 128kbit (16k x 8) serial eeprom is provided for applications that require storing data in nonvolatile memory. please refer to the at24c128c datasheet on the atmel website for further info regarding this device. the i 2 c bus address of this device is 0x50. 3.2.5. led indicators ? red led (d1) duplicate of red led on msp430 launchpad. controlled by msp430 p1.0 (j1.2) C active high . ? green led (d2) duplicate of green led on msp430 launchpad. controlled by msp430 p1.6 (j2.4) C active high . this led is shared with the spi miso signal and is therefore unusable without modification to the spi driver. ? yellow led (d3) controlled by msp430 p2.4 (j2.2) C active low . this led is shared with the i 2 c scl signal and is only usable when not using i 2 c. ? tri - color led (d4) when using a msp430 the tri - color led can be pulse width modulated (pwm) to produce a wide range of colors. this capability is not available when the boosterpack is used with a stellaris launchpad due to lack of pwm capability on the chosen pins. in this situation, the tri - color led on the stellaris launchpad will need to be used instead for applications requiring multiple colors. the boosterpack tri - color led is controlled as follows: red segment C msp430 p2.1/ta1.1 (j1.9) C active low. green segment C msp430 p2.5/ta1.2 (j2.3) C active low. blue segment C msp430 p2.6/ta0.1 (j2.9) C active low. ? a2530 red led (d8) controlled by a2530 p1.0 (gpio3) C active high. ? a2530 yellow led (d9) controlled by a2530 p0.6 (gpio2) C active high.
air boosterpack C users manual page 25 of 45 release date 11/2/12 ? blue leds (d6, d7) these leds (when populated) are always on and are intended to produce a cool looking visual effect which is especially noticeable when the boosterpack s are operated in a dark environment. figure 12 C boosterpack with blue leds installed 3.2.6. switches ? mcu reset (s1) duplicate of s1 reset pushbutton on msp430 launchpad. active low. ? mcu control input (s2) duplicate of s2 user pushbutton on msp430 launchpad. active low. ? a2530 reset (s5 ) radio module hardware reset. active low.
page 26 of 45 air boosterpack C users manual release date 11/2/12 ? sensor/led power control (s3 ) these dip switches are used to control power to specific devices on the boosterpack board. the primary purpose is to provide a method for turning off unused devices to conserve power. for example, an application not using the color light sensor would benefit from turning off position 3, since the light sensor is relatively power hungry. another example would be an application that utilizes the leds but the user turns off positions 1 and 4 to reduce power consumption (no co de change necessary). the default state of all dip switches is on (closed). table 4 C sensor/led dip switch settings (s3) switch position signal name description s3 1 d1,2_en power control for the on - board red and green leds (d1 and d2, respectively). does not impact leds on the launchpad boards. on (closed): red and green leds are enabled and may be turned on by driving their control signals high. off (open): red and green leds are disabled and cannot be turned on, regardless of the state of their control signals. 2 temp/rom_en power control for the ir temperature sensor and eepprom on the i 2 c bus. on (closed): power is applied to these devices. off (open): the devices are powered down. 3 lgt_en power control for the i 2 c rgb light sensor. on (closed): power is applied to the device. off (open): the device is powered down. 4 d3,4_en power control for the on - board yellow and tri - color leds (d3 and d4, respectively). does not impact leds on the launchpad boards. on (closed): yellow and tri - color leds are enabled and may be turned on by driving their control signals low. off (open): yellow and tri - color leds are disabled and cannot be turned on, regardless of the state of their control signals.
air boosterpack C users manual page 27 of 45 release date 11/2/12 ? radio module gpio (s4 ) these dip switches are used to electrically isolate the leds and pull - down resistors from the a2530 gpio signals fo r applications that require the gpio but dont want the added load of the resistors and leds. positions 1 and 2 (gpio0 and gpio1, respectively) may also be used as user input. the default state of all dip switches is on (closed). table 5 C radio module gpio dip switch settings (s4) switch position signal name description s4 1 gpio0 provides a method for changing the state of the a2530 gpio input. on (closed): signal is pulled to gnd through a 2k ohm resistor. off (open): signal is floating. 2 gpio1 provides a method for changing the state of the a2530 gpio input. on (closed): signal is pulled to gnd through a 2k ohm resistor. off (open): signal is floating. 3 gpio2 a2530 yellow led connect/disconnect. on (closed): yellow led is enabled and may be turned on by driving its control signal high. off (open): yellow led is disabled and cannot be turned on, regardless of the state of its control signal. 4 gpio3 a2530 red led connect/disconnect. on (closed): red led is enabled and may be turned on by driving its control signal high. off (open): red led is disabled and cannot be turned on, regardless of the state of its control signal.
