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november 2008 rev 3 1/44 44 vn750 high side driver features cmos compatible input on state open load detection off state open load detection shorted load protection undervoltage and overvoltage shutdown protection against loss of ground very low stand-by current reverse battery protection (see application schematic ) description the vn750 is a monolithic device designed in stmicroelectronic's vipower m0-3 technology. the vn750 is intended for driving any type of load with one side connected to ground. the active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). active current limitatio n combined with thermal shutdown and automatic restart protects the device against overload. the device detects the open load condition in both the on and off state. in the off state the device detects if the output is shorted to v cc . the device automatically turns off in the case where the ground pin becomes disconnected. type r ds(on) i out v cc vn750 vn750s vn750pt vn750-b5 60 m ? 6 a 36 v so-8 pentawatt p 2 pak ppak table 1. device summary package order codes tube tape and reel pentawatt vn750 - so-8 vn750s vn750s13tr p 2 pak vn750-b5 vn750-b513tr ppak vn750pt vn750pt13tr www.st.com
contents vn750 2/44 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18 2.5.1 solution 1: resistor in the ground line (rgnd only) . . . . . . . . . . . . . . . . 18 2.5.2 solution 2: diode (dgnd) in the ground line . . . . . . . . . . . . . . . . . . . . . 19 2.6 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.7 mcu i/os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.8 open load detection in off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.9 so-8 maximum demagnetization energy (vcc = 13.5v) . . . . . . . . . . . . . 21 2.10 ppak/p 2 pak maximum demagnetization energy (vcc=13.5v) . . . . . . . 22 3 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.1 so-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.2 p 2 pak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.3 ppak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.2 so-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.3 pentawatt mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.4 p 2 pak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.5 ppak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 so-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.7 pentawatt packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.8 p 2 pak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.9 ppak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
vn750 list of tables 3/44 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 5. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 6. switching (v cc =13v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 7. input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 8. v cc output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 9. status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 10. protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 11. open load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 12. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 13. electrical transient requirements on v cc pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 14. thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 15. thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 16. thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 17. so-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table 18. pentawatt mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 table 19. p 2 pak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 20. ppak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 table 21. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
list of figures vn750 4/44 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 5. switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 6. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7. off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 8. high level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 9. input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 10. status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 11. status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 12. status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 13. on state resistance vs t case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 14. on state resistance vs v cc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 15. open load on state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 figure 16. input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 17. input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 18. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 19. overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 20. openload off state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 21. turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 22. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 23. i lim vs t case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 24. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 25. open load detection in off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 26. so-8 maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 27. ppak /p 2 pak maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . 22 figure 28. pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 29. rthj-amb vs. pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 23 figure 30. so-8 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 31. thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 32. pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 33. rthj-amb vs. pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . 26 figure 34. p 2 pak thermal impedance junction ambien t single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 35. thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 figure 36. pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 37. rthj-amb vs. pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . 28 figure 38. ppak thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 39. thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 40. so-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 41. pentawatt package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 figure 42. p 2 pak package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 figure 43. ppak package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 figure 44. so-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 figure 45. so-8 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 9 figure 46. pentawatt tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 figure 47. p2pak tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 figure 48. p 2 pak tape and reel (suffix ?13tr?). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
vn750 list of figures 5/44 figure 49. ppak suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 figure 50. ppak tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 figure 51. ppak tape and reel (suffix ?13tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
block diagram and pin description vn750 6/44 1 block diagram and pin description figure 1. block diagram figure 2. configuration diagram (top view) table 2. suggested connections for unused and not connected pins connection / pin status n.c. output input floating x x x x to ground x through 10k ? resistor undervoltage overtemperature v cc gnd input output overvoltage current limiter logic driver power clamp status v cc clamp on state openload off state openload and output shorted to v cc detection detection detection detection detection so-8 output status v cc input gnd v cc v cc output output n.c. gnd status input 1 4 5 8 5 4 3 2 1 ppak / p 2 pak pentawatt
vn750 electrical specifications 7/44 2 electrical specifications figure 3. current and voltage conventions 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the st microelectronics sure program and other relevant quality document. input i s i in v in v cc status i stat v stat gnd v cc i out v out i gnd output v f table 3. absolute maximum ratings symbol parameter value unit so-8 pentawatt p 2 pak p pak v cc dc supply voltage 41 v - v cc reverse dc supply voltage - 0.3 v - i gnd dc reverse ground pin current - 200 ma i out dc output current internally limited a - i out reverse dc output current - 6 a i in dc input current +/- 10 ma i stat dc status current +/- 10 ma v esd electrostatic discharge (human body model: r=1.5k ?; c=100pf) - input - status - output - v cc 4000 4000 5000 5000 v v v v
electrical specifications vn750 8/44 2.2 thermal data symbol parameter value unit so-8 pentawatt p 2 pak p pak e max maximum switching energy (l=1.8mh; r l =0 ? ; v bat =13.5v; t jstart =150oc; i l =9a) 100 mj e max maximum switching energy (l=2.46mh; r l =0 ? ; v bat =13.5v; t jstart =150oc; i l =9a) 138 138 mj p tot power dissipation t c =25c 4.2 60 60 60 w t j junction operating temperature internally limited c t c case operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 c table 3. absolute maximum ratings (continued) table 4. thermal data symbol parameter max. value unit s0-8 pentawatt p 2 pak p pak r thj-case thermal resistance junction-case - 2.1 2.1 2.1 c/w r thj-lead thermal resistance junction-lead 30 - - - c/w r thj-amb thermal resistance junction-ambient 93 (1) 1. when mounted on a standard single- sided fr-4 board with 0.5cm 2 of cu (at least 35m thick) connected to all v cc pins. horizontal mounting and no artificial air flow. 62.1 52.1 (2) 2. when mounted on a standard single- sided fr-4 board with 0.5cm 2 of cu (at least 35m thick). horizontal mounting and no artificial air flow. 77.1 (2) c/w 82 (3) 3. when mounted on a standard single-sided fr-4 board with 2cm 2 of cu (at least 35m thick) connected to all v cc pins. horizontal mounting and no artificial air flow. 62.1 37 (4) 4. when mounted on a standard single-sided fr-4 board with 6cm 2 of cu (at least 35m thick). horizontal mounting and no artificial air flow. 44 (4) c/w
