arrays rp102p rp104p rp164p type 1.00 ?.10 2.00 ?.10 3.20 ?.10 1.00 ?.10 1.00 ?.10 1.60 ?.10 0.35 ?.10 0.35 ?.10 0.50 ?.10 0.33 ?.05 0.30 ?.15 0.40 ?.15 - 0.40 ?.15 0.60 ?.15 0.20 ?.10 0.15 ?.10 0.30 ?.15 0.25 ?.10 0.25 ?.15 0.30 ?.15 0.65 ?.10 0.50 ?.15 0.80 ?.15 1.1 a 2.2 a 8.9 a l w tadbgp average weight (unit: mm) rn102p rn104p type 1.00 ?.10 2.00 ?.10 1.00 ?.10 1.00 ?.10 0.35 ?.10 0.40 ?.10 0.30 ?.10 0.30 ?.10 0.15 ?.10 0.15 ?.10 0.25 ?.15 0.25 ?.15 0.5 ?.10 0.5 ?.10 1.2 a 2.8 a l w tabgp average weight (unit: mm) 2 array (1) convex terminal type (2) concave terminal type 4 array a d b t w l l p b a t w g p g 2 array a a b t w p l g b t w l p g 4 array reducing smd surface area (40% reduced). reducing smd costs (75% reduced). both flow and reflow soldering are applicable. convex & concave type. the product of lead-free terminal is rohs compliant. pho(lead oxide) is included in the glass of our product which is prescribed on rohs appendix as an exception. for semiconductor devices. for computers, digital circuits. feature application structure and dimensions (top side) (bottom side)
16 17 rp: convex type array rn: concave type array rn code designation 10: 1005 16: 1608 16 dimension 2p: 2 pieces 4p: 4 pieces 4p resistors j: ? 5% jumper: j j tolerance 3 digit coding system (iec coding system) e-24 series 1 0 0 resistance value cs : tape packaging 7" es : tape packaging 10" as : tape packaging 13" fs packaging code the part number system shall be in the following format ? 200ppm ? 200ppm 1 ? ~1m ? -55 ? ~+125 ? 70 ? 102p, 104p 162p, 164p type 1/16 power rating (w) 25(v) 50(v) 50(v) 100(v) working voltage (max) overload voltage (max) tcr (ppm/ ? ) resistance range ( ? ) rated ambient temperature rated working temperature 70 ? -55 ? ~+125 ? 102p, 104p 162p, 164p type resistance 50m ? max. 1.0(a) current rating rated ambient temperature rated working temperature rated voltage (v) = rated voltage should be lower than (max) working voltage. 2 rated power(w) ? normal resistance value (r) the rated power is the maximum continuous loading power at 70 ? ambient temperature. for ambient temperature above 70 ? , the loading power follows the below power derating curve. (the load current shall be derated according to derating curve in case of the 'jumper') 100 80 60 40 20 0 percentage of the rated dissipation(%) operation area -55 -40 0 40 80 120 ambient temperature( ? ) 70 125 3 digits indication(e-24 series) - left 2 digits represent significant figures. - last 1 digit represents exponential number of 10. - example: 10 3 left 2 digit: 10 last 1 digits: 3 10 3 = 10 ? 10 3 = 10 000 ? =10k ? rp102p, rn102p, rn104p type : no marking. jumper chip is printed as ?00? parts numbering system specification power derating curve jumper resistors marking the specifications and designs contained herein may be subject to change without notice. please contact our sales representatives or product engineers before you ordering. recommended soldering conditions general general structure precision low ohms ultra low ohms arrays standard resistance value packaging characteristics performance arrays for memory modules attenuator operation notes example of land pattern design
rm102p rm104p type 1.00 ?.10 2.00 ?.10 1.00 ?.10 1.00 ?.10 0.35 ?.10 0.45 ?.10 0.30 ?.10 0.30 ?.10 0.15 ?.10 0.15 ?.10 0.25 ?.15 0.25 ?.15 0.50 ?.10 0.50 ?.10 1.2 a 2.8 a l w tab gp average weight (unit: mm) rk102p rk104p type 1.00 ?.10 2.00 ?.10 1.00 ?.10 1.00 ?.10 0.35 ?.10 0.45 ?.10 0.30 ?.10 0.30 ?.10 0.25 ?.15 0.25 ?.15 0.50 ?.10 0.50 ?.10 1.2 a 2.8 a l w tagp 0.17min 0.3min h average weight (unit: mm) (1) reverse concave type (2) short-free reverse concave type a b t w l p l p g g a t w reducing smd surface area (40% reduced). reducing smd costs (75% reduced). applicable both flow and reflow soldering. reverse & short free reverse concave type. the product of lead-free terminal is rohs compliant. pho(lead oxide) is included in the glass of our product which is prescribed on rohs appendix as an exception. for semiconductor devices. for computers, digital circuits. feature application structure and dimensions arrays for memory modules h t a
18 19 rm : reverse concave array rk : short-free reverse concave array rm code designation 10: 1005 16: 1608 10 dimension 2p: 2 pieces 4p: 4 pieces 4p resistors j: ? 5% jumper: j j tolerance 3 digit coding system (iec coding system) e-24 series 1 0 0 resistance value cs : tape packaging 7" es : tape packaging 10" as : tape packaging 13" cs packaging code the part number system shall be in the following format ? 200ppm 1 ? ~1m ? -55 ? ~+125 ? 70 ? 102p, 104p type 1/16 power rating (w) 25(v) 50(v) working voltage (max) overload voltage (max) tcr (ppm/ ? ) resistance range ( ? ) rated ambient temperature rated working temperature 70 ? -55 ? ~+125 ? 102p, 104p type resistance 50m ? max. 1.0(a) current rating rated ambient temperature rated working temperature rated voltage (v) = rated voltage should be lower than (max) working voltage. 2 rated power(w) ? normal resistance value (r) the rated power is the maximum continuous loading power at 70 ? ambient temperature. for ambient temperature above 70 ? , the loading power follows the below power derating curve. (the load current shall be derated according to derating curve in case of the 'jumper') 100 80 60 40 20 0 percentage of the rated dissipation(%) operation area -55 -40 0 40 80 120 ambient temperature( ? ) 70 125 3 digits indication(e-24 series) - left 2 digits represent significant figures. - last 1 digit represents exponential number of 10. - example: 15 0 left 2 digit: 15 last 1 digits: 0 15 0 = 15 ? 10 0 = 15 ? rm102p, rk102p type : no marking. jumper chip is printed as ?00? parts numbering system specification power derating curve jumper resistors marking the specifications and designs contained herein may be subject to change without notice. please contact our sales representatives or product engineers before you ordering. recommended soldering conditions general general structure precision low ohms ultra low ohms arrays standard resistance value packaging characteristics performance arrays for memory modules attenuator operation notes example of land pattern design
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