page 28 of 45 air boosterpack C users manual release date 11/2/12 3.2.7. jumpers ? current sensor the onboard current sensor can be configured to measure the current drawn by the a2530 radio module only or by the entire board. the current consumption of the radio module is always measured and the installed shunt determines which side of the current sense resistor the remainder of the board gets its power from. therefore there must always be a shunt installed on jp1, otherwise only the radio module will be powered. for applications that do not require current sensing and wish to utilize the mcu pin for another function, the current se nsors analog output can be disconnected from the rest of the board by removing the shunt from jp2. table 6 - jp1 jumper settings (current sensor select) jumper position description jp1 1 current sensor measures radio module only (default) 2 current sensor measures entire board table 7 - jp2 jumper settings (current sensor enable) jumper position description jp2 closed current sensor analog output connected to mcu (default) open current sensor analog output disconnected from mcu ? radio module configuration jp100 and jp101 control the operating mode of the a2530 radio module. currently jp100 is reserved for future use while jp101 selects whether the electrical interface to the module is spi or uart. both of these are 3 - terminal jumpers that can accommodate a 0603 resistor populated in one of two positions. the boosterpack is shipped with a pcb trace making the default connection. to change to a different setting, this trace must be cut prior to soldering a resistor in the new position. table 8 - jp100 jumper settings (cfg0) jumper position radio signal name description jp100 1 cfg0 reserved (default) 2 reserved table 9 - jp101 jumper settings (cfg1) jumper position radio signal name description jp101 1 cfg1 radio uses spi interface (default) 2 radio uses uart interface
air boosterpack C users manual page 29 of 45 release date 11/2/12 ? radio module pin mapping the air boosterpack board provides the ability to remap several of the radio module s i/o pins to different mcu pins. jp102, jp105, and jp108 consist of one or more 0603 smt pads which allow a zero ohm resistor to be soldered in place to select the desired jumper position. the default signal routing is determined by a small trace between one set of pads. to change jumper positions, this trace needs to be c ut and a zero ohm resistor soldered in the new position. jp102, in conjunction with r100, selects whether the radio modules reset signal is generated by mcu pin p2.5 or p2.7. this allows applications requiring a crystal on the mcu to use a different pin for radio module reset, at the expense of giving up the use of the green segment of the tri - color led. srdy is a required signal when using a secondary mcu with the a2530 radio module, there jp105 should not be modified. jp108 can be used to select whether mrdy is tied to module_ss or uses its own mcu pin. some applications may require mrdy to be isolated from module_ss. in these cases, mrdy can be configured to use mcu pin p1.4 instead of p2.0, at the expense of giving up the use of the current se nsor. table 10 C jp102 jumper settings jumper position radio signal name mcu signal name description jp102 closed mrst p2.7 /mrst mrst connected to mcu pin p2.7 (default) open mrst disconnected from mcu pin p2.7 table 11 C jp105 jumper settings jumper position radio signal name mcu signal name description jp105 closed srdy p2.2/ srdy srdy connected to mcu pin p2.2 (default) open srdy disconnected from mcu pin p2.2 table 12 C jp108 jumper settings jumper position radio signal name mcu signal name description jp108 1 mrdy p2.0/ module_ss mrdy connected to mcu pin p2.0 (default) 2 p1.4/ cur/ mrdy/ ext_csn mrdy connected to mcu pin p1.4