vn750 electrical specifications 9/44 2.3 electrical characteristics values specified in this section are for 8v < v cc < 36v; -40c < t j < 150c, unless otherwise stated. table 5. power symbol parameter test conditions min. typ. max. unit v cc operating supply voltage 5.5 13 36 v v usd undervoltage shutdown 3 4 5.5 v v usdhyst undervoltage shutdown hysteresis 0.5 v v ov overvoltage shutdown 36 v r on on state resistance i out = 2a; t j = 25c; v cc > 8v i out = 2a; v cc > 8v 60 120 m ? m ? i s supply current off state; v cc = 13v; v in = v out = 0v off state; v cc = 13v; v in = v out = 0v; t j = 25 c on state; v cc = 13v; v in = 5v; i out = 0a 10 10 2 25 20 3.5 a a ma i l(off1) off state output current v in = v out = 0v 0 50 a i l(off2) off state output current v in = 0v; v out = 3.5v -75 0 a i l(off3) off state output current v in = v out = 0v; v cc = 13v; t j = 125c 5a i l(off4) off state output current v in = v out = 0v; v cc = 13v; t j = 25c 3a table 6. switching (v cc =13v) symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time r l = 6.5 ? from v in rising edge to v out = 1.3v 40 s t d(off) turn-off delay time r l = 6.5 ? from v in falling edge to v out = 11.7v 30 s dv out /dt (on) turn-on voltage slope r l = 6.5 ? from v out = 1.3v to v out =10.4v see figure 21. v/s dv out /dt (off) turn-off voltage slope r l = 6.5 ? from v out = 11.7v to v out =1.3v see figure 22. v/s
electrical specifications vn750 10/44 table 7. input pin symbol parameter test conditions min. typ. max. unit v il input low level 1.25 v i il low level input current v in = 1.25v 1 a v ih input high level 3.25 v i ih high level input current v in = 3.25v 10 a v hyst input hysteresis voltage 0.5 v v icl input clamp voltage i in = 1ma i in = -1ma 66.8 - 0.7 8v v table 8. v cc output diode symbol parameter test conditions min. typ. max. unit v f forward on voltage - i out = 1.3a; t j = 150c 0.6 v table 9. status pin symbol parameter test conditions min. typ. max. unit v stat status low output voltage i stat = 1.6ma 0.5 v i lstat status leakage current normal operation; v stat = 5v 10 a c stat status pin input capacitance normal operation; v stat = 5v 100 pf v scl status clamp voltage i stat = 1ma i stat = - 1ma 66.8 - 0.7 8v v table 10. protections (1) 1. to ensure long term reliability under heavy overload or s hort circuit conditions, protection and related diagnostic signals must be used together with a pro per software strategy. if the device operates under abnormal conditions this software must limit the duration and number of activation cycles. symbol parameter test conditions min. typ. max. unit t tsd shutdown temperature 150 175 200 c t r reset temperature 135 c t hyst thermal hysteresis 7 15 c t sdl status delay in overload condition t j > t jsh 20 ms i lim current limitation 9v < v cc < 36v 5v < v cc < 36v 6915 15 a a v demag turn-off output clamp voltage i out = 2 a; v in = 0v; l = 6mh v cc - 41 v cc - 48 v cc - 55 v
vn750 electrical specifications 11/44 figure 4. status timings figure 5. switching time waveforms table 11. open load detection symbol parameter test conditions min. typ. max. unit i ol openload on state detection threshold v in = 5v 50 200 ma t dol(on) openload on state detection delay i out = 0a 200 s v ol openload off state voltage detection threshold v in = 0v 1.5 3.5 v t dol(off) openload detection delay at turn-off 1000 s v in v stat t dol(off) open load status timing (with external pull-up) overtemp status timing i out < i ol v out > v ol t dol(on) t j > t jsh v in v stat t sdl t sdl t t v out v in 80% 10% dv out /dt (on) t d(off) 90% dv out /dt (off) t d(on)
electrical specifications vn750 12/44 table 12. truth table conditions input output status normal operation l h l h h h current limitation l h h l x x h (t j < t tsd ) h (t j > t tsd ) l overtemperature l h l l h l undervoltage l h l l x x overvoltage l h l l h h output voltage > v ol l h h h l h output current < i ol l h l h h l
vn750 electrical specifications 13/44 table 13. electrical transient requirements on v cc pin iso t/r 7637/1 test pulse test levels i ii iii iv delays and impedance 1 - 25 v - 50 v - 75 v - 100 v 2 ms 10 ? 2 + 25 v + 50 v + 75 v + 100 v 0.2 ms 10 ? 3a - 25 v - 50 v - 100 v - 150 v 0.1 s 50 ? 3b + 25 v + 50 v + 75 v + 100 v 0.1 s 50 ? 4 - 4 v - 5 v - 6 v - 7 v 100 ms, 0.01 ? 5 + 26.5 v + 46.5 v + 66.5 v + 86.5 v 400 ms, 2 ? iso t/r 7637/1 test pulse test levels results i ii iii iv 1c c c c 2c c c c 3acccc 3bcccc 4c c c c 5c e e e class contents c all functions of the device are performed as designed after exposure to disturbance. e one or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to prope r operation without replacing the device.
