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| 1996,1999 data sheet bipolar analog integrated circuit m pc2797gr frequency down converter for vhf to uhf band tv/vcr tuner description the m pc2797gr is a silicon monolithic ic designed for tv/vcr tuner applications. this ic consists of a double balanced mixer (dbm), local oscillator, preamplifier for precscaler operation, if amplifier, regulator, uhf/vhf switching circuit, and so on. this one-chip ic covers a wide frequency band from vhf to uhf bands. this ic is packaged in 20-pin ssop (shrink small outline package) suitable for surface mounting. features ? vhf to uhf bands operation. ? low distortion cm: vhf (@f rf = 470 mhz) 96 db m uhf (@f rf = 890 mhz) 92 db m ? supply voltage : 9 v ? packaged in 20-pin ssop suitable for surface mounting ordering information part number package package style m pc2797gr-e1 20-pin plastic ssop (225 mil) embossed tape 12 mm wide. 2.5 k/reel. pin 1 indicates pull-out direction of tape for evaluation sample order, please contact your local nec office. (part number for sample order: m pc2797gr) document no. p11889ej3v0ds00 (3rd edition) date published october 1999 n cp(k) printed in japan caution electro-static sensitive device the mark shows major revised points. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information.
m pc2797gr 2 data sheet p11889ej3v0ds00 pin configuration (top view) 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. uhf osc collector uhf osc base uhf osc base uhf osc collector ub osc output gnd vhf osc base vhf osc base vhf osc collector reg if output v cc mix output mix output vhf rf input vhf rf input gnd uhf rf input uhf rf input (tr. 1) (tr. 2) (tr. 1) (tr. 2) (tr. 1) (tr. 2) (tr. 1) 1 10 20 11 internal block diagram 20 19 18 17 16 15 14 13 12 11 reg. 12345678910 if amp v osc u osc m pc2797gr 3 data sheet p11889ej3v0ds00 pin explanation pin voltage typ. pin no. symbol above: vhf mode function and explanation equivalent circuit below: uhf mode 1 uosc 6.90 collector pin of uhf oscillator. collector assemble lc resonator with 2 (tr. 1) 6.25 pin through capacitor ~ 1 pf to oscillate with active feedback loop. 2 uosc 6.00 base pin of uhf oscillator base (tr.2) with balance amplifier. connected 3.90 to lc resonator through feedback capacitor ~ 300 pf . 3 uosc 6.00 base pin of uhf oscillator base (tr. 1) with balance amplifier. 3.90 connected to lc resonator through feedback capacitor ~ 300 pf. 4 uosc 6.90 collector pin of uhf oscillator collector with balance amplifier. assemble (tr. 2) lc resonator with 3 pin through capacitor ~ 1 pf to oscillate with 6.25 active feedback loop. double balanced oscillator with transistor 1 and transistor 2. 5 ub switching pin for vhf or uhf operation. 9.0 vhf operation = open uhf operation = 9.0 v 6 osc 5.85 uhf and vhf oscillator output output pin. in case of f/s tuner application, connected pll symthesizer ics input pin. grounded through 1.5 k w 5.85 resistor. 7 gnd 0.0 gnd pin of vhf and uhf 0.0 oscillator. 8 vosc 3.50 base pin of vhf oscillator. base grounded through capacitor ~ (tr. 1) 5.90 10 pf. 9 vosc 3.50 base pin of vhf oscillator. base assemble lc resonator with (tr. 2) 5.90 10 pin to oscillate with active feedback loop. 10 vosc 6.20 collector pin of vhf oscillator. collector connected to lc resonator (tr. 1) 6.90 through feedback capacitor ~ 3 pf. 6 y t from osc * external element reg 1.5 k 9 8 reg 10 4 2 1 3 5 m pc2797gr 4 data sheet p11889ej3v0ds00 pin voltage typ. pin no. symbol above: vhf mode function and explanation equivalent circuit below: uhf mode 11 reg 6.90 monitor pin of regulator output 6.90 voltage. 12 if output 2.80 if output pin of vhf-uhf band functions. 