page 30 of 45 air boosterpack C users manual release date 11/2/12 ? i 2 c pin mapping the example application preloaded in the msp430 uses a software i 2 c controller on port pins p2.3 and p2.4. for stellaris applications utilizing a hardware i 2 c controller, jp106 and jp107 may be used to free up these two pins for other purposes. b oth of these are 2 - terminal jumpers that can accommodate a 0603 resistor. the boosterpack is shipped with a pcb trace making the connection by default. to break the connection, this trace must be cut. table 13 - jp106 jumper settings (sda) jumper position launchpad signal name msp430 signal name description jp106 closed p2.3/ sda sda msp430 p2.3 connected to j2 - 1 (default) open msp430 p2.3 disconnected from j2 - 1 table 14 - jp10 7 jumper settings (s cl ) jumper position launchpad signal name msp430 signal name description jp107 closed p2.4/ scl/ led3 scl msp430 p2.4 connected to j2 - 2 (default) open msp430 p2.4 disconnected from j2 - 2 ? miscellaneous jp103 and jp104 are small solder jumpers intended for test purposes only. do not bridge the gap at these locations as the i 2 c signals (scl, sda) would be shorted directly to gnd, preventing normal operation of the i 2 c bus. table 15 C jp103 jumper settings jumper position radio signal name mcu signal name description jp103 closed tp23 sda reserved open reserved (default) table 16 C jp104 jumper settings jumper position radio signal name mcu signal name description jp104 closed tp21 scl reserved open reserved (default)
air boosterpack C users manual page 31 of 45 release date 11/2/12 3.2.8. connector s ? j1 C launchpad j1 interface table 17 C j1 launchpad connector pinout pin signal name i/o description j1 - 1 lp_vcc i supply voltage j1 - 2 p1.0/led1 o launchpad red led control C active high (onboard msp430) i red led control C active high (external launchpad mcu) j1 - 3 p1.1/rxd i uart receive data (onboard msp430) - not connected (external launchpad mcu) j1 - 4 p1.2/txd o uart transmit data (onboard msp430) - not connected (external launchpad mcu) j1 - 5 p1.3/s2 i/o pushbutton switch connected in parallel with s2 on msp430 launchpad C active low j1 - 6 p1.4/cur/mrdy/ext_cs o not used (onboard msp430) current sensor analog signal (external launchpad mcu) j1 - 7 p1.5/sclk o not used (onboard msp430) i radio module spi clock (external launchpad mcu) j1 - 8 p2.0/module_ss o not used (onboard msp430) i radio module slave select - active low (external launchpad mcu) j1 - 9 p2.1/led4 o not used (onboard msp430) i rgb red led control C active low (external launchpad mcu) j1 - 10 p2.2/srdy o not used (onboard msp430) radio module slave ready C active high (external launchpad mcu)
page 32 of 45 air boosterpack C users manual release date 11/2/12 ? j2 C launchpad j2 interface table 18 - j2 launchpad connector pinout pin signal name i/o description j2 - 1 p2.3/sda i/o not used (onboard msp430) i 2 c data (external launchpad mcu) j2 - 2 p2.4/scl/leds o i 2 c clock output (onboard msp430) i i 2 c clock input (external launchpad mcu) j2 - 3 p2.5/led5 o not used (onboard msp430) i rgb green led control C active low (external launchpad mcu) j2 - 4 p1.6/miso/led2 o launchpad green led control C active high (onboard msp430) o radio module spi data output (external launchpad mcu) i green led control C active high (external launchpad mcu) j2 - 5 p1.7/mosi o spi mosi (onboard msp430) i radio module spi data input (external launchpad mcu) j2 - 6 rst/s1 i/o reset / spy - bi - wire data (onboard msp430) - not connected (external launchpad mcu) j2 - 7 test i test / spy - bi - wire clock (onboard msp430) - not connected (external launchpad mcu) j2 - 8 p2.7/mrst o not used (onboard msp430) i radio module reset C active low (external launchpad mcu) j2 - 9 p2.6/led6 o not used (onboard msp430) i rgb blue led control C active low (external launchpad mcu) j2 - 10 gnd - ground reference
