hd mezz the hd mezz performs at 9.0 ghz/pair at a 20mm stack hd mezz is a 1.2mm x 2mm grid interconnect system for elevated, high speed board-to- board applications. the high density arrays open pin ? eld design allows both single-end- ed or differential pair routing. when routed differentially, hd mezz is rated at 9.0 ghz/pair at a 20mm stack height. the hd mezz is sourced by both sam- tec and molex incorporated. the hdam/hdaf series (hd mezz) is available in: 143, 195, and 299 positions 20mm, 25mm, 30mm, and 35mm standard stack heights custom heights available dual wipe contacts provide a reliable mating interface and the 1.2mm grid is ideal for applications where pcb real estate is limited. the hd mezz has the option to contain lead or a lead-free tin alloy, to meet rohs compliancy requirements. the hdam/ ? ? ? hdaf series also incorporates guide posts as a standard feature to aid in alignment. final inch? information is available for the hd mezz system. final inch? is a reference design for one of the most dif? cult design issues on the board - the breakout region (bor) around the connector. samtec can provide empirical tdr and frequency domain data, test boards, and validated elect- rical models for the hd mezz system. this information is a time saving and unmatch- ed service in the interconnect industry. visit www.? nalinch. com for more information. other high density, high speed array interconnects include: ? searay? ? dp array? ? samarray? guide posts for alignment 1.2mm x 2mm grid high density elevated board-to-board elevated stack heights of 20mm, 25mm, 30mm and 35mm *hd mezz is a trademark of molex incorporated. ?samtec, inc., 2007 143, 195, and 299 positions
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