*customer: specifica t ion item t o p v i e w le d model ssc-ygurht 81 1 - b s [ content s] 1 . feat ur es - --- -- -- --- -- -- -- --- -- -- --- -- -- -- --- -- -- --- -- -- -- --- -- -- --- -- 2 2 . application --------------- ----------------- ----------------- ------------ 2 3. abs o lute maximu m ratin g s ------------ ------ ------------------------ 2 4. electro-optical characteristics --------------------------- ------------ 3 5. rank of yg urht81 1- b s ------------- -------------------------------- 4 6 . soldering p r ofile - --- --- --- --- --- -- --- --- --- --- --- -- --- --- --- --- --- -- 5 7 . ou tline di mension -- - --- -- --- -- -- --- - --- -- --- -- --- -- - --- -- --- -- -- 6 8 . packing ----------- ------ - --------- ------ - --------- ------ - --------- -- 6 9. reel pac k i ng s t ruc t ure ---------------------------------- --- ----------- 7 10. prec aution for us e ----------------------- -------------- ----------------- 8 11. handling of silicone resi n leds - - - ---------------------- -------------- 9 cust o mer che c ked by approve d by supplier drawn by che c ked by approve d by seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 1/ 10 - ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4)
1. features pb-free refl o w so ld erin g ap plicati on rohs com p li ant upper s u rfac e black col o re d smt p a ckage and co lorl ess clear w i n d o w suit abl e for all smt assembl y meth ods ; suit able for al l sol derin g metho d s encap s ulati n g resin : silico n e resin 2. application led d o t matrix indoor a nd o u t door dis p la ys lcd backlights etc. r, y/g ? displ a y s automotive indicator 3. absolute maximum ratings *1 ( t a =25 o c) v a lue param e t e r s y m b o l y e llowish gre en red unit powe r di ssi p a tion p d 9 0 9 0 m w forwa r d current i f 3 0 3 0 m a forwa r d pea k surg e cu rrent i fm *2 9 0 9 0 m a reve rse v o lt age v r 5 v ope r ating t e mperature t opr -30 ~ +8 5 oc s t orage t e m perature t stg -40 ~ +1 00 oc *1 car e i s to be t a ken that pow er di ssi p a tion doe s no t ex ceed the abso l ute m a x i mum rating o f th e produ ct. *2 i fm w a s measur e d at t w 1mse c of p u lse w i d t h and d 1/10 o f d u ty r a tio . seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 g g t g y v x w g t ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4)
4. electro-optical characteristics ( t a = 25oc ) param e ter symbo l con d i t i o n m i n t y p m a x u n i t y e llowish gre en 1 . 9 2 . 1 2 . 5 forwa r d v o lt age red v f i f =20ma 1 . 5 1 . 9 2 . 3 v y e llowish gre en - - 1 reve rse cu rrent red i r v r =5v - - 1 a y e llowish gre en 3 0 5 0 7 0 lumin an ce in tensity *1 red i v i f =20ma 2 0 3 0 4 0 mcd y e llowish gre en 5 6 5 5 7 0 5 7 5 domi nant w a vel ength red d i f =20ma 6 3 5 6 4 0 6 4 5 nm y e llowish gre en - 2 0 - s pectral ban d wi d t h red ? i f =20ma - 3 0 - nm v i ewin g angl e *2 r, g 2 ? i f =40ma to t a l - 1 2 0 - d e g . *1 the lumin ous intensi t y i v w a s mea s ured at the pea k of the sp atial p a tter n w h ic h may not be aligned w i th the mechani cal ax is o f the led p a ckage . l u minou s intensi t y m easuremen t al l o w ance is 10 % *2 2 ? i s the o f f-ax i s w here the lumino us i n ten s i t y is 1/2 o f the pea k in ten s i t y . seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 3/ 10 - [note ] all measure m ent s w e re made u nder the st andardi zed env ironment of ssc.
