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E2E0038-27-Y3 Semiconductor Semiconductor MSM64481 This version: MSM64481 Jan. 1998 Previous version: Mar. 1996 Built-in 512-Bit EEPROM and LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION The MSM64481 is a 4-bit microcontroller with built-in EEPROM that incorporates OKI's nX-4s CPU core. The device contains a 2K-byte ROM, 128-nibble RAM, 128-nibble EEPROM, 1/2 duty LCD driver, time base counter, watchdog timer, low voltage detection circuit, seven interrupt sources, one 3-bit input port, two 4-bit input/output ports, and 500 kHz RC oscillator circuit (with an external capacitor C). FEATURES * Operating range Operating frequency : 200 kHz to 1 MHz Operating voltage : 3 to 6 V Operating temperature : -40 to +85C * Internal program memory : 2048 bytes * Internal data memory : 128 nibbles * Built-in EEPROM : 128 nibbles * Interrupt sources : 6 (3 internal, 3 external) * Minimum instruction execution time : 6 ms (@ 500 kHz) * I/O Port Input-output port : 2 ports 4 bits Input port : 1 port 3 bits * 1/2 duty LCD driver Segment drivers : 40 Common drivers :2 * Built-in watchdog timer * CPU operating voltage : 3.0 to 5.5 V * EEPROM writable operating voltage : 4.5 to 5.5 V * LCD display operating voltage : 3.0 to 6.0 V * Package options 60-pin plastic QFP (QFP60-P-1519-1.00-K) : (Product name: MSM64481-014GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name: MSM64481-014GS-2K-H) 1/12 INT DB7-0 P0 ROM TR1 (2048 bytes) PCM P1 A8, A9 A7-0 H RAM (128 nibbles) P2 P2.0 P2.1 P2.2 P2.3 SEG1 ROMR IR INT INTERRUPT CONTROL WDT INT INT INT VDD1 GND VDD2 LOW VOLTAGE DETECT SEG40 COM1 COM2 (128 nibbles) EEPROM LCD DRIVER L X Y PCL PCH P0.0/INT P0.1/INT P0.2 (8) BLOCK DIAGRAM Semiconductor TR2 TR0 C ALU P1.0 P1.1 P1.2 P1.3 B H (4) (4) DB7-0 (8) OSC1 STBY SFR SP INST. DECODER OSC TIMING CONTROL RESET TEST TBC MSM64481 2/12 Semiconductor MSM64481 PIN CONFIGURATION (TOP VIEW) SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 NC SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 P0.0 P0.1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 COM2 COM1 VDD2 P0.2 P1.0 P1.1 P1.2 P1.3 P2.0 GND P2.1 P2.2 P2.3 VDD1 OSC1 RESET TEST 56-Pin Plastic QFP NC: No-connection pin 3/12 Semiconductor MSM64481 PIN CONFIGURATION (TOP VIEW) (Continued) 60 SEG27 59 SEG26 58 SEG25 57 SEG24 56 SEG23 55 SEG22 54 SEG21 53 SEG20 52 SEG19 51 SEG18 50 SEG17 49 SEG16 48 SEG15 47 SEG14 46 SEG13 45 SEG12 44 SEG11 43 SEG10 42 SEG9 41 SEG8 40 SEG7 39 SEG6 38 SEG5 37 SEG4 36 SEG3 35 SEG2 34 SEG1 33 COM2 32 COM1 31 VDD2 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 1 2 3 4 5 6 7 8 9 SEG37 10 SEG38 11 SEG39 12 SEG40 13 P0.0 14 P0.1 15 NC 16 P0.2 17 P1.0 18 P1.1 19 P1.2 20 P1.3 21 P2.0 22 GND 23 P2.1 24 P2.2 25 P2.3 26 VDD1 27 OSC1 28 60-Pin Plastic QFP NC: No-connection pin RESET 29 TEST 30 4/12 Semiconductor MSM64481 PIN DESCRIPTIONS Function Power supply Ground Control Symbol VDD1 VDD2 GND RESET TEST P0.0 P0.1 P0.2 P1.0 P1.1 Ports P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 COM1 Display drivers COM2 SEG1 to SEG40 Oscillation OSC1 I RC oscillator pin (for an external capacitor C) O O O LCD common driving outputs I/O I/O port I/O I/O port Type -- -- -- I I I I I Ground System reset input pin. When this pin is set "L", the internal state is initialized. This pin contains a built-in pull-up resistor. Pin for IC testing Input port. Also used for external interrupt. Input port. Also used for external interrupt. Input port for detecting external voltage Description -- Power supply for driving the LCD drivers LCD segment driving outputs 5/12 Semiconductor MSM64481 MEMORY MAPS Program Memory (ROM) The program memory is a memory area for program data, the interrupt area, the CZP area, and the start addresss area. The data length is 8 bits. Address 0 to address 2047 is assigned to program memory. The following figure shows the address space of program memory. 