AOD6N50 500v,5.3a n-channel mosfet 600v@150 i d (at v gs =10v) 5.3a r ds(on) (at v gs =10v) < 1.4 w symbol v ds the AOD6N50 is fabricated using an advanced high voltage mosfet process that is designed to deliver high levels of performance and robustness in popular ac- dc applications.by providing low r ds(on) , c iss and c rss along with guaranteed avalanche capability this device ca n be adopted quickly into new and existing offline power supply designs. v ds v units parameter absolute maximum ratings t a =25c unless otherwise noted maximum drain-source voltage 500 g d s v ds v gs i dm i ar e ar e as peak diode recovery dv/dt dv/dt t j , t stg t l symbol r q ja r q cs r q jc maximum junction-to-ambient a,g t c =25c - 55 maximum thermal characteristics units c/w 43 parameter typical w w/ o c maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds 300 c junction and storage temperature range -50 to 150 c power dissipation b p d v 30 gate-source voltage t c =100c a i d t c =25c 5.3 3.3 17 pulsed drain current c continuous drain current b v drain-source voltage 500 mj avalanche current c 118 repetitive avalanche energy c derate above 25 o c 104 0.83 a 2.8 single plused avalanche energy h 235 mj v/ns 5 maximum case-to-sink a maximum junction-to-case d,f c/w c/w 1 0.5 1.2 g d s www.freescale.net.cn 1/6 general description features
symbol min typ max units 500 600 bv dss / ? tj 0.6 v/ o c 1 10 i gss gate-body leakage current 100 n a v gs(th) gate threshold voltage 3.4 4.1 4.5 v r ds(on) 1.2 1.4 w g fs 5 s v sd 0.76 1 v i s maximum body-diode continuous current 5 a i sm 17 a c iss 430 538 670 pf c oss 40 58 80 pf c rss 2.5 4.5 7 pf r g 1.2 2.3 3.5 w q g 9 11.5 14 nc q gs 3 3.8 4.6 nc q gd 2 4.1 6.2 nc t d(on) 18 ns t r 32 ns t d(off) 34 ns v gs =10v, v ds =400v, i d =5a turn-on delaytime gate source charge drain-source breakdown voltage i d =250 a, v gs =0v, t j =25c i d =250 a, v gs =0v, t j =150c diode forward voltage v ds =0v, v gs =30v v ds =40v, i d =2.5a forward transconductance maximum body-diode pulsed current input capacitance output capacitance dynamic parameters turn-on rise time turn-off delaytime v gs =10v, v ds =250v, i d =5a, r g =25 w gate resistance v gs =0v, v ds =0v, f=1mhz total gate charge electrical characteristics (t j =25c unless otherwise noted) static parameters parameter conditions zero gate voltage drain current id=250 a, vgs=0v bv dss m a v static drain-source on-resistance v gs =10v, i d =2.5a reverse transfer capacitance v gs =0v, v ds =25v, f=1mhz switching parameters i dss zero gate voltage drain current v ds =500v, v gs =0v gate drain charge v ds =5v i d =250 m a v ds =400v, t j =125c i s =1a,v gs =0v t d(off) 34 ns t f 22 ns t rr 145 182 220 ns q rr 1.7 2.2 2.7 m c body diode reverse recovery charge i f =5a,di/dt=100a/ m s,v ds =100v turn-off delaytime r g =25 w turn-off fall time body diode reverse recovery time i f =5a,di/dt=100a/ m s,v ds =100v a. the value of r q ja is measured with the device in a still air environm ent with t a =25 c. b. the power dissipation p d is based on t j(max) =150 c in a to252 package, using junction-to-case therm al resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. c. repetitive rating, pulse width limited by juncti on temperature t j(max) =150 c. d. the r q ja is the sum of the thermal impedence from junction t o case r q jc and case to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 m s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-case t hermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of t j(max) =150 c. g.these tests are performed with the device mounted on 1 in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. h. l=60mh, i as =2.8a, v dd =150v, r g =10 ? , starting t j =25 c www.freescale.net.cn 2/6 AOD6N50 500v,5.3a n-channel mosfet
typical electrical and thermal characteristics 0 2 4 6 8 10 0 5 10 15 20 25 30 i d (a) v ds (volts) fig 1: on-region characteristics v gs =5.5v 6v 10v 6.5v 0.1 1 10 100 2 4 6 8 10 i d (a) v gs (volts) figure 2: transfer characteristics - 55 c v ds =40v 25 c 125 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 10 12 r ds(on) ( w w w w ) i d (a) figure 3: on-resistance vs. drain current and gate voltage v gs =10v 0 0.5 1 1.5 2 2.5 3 -100 -50 0 50 100 150 200 normalized on-resistance temperature (c) figure 4: on-resistance vs. junction temperature v gs =10v i d =2.5a 40 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.2 0.4 0.6 0.8 1.0 i s (a) v sd (volts) figure 6: body-diode characteristics 25 c 125 c i d =30a 25 125 0 