? semiconductor components industries, llc, 2012 january, 2012 ? rev. 7 1 publication order number: murhd560/d murhd560t4g, surhd8560t4g, murhd560w1t4g, SURHD8560W1T4G power rectifier features and benefits ? ultrafast 30 nanosecond recovery times ? 175 ? c operating junction temperature ? high temperature glass passivated junction ? high voltage capability to 600 volts ? aec ? q101 qualified and ppap capable ? surhd8 prefix for automotive and other applications requiring unique site and control change requirements ? these are pb ? free devices* applications ? power supplies ? inverters ? free wheeling diodes mechanical characteristics ? case: epoxy, molded ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 0.4 g (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 ? c max. for 10 seconds ? esd ratings: ? machine model = c (> 400 v) ? human body model = 3b (> 8000 v) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information murhd560t4g dpak (pb ? free) dpak case 369c styles 3, 8 2,500 / tape & reel ultrafast rectifier 5.0 amperes 600 volts 4 marking diagrams http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. uh560 = murhd560t4 560w1 = murhd560w1t4 a = assembly location y = year ww = work week g = pb ? free package ayww uh560g 1 3 murhd560w1t4g dpak (pb ? free) 2,500 / tape & reel ayww 560w1g style 3 style 8 4 1 3 style 3 style 8 surhd8560t4g dpak (pb ? free) 2,500 / tape & reel SURHD8560W1T4G dpak (pb ? free) 2,500 / tape & reel
murhd560t4g, surhd8560t4g, murhd560w1t4g, SURHD8560W1T4G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 600 v average rectified forward current (rated v r , t c = 159 ? c) i f(av) 5.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 50 a operating junction and storage temperature range t j , t stg ? 65 to +175 ? c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics rating symbol value unit maximum thermal resistance, junction to case r jc 2.5 ? c/w maximum thermal resistance, junction to ambient (note 1) r ja 49.5 ? c/w 1. rating applies when surface mounted on a 1.5 mm fr4 pc board with a 1 oz. thick, 700 mm 2 cu area. electrical characteristics rating symbol value unit maximum instantaneous forward voltage (note 2) (i f = 5.0 amps, t c = 25 ? c) (i f = 5.0 amps, t c = 125 ? c) v f 2.7 1.65 v maximum instantaneous reverse current (note 2) (rated dc voltage, t c = 25 ? c) (rated dc voltage, t c = 125 ? c) i r 10 70 a maximum reverse recovery time (i f = 1.0 amp, di/dt = 50 amps/ s, v r = 30 v, t j = 25 ? c) t rr 30 ns 2. pulse test: pulse width = 300 s, duty cycle ? 2.0%.
murhd560t4g, surhd8560t4g, murhd560w1t4g, SURHD8560W1T4G http://onsemi.com 3 i r , reverse current (amps) i f , forward current (amps) figure 1. typical forward voltage figure 2. maximum forward voltage figure 3. typical reverse current figure 4. maximum reverse current 0 v f , instantaneous forward voltage (volts) 10 1 600 0 v r , reverse voltage (volts) 1.0e ? 4 1.0e ? 6 1.0e ? 7 1.0e ? 9 0.01 1.5 0.5 3.0 100 200 300 125 ? c 150 ? c 25 ? c 125 ? c 25 ? c 2.0 1.0 100 1.0e ? 5 1.0e ? 8 400 150 ? c i r , maximum reverse current (amps) v r , reverse voltage (volts) 100 ? c 500 100 ? c 600 0 1.0e ? 3 1.0e ? 5 1.0e ? 6 1.0e ? 8 100 200 300 125 ? c 25 ? c 1.0e ? 4 1.0e ? 7 400 150 ? c 500 100 ? c 0.1 2.5 i f , forward current (amps) 0 v f , maximum forward voltage (volts) 10 1 0.01 3.0 1.0 6.0 125 ? c 150 ? c 25 ? c 4.0 2.0 100 100 ? c 0.1 5.0 p fo , average power dissipation (watts) figure 5. typical capacitance figure 6. forward power dissipation i o , average forward current (amps) 1 0 5 0 5 24 6 square wave dc 37 c, capacitance (pf) 0 v r , reverse voltage (volts) 100 50 0 150 50 100 200 8 20 10 60 20 70 30 80 40 90 125 25 75 175 t j = 175 ? c 15 10
murhd560t4g, surhd8560t4g, murhd560w1t4g, SURHD8560W1T4G http://onsemi.com 4 i f , average forward current (amps) 120 150 100 t c , case temperature ( ? c) 9 5 0 130 170 160 180 square wave dc 110 140 figure 7. current derating 8 4 7 3 6 2 1 r jc = 2.5 ? c/w t j = 175 ? c r (t) , transient thermal resistance figure 8. thermal response, junction to case 1000 0.1 0.000001 t, time (s) 10 1 0.1 0.0001 0.001 0.01 1.0 10 0.01 single pulse 0.5 0.2 0.1 0.05 0.01 0.00001 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 r (t) , transient thermal resistance figure 9. thermal response, junction to ambient 1000 0.1 0.000001 t, time (s) 100 1 0.1 0.0001 0.001 0.01 1.0 10 0.01 single pulse 0.5 0.2 0.1 0.05 0.01 0.00001 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 10
murhd560t4g, surhd8560t4g, murhd560w1t4g, SURHD8560W1T4G http://onsemi.com 5 package dimensions dpak (single gauge) case 369c ? 01 issue d style 3: pin 1. anode 2. cathode 3. anode 4. cathode style 8: pin 1. n/c 2. cathode 3. anode 4. cathode b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 murhd560/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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