2.80 13 v cc 9.0 power supply pin for vhf- 9.0 uhf band functions. 14 mix 7.10 vhf and uhf mix output pins . output1 7.05 these pins should be 15 mix 7.10 equipped with tank circuit to output2 7.05 adjust intermediate frequency. 16 vrf input 3.10 bypass pin for vhf mix input. (bypass) grounded through capacitor. 3.10 17 vrf input 3.10 vrf signal input pin from antenna. 3.10 18 gnd 0.0 gnd pin of mix, if amplifier and regulator. 0.0 19 urf input 3.10 bypass pin for uhf mix input. (bypass) grounded through capacitor. 3.10 20 urf input 3.10 urf signal input pin from antenna. 3.10 12 13 17 y t from vhf osc 16 13 14 15 19 y t from uhf osc 20 13 14 15 m pc2797gr 5 data sheet p11889ej3v0ds00 absolute maximum ratings (t a = 25 c unless otherwise specified) parameter symbol condition rating unit supply voltage 1 v cc 11.0 v supply voltage 2 ub 11.0 v power dissipation p d t a = 75 c *1 500 mw operating ambient temperature t a C40 to +75 c storage temperature t stg C60 to +150 c *1 mounted on 50 50 1.6 mm double copper epoxy glass board. recommended operating range parameter symbol min. typ. max. unit supply voltage 1 v cc 8.0 9.0 10.0 v supply voltage 2 ub 8.0 9.0 10.0 v operating ambient temperature t a C20 +25 +75 c m pc2797gr 6 data sheet p11889ej3v0ds00 electrical characteristics (t a = 25 c, v cc = 9 v, f if = 45 mhz) parameter symbol test conditions min. typ. max. unit circuit current 1 i cc 1 @vhf, no input signal *1, 2 31 38 45 ma circuit current 2 i cc 2 @uhf, no input signal *1, 2 31 38 45 ma conversion gain 1 cg1 f rf = 55 mhz, p rf = C30 dbm 18.5 22.0 25.5 db p osc = C10 dbm *3 conversion gain 2 cg2 f rf = 200 mhz, p rf = C30 dbm 18.5 22.0 25.5 db p osc = C10 dbm *3 conversion gain 3 cg3 f rf = 470 mhz, p rf = C30 dbm 18.5 22.0 25.5 db p osc = C10 dbm *3 conversion gain 4 cg4 f rf = 470 mhz, p rf = C30 dbm 24.5 28.0 31.5 db p osc = C10 dbm *3 conversion gain 5 cg5 f rf = 890 mhz, p rf = C30 dbm 24.5 28.0 31.5 db p osc = C10 dbm *3 noise figure 1 nf1 f rf = 55 mhz, p osc = C10 dbm *4 11.0 14.0 db noise figure 2 nf2 f rf = 200 mhz, p osc = C10 dbm *4 11.0 14.0 db noise figure 3 nf3 f rf = 470 mhz, p osc = C10 dbm *4 11.0 14.0 db noise figure 4 nf4 f rf = 470 mhz, p osc = 0 dbm *4 9.5 12.5 db noise figure 5 nf5 f rf = 890 mhz, p osc = 0 dbm *4 10.0 13.0 db maximum output power 1 p o (sat) 1f rf = 55 mhz, p rf = 0 dbm 7.0 10.0 dbm p osc = C10 dbm *3 maximum output power 2 p o (sat) 2f rf = 200 mhz, p rf = 0 dbm 7.0 10.0 dbm p osc = C10 dbm *3 maximum output power 3 p o (sat) 3f rf = 470 mhz, p rf = 0 dbm 7.0 10.0 dbm p osc = C10 dbm *3 maximum output power 4 p o (sat) 4f rf = 470 mhz, p rf = 0 dbm 7.0 10.0 dbm p osc = C10 dbm *3 maximum output power 5 p o (sat) 5f rf = 890 mhz, p rf = 0 dbm 7.0 10.0 dbm p osc = C10 dbm *3 *1 no resistance of osc output *2 by measurement circuit 1 *3 by measurement circuit 2 *4 by measurement circuit 3 m pc2797gr 7 data sheet p11889ej3v0ds00 standard characteristics (reference values) (t a = 25 c, v cc = 9 v) parameter symbol test conditions value for reference unit 1 % cross-modulation distortion 1 cm1 f des = 55 mhz, f undes = f des + 6 mhz, 100 db m p des = C30 dbm, f if = 45 mhz, p osc = C10 dbm, am 100 khz, 30 % modulation, des/cm = 46 dbc *1 1 % cross-modulation distortion 2 cm2 f des = 200 mhz, f undes = f des + 6 mhz, 100 db m p des = C30 dbm, f if = 45 mhz, p osc = C10 dbm, am 100 khz, 30 % modulation, des/cm = 46 dbc *1 1 % cross-modulation distortion 3 cm3 f des = 470 mhz, f undes = f des + 6 mhz, 96 db m p des = C30 dbm, f if = 45 mhz, p osc = C10 dbm, am 100 khz, 30 % modulation, des/cm = 46 dbc *1 1 % cross-modulation distortion 4 cm4 f des = 470 mhz, f undes = f