electrical specifications vn750 14/44 figure 6. waveforms open load without external pull-up status input normal operation undervoltage v cc v usd v usdhyst input overvoltage v cc v cc > v ov status input status status input status input open load with external pull-up undefined load voltage v cc v ol v ol
vn750 electrical specifications 15/44 2.4 electrical characteristics curves figure 7. off state output current figure 8. high level input current figure 9. input clamp voltage figure 10. status leakage current figure 11. status low output voltage figure 12. status clamp voltage -50 -25 0 25 50 75 100 125 150 175 tc (oc) -1 -0.5 0 0.5 1 1.5 2 2.5 3 il (o ff1) (ua ) off state vc c =36v vin=vout=0v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 1 2 3 4 5 6 7 iih (ua ) vin=3.25v -50 -25 0 25 50 75 100 125 150 175 tc (c) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vicl (v) ii n =1 m a -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.01 0.02 0.03 0.04 0.05 ils ta t (u a ) vstat=5v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.1 0.2 0.3 0.4 0.5 0.6 vstat (v) is tat=1.6ma -50 -25 0 25 50 75 100 125 150 175 tc (c) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vscl (v) is t a t =1 m a
electrical specifications vn750 16/44 figure 13. on state resistance vs t case figure 14. on state resistance vs v cc figure 15. open load on state detection threshold figure 16. input high level figure 17. input low level figure 18. input hysteresis voltage -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 20 40 60 80 100 120 140 r on (mohm) io u t =2 a vc c =8v; 13v; 36v 5 10152025303540 vcc (v) 20 30 40 50 60 70 80 90 100 110 120 r on (mohm) io u t =2 a tc= - 40c tc = 25c tc = 125c tc = 150c -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 20 40 60 80 100 120 140 160 180 200 220 io l (ma ) vcc=13v vin=5v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 vil (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v)
vn750 electrical specifications 17/44 figure 19. overvoltage shutdown figure 20. openload off state voltage detection threshold figure 21. turn-on voltage slope figure 22. turn-off voltage slope figure 23. i lim vs t case -50 -25 0 25 50 75 100 125 150 175 tc (c ) 30 32 34 36 38 40 42 44 46 48 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 1 1.5 2 2.5 3 3.5 4 4.5 5 vol (v) vin=0v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 100 200 300 400 500 600 700 800 900 1000 dv out/dt/(on) (v /ms ) vcc=13v rl=6.5ohm -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 50 100 150 200 250 300 350 400 450 500 dvout/dt(off) (v/ms) vcc=13v rl=6.5ohm -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 2 4 6 8 10 12 14 16 18 20 ilim (a ) vc c =13v
electrical specifications vn750 18/44 figure 24. application schematic 2.5 gnd protection networ k against reverse battery 2.5.1 solution 1: resist or in the ground line (r gnd only) this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1. r gnd 600mv / (i s(on)max ). 2. r gnd ( - v cc ) / (- i gnd ) where - i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc < 0: during reverse battery situations) is: p d = (- v cc ) 2 / r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not shared by the device ground then the r gnd will produce a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift will vary depending on how ma ny devices are on in the case of several high side drivers sharing the same r gnd . if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then st suggest s to utilize solution 2 (see below). v cc gnd output d gnd r gnd d ld c +5v r prot v gnd status input +5v r prot
vn750 electrical specifications 19/44 2.5.2 solution 2: diode (d gnd ) in the ground line a resistor (r gnd = 1k ?) should be inserted in parallel to d gnd if the device drives an inductive load. this small signal diode can be safely shared amongst several different hsds. also in this case, the presence of the grou nd network will produce a shift ( 600mv) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. this shift will not vary if more than one hsd shares t he same diode/resistor network. series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. safest configuration for unused input and status pin is to leave them unconnected. 2.6 load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the v cc max dc rating. the same applies if the device is subject to transients on the v cc line that are greater than the ones shown in the iso 7637-2: 2004(e) table. 2.7 mcu i/os protection if a ground protection network is used and negative transient are present on the v cc line, the control pins will be pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the c i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of c and the current required by the hsd i/os (input levels compatibilit y) with the latch-up limit of c i/os. -v ccpeak /i latchup r prot (v oh c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100v and i latchup 20ma; v oh c 4.5v 5k ? r prot 65k ? . recommended values: r prot =10k ? . 2.8 open load detection in off state off state open load detection requires an external pull-up resistor (r pu ) connected between output pin and a positive supply voltage (v pu ) like the +5v line used to supply the microprocessor. the external resistor has to be selected according to the following requirements: 1. no false open load indication when load is connected: in this case we have to avoid v out to be higher than v olmin ; this results in the following condition v out = (v pu / (r l +r pu )) r l < v olmin . 2. no misdetection when load is di sconnected: in this case the v out has to be higher than v olmax ; this results in the following condition r pu < (v pu ? v olmax ) / i l(off2) .