air boosterpack C users manual page 33 of 45 release date 11/2/12 ? j3 C external device interface 0.1 pitch thru - hole footprint which provides a single location for connecting external devices (e.g. sensors) to the boosterpack via spi and/or i 2 c. it is also possible to connect an external mcu acting as spi/i 2 c master to this port, provided the launchpad/boosterpack mcu is removed or configured as spi/i 2 c slave device (e.g. to drive leds or monitor pushbuttons). firmware examp les for using the launchpad/boosterpack mcu as a slave device are not provided. please note that the shunt must be removed from jp2 when using an external spi slave device (see section for more details). table 19 C j3 external device connector pinout pin signal name i/o description j3 - 1 gnd - ground reference j3 - 2 p1.4/cur/mrdy/ext_cs o chip select output to external spi slave C active low j3 - 3 vdd o supply voltage to external device(s) j3 - 4 p1.7/mosi o mosi output to external spi slave (mcu on launchpad or boosterpack) i mosi input from external spi master (external mcu connected via j3) j3 - 5 scl o clock output to external i 2 c slave(s) (mcu on launchpad or boosterpack) i clock input from external i 2 c master (external mcu connected via j3) j3 - 6 p1.6/miso/led2 o miso output to external spi master (external mcu connected via j3) i miso input from external spi slave (mcu on launchpad or boosterpack) j3 - 7 sda i/o i 2 c data j3 - 8 p1.5/sclk o sclk output to external spi slave (mcu on launchpad or boosterpack) i sclk input from external spi master (external mcu connected via j3) j3 - 9 gnd - ground reference j3 - 10 p2.0/module_ss o not used (mcu on launchpad or boosterpack) i radio module chip select input from external spi master (external mcu connected via j3) j3 - 11 srdy o radio module slave ready output j3 - 12 mrst o not used (mcu on launchpad or boosterpack) i radio module hardware reset C active low (external mcu connected via j3)
page 34 of 45 air boosterpack C users manual release date 11/2/12 ? j4 C radio module programming/debugging interface 0.05 pitch footprint for a2530 programming/debugging using a cc debugger. table 20 C j4 a2530 program/debug connector pinout pin signal name i/o description j3 - 1 gnd - ground reference j3 - 2 vdd o supply voltage to debugger j3 - 3 module_dc i radio module debug clock j3 - 4 module_dd i/o radio module debug data j3 - 5 - - j3 - 6 - - j3 - 7 mrst i radio module hardware reset C active low j3 - 8 - - j3 - 9 - - j3 - 10 - - ? j5 C radio module gpio interface 0.1 pitch thru - hole footprint which provides access to the radio modules four gpio signals. for applications requiring use of these pins, the leds and 2k pull - down resistors sharing the gpio signals may be electrically isolated by turning off the s4 dip switches (see table 5 for more info r egarding the dip switches). table 21 C j5 a2530 gpio connector pinout pin signal name i/o description j3 - 1 gnd - ground reference j3 - 2 vdd o supply voltage j3 - 3 gpio1 i/o radio module p0.1 j3 - 4 gpio0 i/o radio module p0.0 j3 - 5 gpio3 i/o radio module p1.0 j3 - 6 gpio2 i/o radio module p0.6 ? j101 C external power interface 2mm pitch shrouded header for connecting external power (e.g. from a battery) to the boosterpack. the positive terminal has a series schottky diode to prevent accidental battery charging in the event the boosterpack is installed on a powered launchpad. table 22 C j101 external power (battery) connector pinout pin signal name i/o description j 101 - 1 gnd - ground reference j 101 - 2 vdd i supply voltage
air boosterpack C users manual page 35 of 45 release date 11/2/12 3.3. schematics figure 13 C schematic sheet 1
page 36 of 45 air boosterpack C users manual release date 11/2/12 figure 14 C schematic sheet 2
air boosterpack C users manual page 37 of 45 release date 11/2/12 3.4. pcb layout figure 15 - pcb layout top layer figure 16 - pcb layout inner layer (gnd plane)