5 . rank of ygurht 8 1 1-bs 1 ) ra n k na m e x 1 x 2 x 3 x 4 i v - re d i v - y g d r e d d y g 2) t e s t c o n d i t i o n ry g if 2 0 2 0 m a vr 1 0 1 0 v 3 ) l u m i no u s i n t e ns i t y [ i v ] m i n m ax m i n m ax n 2 0 2 5 n 30 40 o 2 5 3 0 o 40 50 p 3 0 3 5 p 50 60 q 3 5 4 3 q 60 70 4 ) d o m i na n t w a v e l e ng t h [ d] m i n m ax m i n m ax a 6 35 645 a 5 6 5 56 7 b5 6 7 5 6 9 c5 6 9 5 7 1 d 57 1 5 7 3 e5 7 3 5 7 5 x 56 5 5 7 5 5) f o r w ar d v o l t ag e [ v f ] mi n m a x m i n m a x 1. 5 2 . 3 1 . 9 2 . 5 v 6) r e ve r s e c u r r e n t [ i r ] mi n m a x m i n m a x -1 - 1 u a un i t mc d va l u e ra n k na m e yg un i t re v e r s e vo l t a g e ra n k na m e r pa r a m e t e r s y m b o l f o rw a r d c u rr en t yg un i t ry g un i t un i t nm r ra n k na m e g ra n k na m e yg seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 4/ 10 -
6. soldering profile (1) reflow soldering conditi ons / profile (lead free solder) (2) hand soldering conditions do not excee d 4 se con d s at maximum 315o c und er sold eri ng iro n . (3) the encap sulated material of the le ds is silicon e. precautions should be t a ken to avoid the strong p r essure on t he encap sulated p a rt. so when using the ch ip mounter , the picking up nozzle t hat does no t af fect the silicone resign should b e used. note : in case that the solder e d product s are reuse d in sold e r ing proc ess, w e don?t gu arant ee the prod uct s . seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 5/ 10 - ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4) pre-heating 200 180 15 0 ~ 0 temp [ c ] 22 0 240 260 ri s i n g 5 c / s e c tm : r eflow mac h i n e s e tti ng temp (max 30 sec . ) ts : s urf a c e t emp of pcb (min) ts : s urf a c e t emp of pcb (max) ts : s urf a c e t emp of pc b ( r e commen d ) cooling -5 c / s ec ti me [hr]
seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 6/ 10 - ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4) 8. packing 7. out line dimension (1) qu an tity : 2 000 p c s/reel (2) cu m u lativ e t o leran ce : c u m u lativ e t o leran c e/1 0 p itch e s to b e 0. 2m m (3 ) ad hesi on s t re ngt h of c o ver t a pe : ad hesi o n st re n g t h t o b e 0. 1 - 0 . 7 n w h en t h e c ove r t a pe i s t u r n e d of f fr om t h e carrier tape at t h e a ngle of 10o to the carrier t a pe ( 4 ) packa g e : p/ n, manufacturin g dat a c o de n o . a n d q ua nt i t y to be indicated on a dam p p ro of pac k a g e ( t o leran ce: 0.2, unit: mm ) ( t o leran ce: 0.2, unit: mm ) 3.83 0 . 1 5 8 0.1 1.75 0.1 3.5 0.1 8 1.0 0.1 3.1 0.1 2.0 0.05 4.0 0.1 1.55 0 .05 0.22 0.05 2.22 0.1 0.2 2. 0 60 30 -3 +0 0 . 2 la ble 11 .4 0.3 9.0 0 . 1 180 13 10 22 uppe r surfa c e black 2 1 3 4 packa g e mar k in g (ca t ho de ) yellowis h /gre en catho d e yellowish/green anode red catho d e red anode 1 4 2 3 ri gh t view front v i ew re ar view packa ge outline s c i rc ui t d i agr a m recommended so l d er p a d
9 . reel packing s t ructure xxxxxx 1 outer box structure p a rt num ber : lot number : x x x x xx xx xx quantity : xxxx se ou l s e mi c o n duc tor c o ., lt d . xxxxxx a roh s c a b xxxx side 24 5 7i nch 220 14 2 si ze ( m m ) ma te rial : p a pe r(sw3b(b)) s e oul se m i c onduct o r co. , ltd. ty pe b c 1 aluminum vinyl bag reel p a rt num ber : lot number : x x x x xx xx xx q uant ity : x x x x humidit y indic a tor xxxx de si p a k xxxx lot number : xxxxxxxxxx se o u l se mico nductor co. , l t d. xxxxxx p a rt numb e r : q u an t i ty : xxxx seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 7/ 10 - ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4)