des + 6 mhz, 94 db m p des = C30 dbm, f if = 45 mhz, p osc = C10 dbm, am 100 khz, 30 % modulation, des/cm = 46 dbc *1 1 % cross-modulation distortion 5 cm5 f des = 890 mhz, f undes = f des + 6 mhz, 92 db m p des = C30 dbm, f if = 45 mhz, p osc = C10 dbm, am 100 khz, 30 % modulation, des/cm = 46 dbc *1 *1 by measurement circuit 4 m pc2797gr 8 data sheet p11889ej3v0ds00 typical characteristics i cc vs. v cc i cc - circuit current - ma v cc - supply voltage - v 50 45 40 35 30 25 20 15 10 5 0 024681012 vhf mode no input signal * 1 measurement circuit 1 i cc vs. v cc i cc - circuit current - ma v cc - supply voltage - v 50 45 40 35 30 25 20 15 10 5 0 024681012 uhf mode no input signal * 1 measurement circuit 1 p out vs. p in p out - output power - dbm p in - input power - dbm 15 ?0 ?0 v cc = 9 v f rf = 470 mhz f if = 45 mhz p osc = ?0 dbm measurement circuit 2 p out vs. p in p out - output power - dbm p in - input power - dbm 15 ?0 10 v cc = 9 v f rf = 890 mhz f if = 45 mhz p osc = ?0 dbm measurement circuit 2 cm vs. f rf cm - 1 % cross-modulation distortion - db f rf - input frequency - mhz 10 5 ?0 ?0 ?0 0 10 5 0 ? ?0 ?5 cg, nf vs. f rf nf - noise figure - db cg - conversion gain - db f rf - input frequency - mhz 30 0 1 000 v cc = 9 v f if = 45 mhz p rf = ?0 dbm p osc = ?0 dbm p osc = 0 dbm (@uhf, nf) measurement circuit 2, 3 200 400 600 800 25 20 15 10 5 0 t a = 25 ? t a = 75 ? t a = ?0 ? t a = 25 ? t a = 75 ? t a = ?0 ? 0 ? ?0 ?5 ?0 ?0 ?0 0 10 t a = 25 ? t a = 75 ? t a = ?0 ? t a = 25 ? t a = 75 ? t a = ?0 ? t a = 25 ? t a = 75 ? t a = ?0 ? 105 0 1 000 v cc = 9 v f undes = f rf + 6mhz f if = 45 mhz p rf = ?0 dbm p osc = ?0 dbm measurement circuit 4 200 400 600 800 100 95 90 85 80 t a = 25 ? t a = 75 ? t a = ?0 ? m *1 external resistor is removed. m pc2797gr 9 data sheet p11889ej3v0ds00 standard characteristics (by application circuit example) cg, nf vs. f rf cg - conversion gain - db nf - noise figure - db f rf - input frequency - mhz 0 0 v cc = 9 v f if = 45 mhz p rf = ?0 dbm 10 20 30 40 200 400 600 800 1 000 p out vs. p in p out - output power - dbm p in - input power - dbm ?0 ?0 v cc = 9 v f if = 45 mhz ?0 0 10 20 ?0 ?0 ?0 0 10 f rf = 802 mhz f rf = 362 mhz cm vs. f rf cm - 1 % cross modulation distortion - db f rf - input frequency - mhz 80 0 v cc = 9 v f undes = f rf + 6 mhz f if = 45 mhz p rf = ?0 dbm 90 100 110 200 400 600 800 1 000 m 6 channel beat p out - output power - dbm p in - input power - dbm ?0 ?0 v cc = 9 v f p = 83.25 mhz f s = 87.75 mhz f osc = 129 mhz ?0 0 10 ?0 ?0 ?0 0 ?0 ?0 ?0 ?0 ?0 v tu vs. f osc v tu - tuning voltage - v 0 0 10 20 30 200 400 600 800 1 000 5 15 25 u v l v h f osc - osc frequency - mhz v cc = 9 v f if = 45 mhz m pc2797gr 10 data sheet p11889ej3v0ds00 input impedance (by measurement circuit 5) m pc2797gr 11 data sheet p11889ej3v0ds00 output impedance (by measurement circuit 5) m pc2797gr 12 data sheet p11889ej3v0ds00 measurement circuit 1 measurement circuit 2 reg 1000 pf 1000 pf 1000 pf 20t 27 pf 1000 pf 1000 pf 1000 pf 1000 pf v cc (9v) 20 19 18 17 16 15 14 13 12 11 12345678910 1000 pf 1000 pf 1000 pf 1000 pf 1000 pf ub(9v) open open 1000 pf open open open open 5pin voltage vhf uhf open 9v reg 1000 pf 1000 pf 1000 pf 20t 27 pf 1000 pf 1000 pf 1000 pf 1000 pf 20 19 18 17 16 15 14 13 12 11 12345678910 1000 pf 1000 pf 1000 pf 1000 pf open 1000 pf 5pin voltage vhf uhf open 9v sg1 uhf vhf spectrum analyzer vhf uhf sg2 1.5k 1000 pf m pc2797gr 13 data sheet p11889ej3v0ds00 measurement circuit 3 measurement circuit 4 reg 1000 pf 1000 pf 1000 pf 20t 27 pf 1000 pf 1000 pf 1000 pf 1000 pf 20 19 18 17 16 15 14 13 12 11 12345678910 1000 pf 1000 pf 1000 pf 1000 pf open 1000 pf 5pin voltage vhf uhf