page 38 of 45 air boosterpack C users manual release date 11/2/12 figure 17 - pcb layout inner layer (split pwr plane) figure 18 - pcb layout bottom layer
air boosterpack C users manual page 39 of 45 release date 11/2/12 figure 19 - pcb layout top silkscreen figure 20 - pcb layout bottom silkscreen
page 40 of 45 air boosterpack C users manual release date 11/2/12 figure 21 - pcb layout bottom layer mirror image figure 22 - pcb layout bottom silkscreen mirro r image
air boosterpack C users manual page 41 of 45 release date 11/2/12 3.5. bill of materials (bom) table 23 - bill of material item ref des qty description comment 1 c1,c2,c3, c4,c9 5 cap cer 0.1uf 16v 10% x7r 0402 2 c5,c6 2 cap cer 1000pf 50v 5% np0 0402 3 c7,c8 2 np cap cer 1 2 pf 50v 5% np0 0402 not populated 4 c10 1 cap cer 10uf 6.3v 20% x5r 0603 5 d1,d8 2 led 0402 red smd 6 d2 1 led 0402 green smd 7 d3,d9 2 led 0402 y ello w smd 8 d4 1 led rgb square clear smd 9 d5 1 diode schottky 500ma smd 10 d6,d7 2 np led 0402 blue smd not populated kingbright aphhs1005qbc/d (or equivalent) 11 j1,j2 2 conn socket 10pos 2.54mm single row vertical t/h 12 j3 1 np conn header 12pos 2.54mm dual row vertical t/h not populated 13 j4 1 np conn header 10pos 1.27mm dual row vertical t/h shrouded not populated samtec shf - 105 - 01 - l - d - th (or equivalent) 14 j5 1 np conn header 6pos 2.54mm dual row vertical t/h not populated 15 j101 1 conn header 2pos 2mm ra t/h 16 jp1 (hdr) 1 conn header 3pos 2mm single row vert ical t/h 17 jp1 (shunt) 1 conn shunt 2mm 2pos gold 18 jp2 (hdr) 1 conn header 2pos 2mm single row vert ical t/h 19 jp2 (shunt) 1 conn shunt 2mm 2pos gold 20 jp100, jp101, jp108 3 np jumper 3 p ad smd ( res 0.0 ohm 1/10w 0603 smd ) not populated 21 jp102, jp105, jp106, jp107 4 np jumper 2pad smd ( res 0.0 ohm 1/10w 0603 smd ) not populated
page 42 of 45 air boosterpack C users manual release date 11/2/12 item ref des qty description comment 22 r1, r15 , r18 3 res 47k ohm 1/10w 5% 0 402 smd 2 3 r2,r5,r7, r8,r9, r10,r11, r12,r13, r14, r16 , r17,r19, r20, r21 13 /2 np res 2 k ohm 1/10w 5% 0 402 smd r12,r13 not populated 2 4 r3,r6 2 res 0.2 ohm 1/10w 1 % 0603 smd 2 5 r4 1 np res 0.0 ohm 1/10w 0 402 smd not populated 2 6 r 100 1 np res 0.0 ohm 1/10w 0 603 smd not populated 2 7 s1,s2,s5 2/1 np switch tact spst no smd s5 not populated omron b3u - 1000p (or equivalent) 2 8 s3,s4 2 s witch dip 4pos 1.27 mm smd 2 9 u1 1 ic eeprom 128kbit 400khz 8udfn atmel at24c128c - mahm - t 30 u2 1 ic color sensor dgtl progr 6 - dfn taos tcs3414fn 31 u3 1 ic sensor thermopile 8dsbga texas instruments tmp006aiyzft 3 2 u4 1 ic current shunt monitor 4dsbga texas instruments ina216a2yffr 3 3 u5 ( skt ) 1 ic socket 20pin 3 4 u5 (ic) 1 ic mcu 16bit 16kb flash 20pdip texas instruments msp430g2553in20 3 5 u6 1 radio module a2530 smd anaren A2530E24Az1 or a2530 r 24az1 3 6 y1 1 np crystal 32.768 khz 12.5pf smd not populated abracon abs06 - 32.768khz - t (or equivalent)
air boosterpack C users manual page 43 of 45 release date 11/2/12 history date author change note no./notes 11/2/12 initial draft
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if you have additional questions, need samples, or would like a quote C please email the air team at air@anaren.com . for a full list of our franchised distributors, please visit our website: http://www.anaren.com/air/ anaren microwave, inc. 6635 kirkville road east syracuse, ny 13057 tel: +1 315 432 8909 +1 800 411 6596 fax: +1 315 432 8970 anaren microwave (europe), inc. 12 somerset house, suite 16 & 17 hussar court, waterlooville hampshire, england p07 - 7sg tel: +44 2392 232392 fax: +44 2392 251369 anaren communication suzhou co. ltd. no. 5 chun hui road wei ting, suzhou industrial park suzhou 215122, pr china tel: +86 512 6287 6400 fax: +86 512 6274 9283 attach distributor contact information here

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