10. precau tion for use (1) s t orage in orde r to a v oid the ab sorptio n of mo isture, it is re comm end ed to store in a dry box (o r a desi c cato r) with a de siccant. otherwise, to st ore them in the followin g enviro n ment is r e c o mme n ded . t e mperatu r e : 5oc ~30 o c humidity : maximum 65% hr (2) attention af ter op en. led is corre s po nd to smd, whe n led be solde r e d dip, interfaci a l sep a ratio n may af fect the light tran smission ef fici en cy , causi ng the light intensity to drop. attention in followed; a. af ter open ed and m ount ed the sol d e r i ng sh all be q u ickly . b. keeping of a fraction t e mperature : 5 ~ 40 oc hu midity : less than 30 % (3) in the ca se of more than 1 wee k p a ssed af te r openin g or cha nge colo r of indicator on desi c cant, co mpon ent s sh all be dri ed 1 0 -1 2h r . at 60 5o c. (4) in the case of that the compo nent s is humide d , the comp one nt s shall b e dri e d ; 24hr at 80 5 o c or 1 2 hr at 100 5o c. (5) a n y me ch anical force o r any ex ce ss vibration sh al l not be acce pted to a pply duri ng co olin g pro c e s s to no rmal temp era t ure af ter sold erin g. (6) q u ick coo ling sh all be a v oided. (7) com pon e n t s shall not be mou n ted o n wa rpe d dire ction of l/f . (8) anti radio a ctive ray de sign i s not co nsid ered for the produ ct s. (9) thi s device sh ould no t be used in any type of fl uid su ch as wate r , oil, organi c solvent etc. whe n wa shi n g is re quired, ip a shoul d be used. (10 ) wh en th e leds a r e ill uminatin g, op eratin g cu rre n t shoul d be deci ded af te r con s ide r in g th e ambie n t maximum tempe r ature. (1 1) leds m u st b e sto r e d to maint a in a cl ean atmo sph e re. if the leds a r e st ore d for 3 mo nths or more af ter being shipp e d from ssc, a seale d cont aine r with a nitroge n atmosphe re sh ould be u s ed fo r s t or ag e . (12 ) the le ds mu st be sol dered withi n seven d a ys a f ter ope ning t he moi s ture -p roof p a ckin g. (13 ) re p a ck unu sed p r od uct s with anti-moi s ture p a cki ng, fold to close any o penin g and then store in a dry place. (14 ) the a p p earan ce an d spe c ification s of t he produ ct may be modified for impro v ement witho u t notice. seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 8/ 10 - ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4)
1 1 . handling of silicone resin le ds (1) during proc essing, mech a n ical stress on the surfac e should b e minimi zed as much as possible. sh ar p object s of al l t y pes sho u ld n o t be use d to pier ce the seal ing compo und. (2) in genera l , leds sho u ld o n l y be ha nd led from the side. b y the w a y , thi s also app lies t o leds w i tho u t a silico ne se ala n t, since the surface can a l so b e come scratch ed. (3) w hen p o p u l ating bo ards i n smt productio n , there ar e ba sicall y no restri ctions reg a rdi n g the form of th e pick an d plac e nozzle, e x c ept that mechan ica l pressu re on the surface of the resi n must be prev ented. t h is is assured b y ch oosi ng a pick an d plac e nozzle w h ic h is larger tha n the led? s reflect o r area. (4) silico ne d i f f ers from materials conv enti o nall y used for the manufact u r i ng of leds. t hese co nditi on s must be co nsi dere d dur ing t he h and lin g of such d e vices. comp ar ed to s t andar d enc ap sulant s, sil i con e i s gen eral l y s o f t er , and the surfa c e is more like l y to attract dus t. as mention ed previo usl y , the increas ed se ns itivit y to d u st requires s peci a l care durin g proc essi ng. in cases w here a mi nimal level of dirt an d dust p a rticl e s cannot be guar antee d, a suit abl e cle ani ng sol u tion mu st be appl ied to the surface af ter the solder in g of compon ent s. (5) ssc sugg e s t s using iso p rop y l alc o h o l for cl eani ng. in ca se other solv en t s are used, it must be assur ed that these s o lvent s d o not dissolv e the p a ckage or res i n. ultra s o n ic cle aning i s not reco mmen ded . ultr asoni c cl eanin g may cause dam age to the led. seou l s e mic o nduct o r co ., l t d. 148- 29 kasan- don g , keu m chun- gu, seoul, 153- 023, kor ea phone : 82- 2- 210 6 - 7305~6 - 9/ 10 - ssc-ygur h t81 1 -bs ssc-q p- 040 1-0 6 ( r ev .0 .4)
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