electrical specifications vn750 20/44 because i s(off) may significantly increase if v out is pulled high (up to several ma), the pull- up resistor r pu should be connected to a supply that is switched off when the module is in standby. the values of v olmin , v olmax and i l(off2) are available in the electrical characteristics section. figure 25. open load detection in off state v ol v batt. v pu r pu r l r driver + logic + - in p u t status v cc out ground i l(off2)
vn750 electrical specifications 21/44 2.9 so-8 maximum demagnetization energy (v cc = 13.5v) figure 26. so-8 maximum turn-off current versus inductance note: values are generated with r l =0 ?. in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves a and b. c: t jstart = 125c repetitive pulse a: t jstart = 150c single pulse b: t jstart = 100c repetitive pulse demagnetization demagnetization demagnetization t v in , i l 1 10 100 0.1 1 10 100 l(mh) i lmax (a) a b c
electrical specifications vn750 22/44 2.10 ppak/p 2 pak maximum demagnetization energy (v cc = 13.5v) figure 27. ppak /p 2 pak maximum turn-off current versus inductance note: values are generated with r l =0 ?. in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves a and b. c: t jstart = 125c repetitive pulse a: t jstart = 150c single pulse b: t jstart = 100c repetitive pulse demagnetization demagnetization demagnetization t v in , i l 1 10 100 0.1 1 10 100 l(mh) i lmax (a) a b c
vn750 package and pcb thermal data 23/44 3 package and pcb thermal data 3.1 so-8 thermal data figure 28. pc board note: layout condition of r th and z th measurements (pcb fr4 area = 58mm x 58 mm,pcb thickness = 2 mm, cu thickness=35 m , copper areas: 0.14 cm 2 , 0.8 cm 2 , 2 cm 2 ). figure 29. r thj-amb vs. pcb copper area in open box free air condition 70 75 80 85 90 95 100 105 110 00.511.522.5 pcb cu heats ink area (cm^ 2) rt hj_am b (oc / w) so-8 at 2 pins connected to tab
package and pcb thermal data vn750 24/44 figure 30. so-8 thermal impedanc e junction ambient single pulse equation 1: pulse calculation formula where = t p /t figure 31. thermal fitting model of a single channel 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zt h (c / w) 0.5 cm 2 2 cm 2 z th r th z thtp 1 ? () + ? =
vn750 package and pcb thermal data 25/44 table 14. thermal parameter 3.2 p 2 pa k th e rm al da t a figure 32. pc board note: layout condition of r th and z th measurements (pcb fr4 area = 60mm x 60mm, pcb thickness = 2 mm, cu thickness = 35 m , copper areas: 0.97cm 2 , 8cm 2 ). area/island (cm 2 )0.52 r1 (c/w) 0.05 r2 (c/w) 0.8 r3 (c/w) 3.5 r4 (c/w) 21 r5 (c/w) 16 r6 (c/w) 58 28 c1 (ws/c) 0.006 c2 (ws/c) 0.0026 c3 (ws/c) 0.0075 c4 (ws/c) 0.045 c5 (ws/c) 0.35 c6 (ws/c) 1.05 2
package and pcb thermal data vn750 26/44 figure 33. r thj-amb vs. pcb copper area in open box free air condition figure 34. p 2 pak thermal impedance junction ambient single pulse 30 35 40 45 50 55 024681 0 pcb cu heatsink area ( cm^ 2 ) rthj_amb (c/ w) tj-tamb=50c 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zt h (c / w) 0.5 cm 2 6 cm 2
