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prepared by: date: jian /16/?jj cleda approved by: date: electronk components group lt /l&/45 sharp corporation 3 xlku~ ?1 specification spec.no. issue dg!wo43 jun/16/99 page 10 pages representative division: opto-electronic devices division device specification for light emitting diode model no. gl52r44 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; l * oa equipment * audio visual equipment * home appliance * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers 1 if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; [_ * transportation control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment 1 (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; i * space equipment * telecommunication equipment (for trunk lines) * nuclear power control equipment * medical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. customer?s approval date: presented by: m.katoh, / date: by: department general manager of engineering dept.,iii optc-electronic devices division electronic components group sharp colzporatlon
dg996043 jun/16/9!i model no. page GL5ZR44 l/10 GL5ZR44 stxxitication 1. application this specification applies to the light emitting diode &vice model no. GL5ZR44. [algalnp (dicing or scribe/brake type> red led device] 2. outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . ..o refer to the attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 3-4. 3- 1. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating cwe 3-4. characteristics diagram 4. reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 5. 4-l. test items and test conditions 4-2. measurement items and failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..a refer to the attached sheet page 6. 5- 1. applied standard 5-2. sampling method and level 5-3. test items, judgement criteria and classifica of defect 5-4. test items the surface is be applied for flat type, judgement criteria and classifka of defect 6. supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 7-8. 6-l. packing 6-2. luminous intensity rank 6-3. dominant wavelength rank 6-4. environment 7 precau~omforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 9- 10. 7- 1. lead forming method 7-2. notice of installation 7-3. soldering conditions 7-4. for cleaning
dg9!%043 model no. i;l5zr44 juni16i99 page 2/10 i -2outlhe dimensions and pin eons l+lorless transp8rency (ore) unspecified tol. to be +0.2mm pin comtxtioils joti> cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product. unit mm material lead : (fe) cold rolled steel package : epoxy reek finish lead : sn plated or wave soldering drawing no. 51106024
dg996043 jun/16/99~ model no. page i GL5ZR44 i 3110 3. ratings and characteristics 3- 1. absolute maximum ratings (ta=25?c) parameter symbol value unit power dissipation p 130 mw (note i) duty ratio=l/lo&he width=o.lms (note 2) at the position of 1.6mm from the bottom resin package (note 3) refer to the suplement item 6. regarding the standard of rank classification. 3-3. derating curve peak forward current derating curve forward current derating curve 120 3 h 100 $ 80 ,? 2 60 7 z 4o 5 20 : 0. 0 -25 0 25 50 75 *%nl 125 ambient temperature ta (?cl ambient temperature ta (?c) 60 2 5 50 l ; 40 c 2 l. 30 d ?: 20 l b 10 0 -25 0 25 50 7585 100 125
dg996043 jun/16/99 model no. page GL5ZR44 4110 peak forward current vs. duty ratio (ta=25?c) 10 l/100 l/10 1 10 duty raito dr 3-4. characteristics diagramttyp) (note 1) relative luminous intensity vs. ambient temperature forward current vs.forward voltage (ta=25"c) (if=2om4) -60 -40 -20 0 20 40 60 80 100 120 ambient temprature tarc)- 1 1.2 1.4 1.6 1.8 2 2.22.42.6 forward voltage vf(v) relativs lumitmus intsmity vs. frowmrd voltrga (ta=25?=c) 1000 $ .- it 100 0 1 1 .- b 0.01 0. 1 1 10 100 forward current ifhn (note 1) above characteristic data are typical data and not a guarantteed data.
l dg996043 i jun/16/!39 model no. 1 page GL5ZR44 5110 4. reliability the reliability of products shall be satisfied with items listed below. 4- 1. test items and test conditions confidence level: 904 b temperature cycling -4o?c(3omin)~+loo?c(3omin),3o cycles n=22,c=o 10 high temp* and high humidity storage ta=+6o?c, 9o%rh, t=loooh n=22,c=o 10 high temperature storage ta=l 00c , t= loooh n=22, c=o 10 low temperature storage ta=-4o?c. t=loooh n=22, c=o 10 operation life ta=25?c, irmax. t=loooh *3 n=22, c=o 10 4-2. measurement items and failure judgement criteria * 1 measurement sylilbol failure judgement criteria *2 forward voltage vf vf > u.s.l. x 1.2 reverse current ir ir >u.s.l.x 2.0 luminous intensity iv iv > the first stage value x 2.0 or the first stage value x 0.5 > iv z solderability : sol&r shah be adhere at the area of 95% or more of dipped portion. z terminal strength : package is not destroyed, and terminal is not slack *l: measuring condition is in accordance with specification. *2: u.s.l. is shown by upper specification limit. *3: if max.is shown by forward current of absolute maximum ratings.