open 9v noise source uhf vhf vhf uhf sg1 noise meter bpf v cc (9v) 1000 pf ub(9v) 1.5k reg 1000 pf 1000 pf 1000 pf 20t 27 pf 1000 pf 1000 pf 1000 pf 1000 pf 20 19 18 17 16 15 14 13 12 11 12345678910 1000 pf 1000 pf 1000 pf 1000 pf open 1000 pf 5pin voltage vhf uhf open 9v mix pad uhf vhf vhf uhf sg3 sg1 desire sg2 undesire spectrum analyzer 1.5k 1000 pf m pc2797gr 14 data sheet p11889ej3v0ds00 measurement circuit 5 reg 1000 pf 1000 pf 1000 pf 1000 pf 1000 pf 1000 pf 1000 pf v cc (9v) 20 19 18 17 16 15 14 13 12 11 12345678910 1000 pf 1000 pf 1000 pf 1000 pf 1000 pf ub(9v) open open 1000 pf open 5pin voltage vhf uhf open 9v network analyzer m pc2797gr 15 data sheet p11889ej3v0ds00 application circuit example the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 20 19 18 17 16 15 14 13 12 11 reg. urf in vrf in v cc if out 1 000 pf 1 000 pf 1 000 pf 1 000 pf 20t 1 000 pf 1 000 pf 1 000 pf 27pf ub 1 pf 3 pf 1 pf 360 pf 360 pf 6 pf 47 k 2t 1t363 0.5 pf 47 k v tu 1.5 k 1 000 pf osc out 1 000 pf v tu 47 k 47 k 10 pf 200 pf 3 pf 1t363 2 47 k 82 pf 1 000 pf 47 k 1 000 pf 2.7 k 1 000 pf 7t 75 12345678910 hb lb 8 pf 4t 4 pf m pc2797gr 16 data sheet p11889ej3v0ds00 illustration of the evaluation board for application circuit example (surface) vrf in urf in 1 ulo in pc2797gr if out vlo in osc out m a b 1000p m pc2797gr 17 data sheet p11889ej3v0ds00 illustration of the evaluation board for application circuit example (back side) 1000p 4p 1p 1p 3p 47k 360p 1t363 1000p 1000p 360p 2t 1000p 27p 20t 47k 1000p v cc 1000p 1000p 1000p 2.7k 1000p represents cutout 1000p 47k 47k 4t 200p 10p 3p 75 47k 1.5k 82p 47k 6p 8p 1t363 2 1000p 7t v tu ub lb hb a b 0.5pf m pc2797gr 18 data sheet p11889ej3v0ds00 package dimensions 20 pin plastic ssop (225 mil) (unit: mm) 20 detail of lead end 1.8 max. 3? +7? ?? 0.65 0.10 m 0.15 0.5 0.2 11 110 6.7 0.3 1.5 0.1 0.1 0.1 0.22 +0.10 ?.05 0.575 max. 0.15 +0.10 ?.05 6.4 0.2 4.4 0.1 1.0 0.2 note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition. m pc2797gr 19 data sheet p11889ej3v0ds00 note on correct use (1) observe precautions for handling because of electro-static sensitive devices. (2) form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation). (3) keep the track length of the ground pins as short as possible. (4) a low pass filter must be attached to v cc line. (5) a matching circuit must be externally attached to output port. recommended soldering conditions the following conditions (see table below) must be met when soldering this product. please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e). m pc2797gr soldering process soldering conditions infrared ray reflow peak packages surface temperature: 235 ?c or below, reflow time: 30 seconds or below (210 ?c or higher), number of reflow process: 3, exposure limit *1 : none vps peak packages surface temperature: 215 ?c or below, reflow time: 40 seconds or below (200 ?c or higher), number of reflow process: 3, exposure limit *1 : none partial heating method terminal temperature: 300 ?c or below, flow time: 3 seconds or below, exposure limit * 1 : none *1 exposure limit before soldering after dry-pack package is opened. storage conditions: 25 ?c and relative humidity at 65 % or less. caution do not apply more than single process at once, except for partial heating method. symbol ir35-00-3 vp15-00-3 m pc2797gr nesat (nec silicon advanced technology) is a trademark of nec corporation. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. nec corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated quality assurance program for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. m7 98.8 |
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