vn750 package and pcb thermal data 27/44 equation 2: pulse calculation formula where = t p /t figure 35. thermal fitting model of a single channel table 15. thermal parameter area/island (cm 2 )0.56 r1 (c/w) 0.15 r2 (c/w) 0.7 r3 (c/w) 0.7 r4 (c/w) 4 r5 (c/w) 9 r6 (c/w) 37 22 c1 (ws/c) 0.0006 c2 (ws/c) 0.0025 c3 (ws/c) 0.055 c4 (ws/c) 0.4 c5 (ws/c) 2 c6 (ws/c) 3 5 z th r th z thtp 1 ? () + ? =
package and pcb thermal data vn750 28/44 3.3 ppak thermal data figure 36. pc board note: layout condition of r th and z th measurements (pcb fr4 area = 60mm x 60mm, pcb thickness = 2 mm, cu thickness=35 m , copper areas: 0.44 cm 2 , 8 cm 2 ). figure 37. r thj-amb vs. pcb copper area in open box free air condition 0 10 20 30 40 50 60 70 80 90 0246810 pcb cu heatsink area (cm^2) rthj_amb (oc / w)
vn750 package and pcb thermal data 29/44 figure 38. ppak thermal impedance junction ambient single pulse equation 3: pulse calculation formula where = t p /t figure 39. thermal fitting model of a single channel 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zt h (c / w) 0.44 cm 2 6 cm 2 z th r th z thtp 1 ? () + ? =
package and pcb thermal data vn750 30/44 table 16. thermal parameter area/island (cm 2 )0.56 r1 (c/w) 0.15 r2 (c/w) 0.7 r3 (c/w) 1.6 r4 (c/w) 2 r5 (c/w) 15 r6 (c/w) 61 24 c1 (ws/c) 0.0006 c2 (ws/c) 0.0025 c3 (ws/c) 0.08 c4 (ws/c) 0.3 c5 (ws/c) 0.45 c6 (ws/c) 0.8 5
vn750 package and packing information 31/44 4 package and packing information 4.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second-level interconnect. the category of second-level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. 4.2 so-8 package information figure 40. so-8 package dimensions
package and packing information vn750 32/44 table 17. so-8 mechanical data dim. mm min. typ. max. a 1.75 a1 0.1 0.25 a2 1.65 a3 0.65 0.85 b 0.35 0.48 b1 0.19 0.25 c 0.25 0.5 c1 45 (typ.) d4.8 5 e 5.8 6.2 e1.27 e3 3.81 f3.8 4 l 0.4 1.27 m 0.6 s 8 (max.) l1 0.8 1.2
vn750 package and packing information 33/44 4.3 pentawatt mechanical data figure 41. pentawatt package dimensions table 18. pentawatt mechanical data dim. mm min. typ. max. a 4.8 c 1.37 d2.4 2.8 d1 1.2 1.35 e 0.35 0.55 f 0.8 1.05 f1 1 1.4 g3.23.43.6 g1 6.6 6.8 7 h2 10.4
package and packing information vn750 34/44 dim. mm min. typ. max. h3 10.05 10.4 l17.85 l1 15.75 l2 21.4 l3 22.5 l5 2.6 3 l6 15.1 15.8 l7 6 6.6 m4.5 m1 4 diam. 3.65 3.85 table 18. pentawatt mechanical data (continued)
vn750 package and packing information 35/44 4.4 p 2 pak mechanical data figure 42. p 2 pak package dimensions p010r
package and packing information vn750 36/44 table 19. p 2 pak mechanical data dim. mm min. typ. max. a 4.30 4.80 a1 2.40 2.80 a2 0.03 0.23 b 0.80 1.05 c 0.45 0.60 c2 1.17 1.37 d 8.95 9.35 d2 8.00 e 10.00 10.40 e1 8.50 e 3.20 3.60 e1 6.60 7.00 l 13.70 14.50 l2 1.25 1.40 l3 0.90 1.70 l5 1.55 2.40 r 0.40 v2 0o 8o package weight 1.40 gr (typ)
vn750 package and packing information 37/44 4.5 ppak mechanical data figure 43. ppak package dimensions table 20. ppak mechanical data dim. mm min. typ. max. a 2.20 2.40 a1 0.90 1.10 a2 0.03 0.23 b 0.40 0.60 b2 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 d1 5.1 d 6.00 6.20 e 6.40 6.60
package and packing information vn750 38/44 dim. mm min. typ. max. e1 4.7 e1.27 g 4.90 5.25 g1 2.38 2.70 h 9.35 10.10 l2 0.8 1.00 l4 0.60 1.00 r0.2 v2 0o 8o package weight gr. 0.3 table 20. ppak mechanical data (continued)