dg996043 imodel no. juni16l99 page GL5ZR44 6110 5. incoming inspection 5- 1. applied standard : is0 2859- 1 5-2. sampling method and level : a single sampling plannormal inqection level ii : aql major defect : 0.065% minor defect : 0.4% 5-3. test items, judgement criteria and classifica of defect no. test items i judgement criteria 1 discomection not emit light 2 position of cutting off rim different from dimension 3 reverse terminal different from dimension 4 outline dimensions not satisfy outline specification 5 i characteristics i over the limit value of specification at v,, i,, and iv 6 i cut off the rim i exceed -0.2mm white point : exceed 4 0.3mm (on top view) 7 foreign substance black point : exceed 4 0.3mm (on top view) sing form : exceed 3.omm (on top view) 8 scratch exceed 4 0.3mm or o.lmm x l.omm (on top view) 9 void exceed $0.3mm (on top view) 10 uneven density of material for scattering extremely uneven density 11 unbalanced center exceed fo25mm from package center 12 i burr i exceed +0.2mrn againstprovided dimension 13 insertion position of terminal insertion position of terminal :lassifica ofdefec major defect minor defect 5-4. test items the surface is be applied for flat type, judgement criteria and classifica of defect no. test items i judgement criteria 14 chapped the surface the surface chapped is striking for see the lamp top 15 1 hollow the surface 1 the surface hollow is striking for see the lamp top minor defect
i GL5ZR44 1 7110 6. supplement 61. packing 6-l-l. inner package put 25opcs the same luminous intensity rank products into pack and put following label by pack. product weight : 0.28g (one product,typ.) (kiication label sample) shipbent table part no. GL5ZR44 + model number quantity 250 + quantity of products *&l cl tlclclclcl lot no. ka99b19 + lot number * a 0 00 0 @-0 c- luminous intensity rank sharp? dominant wavelength rank made in japan + production country @ production plant code(to be indicated alphabetically) @ support code @) year of production(the last two figures of the year) @ month of production (to be indicated alphabetically with january corresponding to a) @ date of production(ol-31) 6-l-2. outer package put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. outer package out line dimension width: 14omm, depth: 225mrn, hight: 9omm (note 1) tolerance:fls% in regard to luminous intensity , the following ranking shall be carried out. however the quantity of each rank shall not be pre scribed. in case of the distribution of the luminous intensity shift to high, at that dc996043 model no. junll6/99 page point new upper rank is prescribed and lower rank is delete. 6-3dominant wavelength rank (note 2) (ta=25?c ) i rank i dominant wavelength 1 unit 1 condition i y 1 628.5 - 632.5 1 z 631.5 - 635.5 1 634.5 - 638.5 run if2oma 2 637.5 - 641.5 3 640.5 - 644.5 (note 2) the condition of measurement : the measurement of the light emission from the front side of lamp. this rank value is the setting value of when that classifies it the rank and be not a guarantee value. also i shall not ask the delivery ratio of each rank.
dg996043 jun/16/99 model no. page GL5ZR44 8/10 6-4. environment 641. ozonosphere destructive chemicals. (1) the &vice doesn?t contain following substance. (2) the &vice doesn?t have a production line whose process requires following substance. restricted part: cfcs~ones,ccb,t~c~o~~~e~ych) 642. bromic non-bun&g materials the device doesn?t contain bromic non-burning materiak@bbos,pbbs)
dg996043 jun/16/!8 model no. page GL5ZR44 9110 7. prtcautions for use 7 - 1. lead forming method avoid forming a lead pin with the lead pin b&se as a fulcrum:be sure to hold a lead pin firmly when forming. lead pins should be forwed before soldering. 7 - 2. notice of installation 7-z-l installation on a p wb when mounting an led lamp on a pib, do not apply physical stress to the lead pins. *the lead pin pitch should match the pbb pin-hole pitch:absolutely avoid widening or narrowing the lead pins. l when positioning an led lamp,basicaily employ an led with tie-bar cut or use a spacer. 7-z-z when an led 1 is mounted directly on a p w b if the bottom face of an led lamp is mounted directly on single-sided pwb,the base of the lead pins may be subjected to physical stress due to pwb warp, cutting or clinching of lead pins.prior to use,be sure to check that no disconnection inside of the resin or damage to resin etc.,is found.when an led lamp is mounted on a double-sided pwb,the heat during soldering affects the resin;therefore,keep the led lamp more that 1.6mm afloat above the pw. 7-z-3 installation using a holder during an led lamp positioning,when a holder is used, a holder should be designed not to subject lead pins to any undue stress. (note)pay attention to the thermal expansion coefficient of the material used for the holder.since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-z-4 installation to the case do not fix part c with- adhesives when fixed to the case as shown in figure.a hole of the case should be designed not to subject the inside of resin to any undue stress. goal
dg996043 jun/16/99 model no. page GL5ZR44 lo/lo 7 - 3. s oldering conditions solder the lead pins under the following conditions type of s oldering conditions 1. manual soldering 295c -+s?c. within 3 seconds 2. wave soldering 260c + 5c. vi thin 5 seconds 3. auto soldering preheating 70c to 8o?c, within 30 seconds soldering 245?c+5?c, within 5 seconds (note) avoid d? ipping resin into soldering bath avoid applying stress to lead pins while they are heated.for example , when the led lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. i ran 7 - 4. for cleaning (1) solvent cleaning : solvent temperature 45c or less immersion for 3 min or less (2 > ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,pwb size or device mounting condition etc. please test it in actual using condition and confirm that doesn?t occur any defect before starting the ultrasonic cleaning. ( 3 > applicable solvent : ethyl alcohol. methyl alcohol, isopropyl alcohol in case when the other solvent is used,there are cases that the packaging resin is eroded. please use the other solvent after thorough confirmation is performed in actual using condition.

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