7FFh Program area 040h 2048 bytes Interrupt area 020h CZP area 010h Start address area 000h 8 bits Program Memory Address Space The CZP area is the start address range of a CZP subroutine of one-byte call instruction. 6/12 Semiconductor Data Memory (RAM) MSM64481 The data memory space is assigned to RAM and special function registers (SFRs). Data Memory is located in a different address space from program memory. The data length is 4 bits (1nibble), and a bank unit is 256 nibbles. The data memory uses two bank areas: one for the EEPROM and SFR areas, in Bank 0; the other for RAM, including the stack, in Bank 7. The following figure shows the address space of data memory. 7FFh RAM area 780h 700h BANK7 Unused area 780h 7FFh Data/stack 128 nibbles area 128 nibbles Inaccessible area 07Fh 07Eh 07Dh MIEF 07Ch 0FFh EEPROM area Stack pointer HALT 128 nibbles 07Fh 000h BANK0 SFR area 000h 4 bits Other SFR area Data Memory Address Space 7/12 Semiconductor MSM64481 ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Power Supply Voltage for LCD Displays Input Voltage Output Voltage 1 Output Voltage 2 Storage Temperature Symbol VDD1 VDD2 VIN VOUT1 VOUT2 TSTG Condition Ta=25C Ta=25C Ta=25C VDD1 output, Ta=25C VDD2 output, Ta=25C -- Rating -0.3 to +7 -0.3 to +7 -0.3 to VDD1+0.3 -0.3 to VDD1+0.3 -0.3 to VDD2+0.3 -55 to +150 Unit V V V V V C RECOMMENDED OPERATING CONDITIONS Parameter Operating Voltage 1 (CPU operable range) Operating Voltage 2 (EEPROM writable range) Operating Voltage (LCD display enable range) Operating Frequency EEPROM Rewritable Cycle EEPROM Data Retaining Years Operating Temperature fOP -- -- Top -- -- -- -- 200 to 1000 10,000 10 -40 to +85 kHz cycles years C Symbol VDD1 VDD1 VDD2 Condition -- -- -- Range 3.0 to 5.5 4.5 to 5.5 3.0 to 6.0 Unit V V V 8/12 Semiconductor MSM64481 ELECTRICAL CHARACTERISTICS DC Characteristics (VDD1=5 V, VDD2=6 V, Ta=-40 to +85C unless otherwise specified) Parameter Input Voltage 1 (P1.0 to P1.3) (P2.0 to P2.3) Input Voltage 2 (P0.0 to P0.2) (TEST, RESETB) Input Current 1 (P1.0 to P1.3) (P2.0 to P2.3) Input Current 2 (P0.0 to P0.2) (TEST, RESETB) Pull-up Resistance (P1.0 to P1.3) (P2.0 to P2.3) Output Current 1 (P1.0 to P1.3) (P2.0 to P2.3) VOL1 VOH2 VOL2 VOH3 VOL3 VOM fOSC IDDS *1 IDD1 *2 IDD2 *3 IDDE *2 Symbol VIH1 VIL1 VIH2 VIL2 IIH1 IIL1 IIH2 IIL2 RON Condition -- -- -- -- VIH1=VDD1 VIL1=GND VIH2=VDD1 VIL2=GND VDD1=5 V VI=0 V VDD1=4.5 V VO=4.1 V VDD1=4.5 V VO=0.4 V VDD2=5 V IO=-50 A VDD2=5 V IO=50 A VDD2=5 V IO=-50 A VDD2=5 V IO=50 A VDD2=5 V IO=20 A VDD1=4.5 to 5.5 V C=47 pF CPU in halt state CPU in operation During write to EEPROM Min. VDD10.7 -- VDD10.7 -- -- -1 -- -1 Typ. -- -- -- -- -- -- -- -- Max. -- VDD10.2 Unit V -- VDD10.2 1 -- A 1 -- 5 -- 40 kW IOH1 -- 2 -- 0.20 -- 0.20 2.25 -- -- -- -- -- -- 2.50 50035% -2 mA -- VDD2-0.20 -- V VDD2-0.20 -- 2.75 V kHz 20 3 1 5 mA A Output Voltage 2 (SEG1 to SEG40) Output Voltage 3 (COM1 to COM2) Intermediate Level Output Voltage (COM1 to COM2) RC Oscillation Frequency Static Current Consumption Dynamic Current Consumption -- -- -- -- -- -- -- -- *1 VDD1=5.5 V, operating frequency f=0 Hz *2 VDD1=5.5 V, VDD2=6 V, operating frequency f=500 kHz *3 VDD1=5.5 V, VDD2=6 V, operating frequency f=500 kHz, LCD in display state 9/12 Semiconductor AC Characteristics MSM64481 (VDD1=3 to 5.5 V, Ta=-40 to +85C unless otherwise specified) Parameter OSC Clock Pulse Width OSC Clock Cycle Input Data Setup Time Input Data Hold Time Output Data Delay Time P0.1 External Interrupt Pulse Width Reset Pulse Width Symbol tOSCW tOSC tSU tHL tD tWP01 tWRES Condition -- -- VDD1=4.5 to 5.5 V VDD1=4.5 to 5.5 V VDD1=4.5 to 5.5 V, Cl=30 pF -- -- Min. 500 1 200 300 -- 15 tOSC 6 tOSC Max. -- -- -- -- 400 -- -- Unit ns s ns ns ns ns ns tOSC OSC tOSCW tOSCW P0, P1 tSU tHL tD P0, P1 tWP01 P0.1 tWRES RESET 10/12 Semiconductor MSM64481 PACKAGE DIMENSIONS (Unit : mm) QFP60-P-1519-1.00-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/12 Semiconductor MSM64481 (Unit : mm) QFP56-P-910-0.65-2K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12 |
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