vn750 package and packing information 39/44 4.6 so-8 packing information the devices can be packed in tube or tape and reel shipments (see the device summary on page 1 ). figure 44. so-8 tube shipment (no suffix) figure 45. so-8 tape and reel shipment (suffix ?tr?) all dimensions are in mm. base q.ty 100 bulk q.ty 2000 tube length ( 0.5) 532 a 3.2 b 6 c ( 0.1) 0.6 c b a tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 12 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d (+0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 5.5 compartment depth k (max) 4.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions all dimensions are in mm. base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 12.4 n (min) 60 t (max) 18.4
package and packing information vn750 40/44 4.7 pentawatt packing information the devices can be packed in tube or tape and reel shipments (see the device summary on page 1 ). figure 46. pentawatt tube shipment (no suffix) 4.8 p 2 pak packing information the devices can be packed in tube or tape and reel shipments (see the device summary on page 1 ). figure 47. p 2 pak tube shipment (no suffix) all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 18 b 33.1 c ( 0.1) 1 c b a all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 18 b 33.1 c ( 0.1) 1 c b a
vn750 package and packing information 41/44 figure 48. p 2 pak tape and reel (suffix ?13tr?) 4.9 ppak packing information the devices can be packed in tube or tape and reel shipments (see the device summary on page 1 ). figure 49. ppak suggested pad layout tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 12 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 11.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions all dimensions are in mm. base q.ty 1000 bulk q.ty 1000 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 24.4 n (min) 60 t (max) 30.4 6.7 1.8 3
package and packing information vn750 42/44 figure 50. ppak tube shipment (no suffix) figure 51. ppak tape and reel (suffix ?13tr?) all dimensions are in mm. base q.ty 75 bulk q.ty 3000 tube length ( 0.5) 532 a 6 b 21.3 c ( 0.1) 0.6 a c b all dimensions are in mm. base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 2.75 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions
vn750 revision history 43/44 5 revision history table 21. document revision history date revision changes 21-jun-2004 1 initial release. 03-may-2006 2 current and voltage convention update (page 2). configuration diagram (top view) & suggested connections for unused and n.c. pins: insertion (page 2). 6cm2 cu condition insertion in thermal data table (page 3). v cc - output diode section update (page 4). revision history table insertion (page 30). disclaimers update (page 31). 24-nov-2008 3 document reformatted and restructured. added content, list of figures and tables. added ecopack ? packages information. updated figure 48.: p 2 pak tape and reel (suffix ?13tr?) : ? changed component spacing (p) in tape dimensions table from 16 mm to 12 mm.
vn750 44/44 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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