|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
geometry process details principal device types cmlsh05-4 gross die per 4 inch wafer 28,028 process cpd96v schottky diode 500ma low v f schottky diode chip process epitaxial planar die size 20 x 20 mils die thickness 7.1 mils anode bonding pad area 16.4 x 16.4 mils top side metalization al - 20,000? back side metalization au - 12,000? www.centralsemi.com r5 (22-march 2010)
process cpd96v typical electrical characteristics www.centralsemi.com r5 (22-march 2010) |
Price & Availability of CPD96V10 |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |