? e97223-te sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. driver amplifier for transmission CXG1027TM absolute maximum ratings (ta=25 ?) supply voltage v dd 6v operating temperature topr ?5 to +85 ? storage temperature tstg ?5 to +150 ? allowable power dissipation p d 550 mw voltage between gate and source v gso 15 v drain current 150 ma operating condition supply voltage v dd 3.4 v v gg 0.2 v description the CXG1027TM is a two-stage driver amplifier for 800 mhz and 1.5 ghz pdc. this is used to amplify the transmission-side power of the rf signal. features ultraminiature package (10 pin tssop) low voltage operation : 2.9 v (min.) low current consumption : 45 ma (typ.) high gain : 27.5 db (typ.) (for 1.5 ghz) 29.5 db (typ.) (for 800 mhz) low distortion (adjacent channel leak power ratio) : ?0 dbc (typ.) (30 khz offset) ?9 dbc (typ.) (50 khz offset) positive power supply operation (adjustment-free for v gg ) supports both 800 mhz and 1.5 ghz by the external matching circuit applications power amplification between the quadrature modulator ic for 800 mhz/1.5 ghz pdc transmitter (approx. ?5 dbm output) and the power module or power amplifier mmic (approx. +10 dbm input) structure gaas mmic 10 pin tssop (plastic)
? CXG1027TM electrical characteristics v gg =0.2 v, v dd =3.4 v, f=941.5 mhz (ta=25 ?) item * 1 current consumption output power * 1 power gain * 2 adjacent channel leak power ratio (30 khz offset) * 2 adjacent channel leak power ratio (50 khz offset) symbol i dd p out g p acpr30 acpr50 min. 10 27 typ. 45 29.5 ?0 ?9 max. 65 32 ?7 ?5 unit ma dbm db dbc dbc item * 1 current consumption output power * 1 power gain * 2 adjacent channel leak power ratio (30 khz offset) * 2 adjacent channel leak power ratio (50 khz offset) symbol i dd p out g p acpr30 acpr50 min. 10 25 typ. 45 27.5 ?0 ?9 max. 65 30 ?7 ?5 unit ma dbm db dbc dbc v gg =0.2 v, v dd =3.4 v, f=1.441 ghz (ta=25 ?) * 1 : when +10 dbm output * 2 : when +10 dbm output, 21 khz band width block diagram package description/pin configuration v dd 1 v gg rf out /v dd 2rf in 10pin tssop (plastic) gnd rf out /v dd 2 gnd (cap) gnd v dd 1 gnd gnd (cap) rf in gnd (1.5ghz) or gnd (ind) (800mhz) v gg 110
? CXG1027TM recommended circuit (for 800 mhz) (for 1.5 ghz) r 2 12 w rf out v dd 2 1 3 4 5 r 1 15 w rf in v gg 10 9 8 7 6 cp 1000pf c 2 10pf l 4 12nh cp 1000pf l 3 8.2nh cp 1000pf c 1 100pf l 1 33nh l 2 39nh l 5 5.6nh cp 1000pf cp 1000pf rf out v dd 2 1 3 4 5 rf in v gg 10 9 8 7 6 cp 1000pf c 2 4pf l 4 4.7nh cp 1000pf l 3 10nh r 2 12 w cp 1000pf r 1 15 w cp 1000pf c 1 100pf l 1 18nh l 2 18nh cp 1000pf
? CXG1027TM recommended evaluation board (for 800 mhz) (for 1.5 ghz) 25mm v gg gnd v dd rf in rf out gnd l 1 l 2 c 1 l 5 c 2 l 4 cp l 3 cp r 2 cp r 1 cp cp v gg gnd v dd rf in rf out gnd cp cp c 2 l 4 cp cp l 3 r 2 l 1 l 2 c 1 cp r 1 glass fabric-base epoxy 4-layer board (thickness : 0.3 mm 2) gnd for the overall 2nd, 3rd and 4th sides
? CXG1027TM example of representative characteristics (ta=25 ?) p out , gain, i dd , acpr vs. p in freq.=1.441ghz, v dd =3.4v, v gg =0.2v 30 20 10 0 ?0 ?0 p out [dbm] gain [db] ?0 ?0 ?0 ?0 0 p in [dbm] i dd [ma] 60 50 40 acpr [dbc] ?0 ?0 ?0 ?0 ?0 ?0 gain p out i dd acpr50 p out , gain, i dd , acpr vs. v dd freq.=1.441ghz, v gg =0.2v, p in =?8dbm 30 20 10 0 ?0 ?0 p out [dbm] gain [db] 2.0 2.5 3.0 3.5 5.5 v dd [v] i dd [ma] 60 50 40 acpr [dbc] ?0 ?0 ?0 ?0 ?0 ?0 gain p out i dd acpr30 acpr50 4.0 4.5 5.0 gain, acpr vs. i dd freq.=1.441ghz, p out =10dbm, v dd =3.4v, v gg =var. 30 20 10 0 ?0 ?0 gain [db] 20 30 40 50 i dd [ma] acpr [dbc] ?0 ?0 ?0 ?0 ?0 ?0 gain acpr30 acpr50 60 70 80 acpr30
sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.22 0.5 5 1.2max * 2.8 0.1 10 6 * 2.2 0.1 3.2 0.2 0.1 ?0.05 + 0.15 0.45 0.15 0?to 10 1 a (0.2) 0.22 ?0.07 + 0.08 (0.1) 0.12 ?0.015 + 0.025 detail a 0.02g tssop-10p-l01 10pin tssop(plastic) 0.1 0.1 m note: * ?dimensions do not include mold protrusion. 0.25 package outline unit : mm CXG1027TM ?
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