october 2006 rev 2 1/9 STTH3R02 ultrafast recovery diode main product characteristics features and benefits very low conduction losses negligible switching losses low forward and reverse recovery times high junction temperature description the STTH3R02 uses st's new 200 v planar pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. packaged in do-201ad, do-15, and smc, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. order codes i f(av) 3 a v rrm 200 v t j (max) 175 c v f (typ) 0.7 v t rr (typ) 16 ns part number marking STTH3R02 STTH3R02 STTH3R02rl STTH3R02 STTH3R02q STTH3R02 STTH3R02qrl STTH3R02 STTH3R02s 3r2s k a k a k a k k a a k a do-15 STTH3R02q smc STTH3R02s do-201ad STTH3R02 www.st.com
characteristics STTH3R02 2/9 1 characteristics to evaluate the conduction losses use the following equation: p = 0.68 x i f(av) + 0.04 i f 2 (rms) table 1. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i frm repetitive peak forward current (1) t p = 5 s, f = 5 khz 110 a i f(rms) rms forward current do-201ad / do-15 70 a smc 70 i f(av) average forward current, = 0.5 do-15 t lead = 50 c 3a do-201ad t lead = 90 c smc t c = 110 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 175 c t l maximum lead temperature for soldering during 10 s at 4 mm from case 230 c 1. on infinite heatsink with 10 mm lead length table 2. thermal parameters symbol parameter value unit r th(j-l) junction to lead lead length = 10 mm on infinite heatsink do-15 45 c/w do-201ad 30 r th(j-c) junction to case smc 20 table 3. static electrical characteristics symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 3 a t j = 125 c 3 30 v f (2) forward voltage drop t j = 25 c i f = 9 a 1.20 v t j = 25 c i f = 3 a 0.89 1.0 t j = 100 c 0.76 0.85 t j = 150 c 0.70 0.80 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 %
STTH3R02 characteristics 3/9 table 4. dynamic characteristics symbol parameter test conditions min. typ max. unit t rr reverse recovery time i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 24 30 ns i f = 1 a, di f /dt = -100 a/s, v r = 30 v, t j = 25 c 16 20 i rm reverse recovery current i f = 3 a, di f /dt = -200 a/s, v r = 160 v, t j = 125 c 3.5 4.5 a t fr forward recovery time i f = 3 a, di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 40 ns v fp forward recovery voltage i f = 3 a, di f /dt = 100 a/s, t j = 25 c 1.9 v figure 1. peak current versus duty cycle figure 2. forward voltage drop versus forward current (typical values) 0 20 40 60 80 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i m (a) t d =tp/t tp i m t =tp/t tp i m p = 5 w p = 5 w p = 3 w p = 3 w p = 10 w p = 10 w 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 i fm (a) t j =25c t j =150c v fm (v) figure 3. forward voltage drop versus forward current (maximum values) figure 4. relative variation of thermal impedance junction to ambient versus pulse duration - do-201ad (epoxy printed circuit board fr4, e cu =35m) 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 i fm (a) t j =25c t j =150c v fm (v) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse do-201ad l leads =10mm t p (s)
characteristics STTH3R02 4/9 figure 5. relative variation of thermal impedance junction to ambient versus pulse duration - do-15 (epoxy printed circuit board fr4, e cu =35m) figure 6. relative variation of thermal impedance junction to ambient versus pulse duration - smc (epoxy printed circuit board fr4, e cu =35m) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse do-15 l leads =10mm t p (s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse smc s cu =1cm2 t p (s) figure 7. junction capacitance versus reverse applied voltage (typical values) figure 8. reverse recovery charges versus di f /dt (typical values) 1 10 100 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v) 0 10 20 30 40 50 60 70 80 10 100 1000 q rr (n c ) i f =3a v r =160v t j =125c t j =25c di f /dt(a/s) figure 9. reverse recovery time versus di f /dt (typical values) figure 10. peak reverse recovery current versus di f /dt (typical values) 0 10 20 30 40 50 60 10 100 1000 t rr (ns) i f =3a v r =160v t j =125c t j =25c di f /dt(a/s) 0 1 2 3 4 5 6 7 8 10 100 1000 i rm (a) i f =3a v r =160v t j =125c t j =25c di f /dt(a/s)
STTH3R02 ordering information scheme 5/9 2 ordering information scheme figure 11. dynamic parameters versus junction temperature figure 12. thermal resistance junction to ambient versus copper surface under each lead for do-15 and do-201ad (epoxy printed circuit board fr4, e cu = 35m) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;i rm [t j ] /q rr ;i rm [t j =125 c ] i rm q rr i f =3a v r =160v t j (c) r th(j-a) (c/w) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 do-201ad do-15 s cu (cm2) figure 13. thermal resistance versus copper surface under each lead for smc (epoxy printed circuit board fr4, e cu = 35m) figure 14. thermal resistance versus lead length for do-201ad package 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r th(j-a) (c/w) smc s cu (cm2) 0 10 20 30 40 50 60 70 80 90 100 5 10152025 r th (c/w) do-201ad r th(j-a) r th(j-l) l leads (mm) stth 3 r 02 xxx ultrafast switching diode average forward current 3 = 3 a 02 = 200 v blank = do-201 in ammopack rl = do-201 in tape and reel q = do-15 in ammopack qrl = do-15 in tape and reel s= smc in tape and reel model r package repetitive peak reverse voltage
package information STTH3R02 6/9 3 package information epoxy meets ul94, v0 cooling method: by conduction (c) table 5. do-201ad dimensions ref. dimensions millimeters inches min. max. min. max. a 9.50 0.374 b 25.40 1.000 c 5.30 0.209 d 1.30 0.051 e 1.25 0.049 notes 1 - the lead diameter ? d is not controlled over zone e 2 - the minimum length which must stay straight between the right angles after bending is 0.59"(15mm) table 6. do-15 dimensions ref. dimensions millimeters inches min. max. min. max. a 6.05 6.75 0.238 0.266 b 2.95 3.53 0.116 0.139 c 26 31 1.024 1.220 d 0.71 0.88 0.028 0.035 ?c ?d a ee note 2 note 1 note 1 bb d b a cc
STTH3R02 package information 7/9 figure 15. smc footprint (dimensions in mm) in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 7. smc dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 d 5.55 6.25 0.218 0.246 l 0.75 1.60 0.030 0.063 e c l e2 e1 d a1 a2 b 4.25 8.65 2.20 3.30 2.20
ordering information STTH3R02 8/9 4 ordering information 5 revision history part number marking package weight base qty delivery mode STTH3R02 STTH3R02 do-201ad 1.16 g 600 ammopack STTH3R02rl STTH3R02 do-201ad 1.16 g 1900 tape and reel STTH3R02q STTH3R02 do-15 0.4 g 1000 ammopack STTH3R02qrl STTH3R02 do-15 0.4 g 6000 tape and reel STTH3R02s 3r2s smc 0.243 g 2500 tape and reel date revision description of changes 03-may-2006 1 first issue 10-oct-2006 2 added smc package
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