2 4 6 8 10 0 5 10 15 20 25 30 i d (a) v ds (volts) fig 1: on-region characteristics v gs =5.5v 6v 10v 6.5v 0.1 1 10 100 2 4 6 8 10 i d (a) v gs (volts) figure 2: transfer characteristics - 55 c v ds =40v 25 c 125 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 10 12 r ds(on) ( w w w w ) i d (a) figure 3: on-resistance vs. drain current and gate voltage v gs =10v 0 0.5 1 1.5 2 2.5 3 -100 -50 0 50 100 150 200 normalized on-resistance temperature (c) figure 4: on-resistance vs. junction temperature v gs =10v i d =2.5a 0.8 0.9 1 1.1 1.2 -100 -50 0 50 100 150 200 bv dss (normalized) t j ( o c) figure 5: break down vs. junction temperature www.freescale.net.cn 3/6 AOD6N50 500v,5.3a n-channel mosfet
typical electrical and thermal characteristics 0 3 6 9 12 15 0 3 6 9 12 15 18 v gs (volts) q g (nc) figure 7: gate-charge characteristics v ds =400v i d =2.5a 1 10 100 1000 10000 0.1 1 10 100 capacitance (pf) v ds (volts) figure 8: capacitance characteristics c iss c oss c rss 0.01 0.1 1 10 100 1 10 100 1000 i d (amps) v ds (volts) figure 9: maximum forward biased safe operating area (note f) 10 m s 10ms 1ms dc r ds(on) limited t j(max) =150 c t c =25 c 100 m s 0 200 400 600 800 1000 0.0001 0.001 0.01 0.1 1 10 power (w) pulse width (s) figure 10: single pulse power rating junction-to- case (note f) t j(max) =150 c t c =25 c 0 3 6 9 12 15 0 3 6 9 12 15 18 v gs (volts) q g (nc) figure 7: gate-charge characteristics v ds =400v i d =2.5a 1 10 100 1000 10000 0.1 1 10 100 capacitance (pf) v ds (volts) figure 8: capacitance characteristics c iss c oss c rss 0.01 0.1 1 10 100 1 10 100 1000 i d (amps) v ds (volts) figure 9: maximum forward biased safe operating area (note f) 10 m s 10ms 1ms dc r ds(on) limited t j(max) =150 c t c =25 c 100 m s 0 200 400 600 800 1000 0.0001 0.001 0.01 0.1 1 10 power (w) pulse width (s) figure 10: single pulse power rating junction-to- case (note f) t j(max) =150 c t c =25 c 0.001 0.01 0.1 1 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 z q q q q jc normalized transient thermal resistance pulse width (s) figure 11: normalized maximum transient thermal imp edance (note f) d=t on /t t j,pk =t c +p dm .z q jc .r q jc r q jc =1.2 c/w in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse single pulse t on t p d www.freescale.net.cn 4/6 AOD6N50 500v,5.3a n-channel mosfet
typical electrical and thermal characteristics 0 30 60 90 120 0 25 50 75 100 125 150 power dissipation (w) t case (c) figure 12: power de-rating (note b) 0 1 2 3 4 5 6 0 25 50 75 100 125 150 current rating i d (a) t case (c) figure 13: current de-rating (note b) 0 100 200 300 400 500 0.001 0.01 0.1 1 10 100 1000 power (w) pulse width (s) figure 14: single pulse power rating junction - to - ambient (note g) t j(max) =150 c t a =25 c 0 30 60 90 120 0 25 50 75 100 125 150 power dissipation (w) t case (c) figure 12: power de-rating (note b) 0 1 2 3 4 5 6 0 25 50 75 100 125 150 current rating i d (a) t case (c) figure 13: current de-rating (note b) 0 100 200 300 400 500 0.001 0.01 0.1 1 10 100 1000 power (w) pulse width (s) figure 14: single pulse power rating junction-to-am bient (note g) t j(max) =150 c t a =25 c 0.0001 0.001 0.01 0.1 1 10 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 z q q q q ja normalized transient thermal resistance pulse width (s) figure 15: normalized maximum transient thermal imp edance (note g) d=t on /t t j,pk =t a +p dm .z q ja .r q ja r q ja =55 c/w in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse single pulse t on t p d www.freescale.net.cn 5/6 AOD6N50 500v,5.3a n-channel mosfet
- + vdc ig vds dut - + vdc vgs vgs 10v qg qgs qgd charge gate charge test circuit & waveform - + vdc dut vdd vgs vds vgs rl rg vgs vds 10% 90% res istive switching test circuit & waveforms t t r d(on) t on t d(off) t f t off vdd vgs id - + vdc l vgs vds id bv i unclamped inductive switching (uis) test circuit & waveforms vds ar dss 2 e = 1/2 li ar ar - + vdc ig vds dut - + vdc vgs vgs 10v qg qgs qgd charge gate charge test circuit & waveform - + vdc dut vdd vgs vds vgs rl rg vgs vds 10% 90% res istive switching test circuit & waveforms t t r d(on) t on t d(off) t f t off vdd vgs id vgs rg dut - + vdc l vgs vds id vgs bv i unclamped inductive switching (uis) test circuit & waveforms ig vgs - + vdc dut l vds vgs vds isd isd diode recovery tes t circuit & waveforms vds - vds + i f ar dss 2 e = 1/2 li di/dt i rm rr vdd vdd q = - idt t rr ar ar www.freescale.net.cn 6/6 AOD6N50 500v,5.3a n-channel mosfet
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