gib1401 thru gib1404 vishay semiconductors formerly general semiconductor document number 88632 www.vishay.com 22-mar-02 1 ultrafast plastic rectifier reverse voltage 50 to 200v forward current 8.0a maximum ratings and thermal characteristics (t c = 25? unless otherwise noted) parameter symbol gib1401 gib1402 GIB1403 gib1404 unit maximum repetitive peak reverse voltage v rrm 50 100 150 200 v maximum rms voltage v rms 35 70 105 140 v maximum dc blocking voltage v dc 50 100 150 200 v maximum average forward rectified current at t c = 125? i f(av) 8.0 a peak forward surge current 8.3ms single half sine-wave superimposed i fsm 125 a on rated load (jedec method) typical thermal resistance (note 1) r jc 2.25 ?/w operating and storage temperature range t j , t stg ?5 to +150 ? electrical characteristics (t c = 25? unless otherwise noted) parameter symbol gib1401 gib1402 GIB1403 gib1404 unit maximum instantaneous i f = 4a, t j = 25? 0.900 forward voltage at: i f = 8a, t j = 25? v f 0.975 v i f = 4a, t j = 100? 0.800 i f = 8a, t j = 100? 0.895 maximum dc reverse current t c = 25? 5.0 at rated dc blocking voltage at: t c = 100? i r 150 a maximum reverse recovery time at t rr 35 ns i f = 0.5a, i r = 1.0a, irr = 0.25a typical junction capacitance at 4v, 1mh z c j 85 pf notes: (1) thermal resistance from junction to case mounted on heatsink features ?plastic package has underwriters laboratory flammability classification 94v-0 ?glass passivated chip junction ?low power loss ?low leakage current ?high surge capability ?superfast recovery time for high efficiency ?high temperature soldering in accordance with cecc 802 / reflow guaranteed mechanical data case: jedec to-263ab molded plastic body terminals: lead solderable per mil-std-750, method 2026 polarity: as marked mounting position: any weight: 0.05 oz., 1.35 g 0.380 (9.65) 0.411 (10.45) 0.320 (8.13) 0.360 (9.14) 0.591 (15.00) 0.624 (15.85) 1 2 0.245 (6.22) min k 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) k 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.021 (0.53) 0.014 (0.36) 0.110 (2.79) 0.140 (3.56) 0.090 (2.29) 0.110 (2.79) 0.047 (1.19) 0.055 (1.40) pin 1 pin 2 k - heatsink 0-0.01 (0-0.254) to-263ab dimensions in inches and (millimeters) 0.08 (2.032) 0.24 (6.096) 0.42 (10.66) 0.63 (17.02) 0.12 (3.05) 0.33 (8.38) mounting pad layout
gib1401 thru gib1404 vishay semiconductors formerly general semiconductor www.vishay.com document number 88632 2 22-mar-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) 0 25 50 75 150 125 100 1 100 10 peak forward surge current (a) number of cycles at 60 h z 0 6.0 8.0 12 10 0 25 50 75 100 125 150 average forward rectified current (a) case temperature ( c) 0.4 0.6 0.8 1.0 1.2 fig. 3 ?typical instantaneous forward characteristics 020 60 40 100 80 fig. 4 ?typical reverse leakage characteristics instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) 4.0 2.0 resistive or inductive load t c = 125 c 8.3ms single half sine-wave (jedec method) infinite heatsink mounting, t c free air rating, t a p.c.b. mounting 0.01 0.1 10 1 80 instantaneous forward current (a) t j = 125 c t j = 25 c reverse voltage (v) junction capacitance (pf) 0.1 1 10 100 100 1,000 10 0.01 0.1 10 1 100 t j = 100 c fig. 5 ?typical junction capacitance pulse width = 300 s 1% duty cycle t j = 125 c t j = 25 c t j = 125 c t j = 25 c f = 1.0 mh z vsig = 50mvp-p fig. 1 ?maximum forward current derating curve fig. 2 ?maximum non-repetitive peak forward surge current instantaneous forward voltage (v)
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