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ZXFV201, ZXFV202, ZXFV203, ZXFV204 Quad, single, triple and dual video amplifiers Device description The ZXFV201, ZXFV202, ZXFV203 and ZXFV204 are quad, single, triple and dual, respectively, high speed amplifiers designed for video and other high speed applications. Their low differential gain and phase performance make them ideal for video amplifier buffer applications. The quad allows one IC to drive RGBS format component video signals, while the triple provides RGB component video buffer/driver. The dual amplifier is a mainstay of the video market providing two channels in the space of 1 single in SO8. The small size of the ZXFV202 in SOT23 allows it to be placed where needed for position/size critical applications. www..com Features * * * * * * * * * * * High speed Gain of 1 - 3dB bandwidth 210MHz Slew rate 380V/s Good video 25 MHz 0.1dB bandwidth Differential gain 0.04% Differential phase 0.04 40mA output current @ 3V Output Characterized up to 300pF load 5 Volt supply operation Supply current 7.5mA per amplifier Applications * * * * * Industry standard pinouts Video gain stages CCTV buffer Video distribution RGB buffering Home theater High speed ADC signal input drive Cable driving Together with high output drive and slew rate capability, they bring high performance to video applications. Ordering information Part number ZXFV202E5TA Descrip- Status tion Single Active Reel size (inches) 7 7 7 7 13 7 13 7 13 Qty. 3,000 500 500 500 Part mark V202 V202 ZXFV202 ZXFV204 * * * ZXFV202E5TD Single Obsolete ZXFV202N8TA Single Obsolete ZXFV204N8TA ZXFV204N8TC Dual Dual Obsolete Active Active Application diagram Y +2 75 Back termination C +2 75 Co-ax 75 Co-ax 2,500 ZXFV204 500 ZXFV203 ZXFV203N14TA Triple ZXFV203N14TC Triple Obsolete ZXFV201N14TA Quad ZXFV201N14TC Quad LTB Obsolete 2,500 ZXFV203 500 ZXFV201 2,500 ZXFV201 Dual amplifier S - video driver Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 1 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Absolute maximum ratings over operating free-air temperature (unless otherwise stated (a)) Supply voltage (VS+ to VS-) Input voltage (VIN-, VIN+) (b) Differential input voltage (VID) Inverting input current (IIN-) (c) Output current (continuous, TJ < 110C) Internal power dissipation Storage temperature range Operating ambient junction temperature (TJMAX) -0.5V to +11V VS- -0.5V to VS+ +0.5 V 3V 5mA 60mA See power dissipation derating table -65C to +150C 150C NOTES: (a) Stresses above those listed under Absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (b) During power-up and power-down, these voltage ratings require that signals be applied only when the power supply is connected. (c) At high closed loop gains and low gain setting resistors care must be taken if large input signals are applied to the device which cause the output stage to saturate for extended periods of time. Power derating table Package SOT23-5 SO8 SO14 Theta-ja 195C/W 168C/W 120C/W Power rating at 25'C 0.64W 0.74W 1.04W Recommended operating conditions Parameter VS VCMR TA Dual supply voltage range Common mode input voltage range Ambient temperature range Min. 4.75 -3 -40 Max. 5.25 +3 85 Unit V V C Recommended resistor values VS = 5V, CL = 10pF GCL 1 RF 680 820 1000 430 2 470 560 430 470 560 n/c RG Peaking 2 dB 0 -2dB 2dB 1.5dB 0 Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 2 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 DC electrical characteristics (5V power supplies, Tamb= 25C unless otherwise stated. Rf = 1k , RL = 150 , CL = 10pF) Parameter Supply voltage V+ operating range Supply voltage V- operating range Supply current/per channel Input common mode voltage range Input offset voltage Output offset voltage Input bias current, non-inverting input Input resistance Output voltage swing Output drive current Positive PSRR Negative PSRR IOUT = 40mA VIN = 3V V+ = 0.25 V- = 0.25 P P P P P P P P P P 40 49 49 57 57 1.5 Conditions Test Min. Typ. Max. 4.75 -5.25 5.0 5 -5 7.5 3 1 2 5 2 3 10 20 10 6.5 5.25 -4.75 10 Unit V V mA V mV mV A M V mA dB dB Test - P = production tested. C = characterized AC electrical characteristics (5V, Rf = 470 , G = 2, CL = 10pF, TA = 25C, unless otherwise stated) Parameter BW-3 BW0.1 SR Bandwidth, -3dB Bandwidth, 0.1dB Slew Rate Conditions VOUT = 0.2VPP G = +2, RF = 470 VOUT = 0.2VPP G = +1, RF = 820 VOUT = 0.2VPP VOUT = 2VPP G = +2, RF = 470 VOUT = 2VPP G = +1, RF = 820 tr tf tp dG dP Rise time Fall time Propagation delay VOUT = 1V, 10% - 90% VOUT = 2V, 10% - 90% Min Typ 210 210 30 600 380 5.8 4.6 2.6 0.04 0.04 % ns V/ s MHz MHz Max Unit Differential phase, NTSC NTSC/PAL, 280mVPP, Differential phase, NTSC DC = -1.428V to +1.428 V Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 3 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Applications information A typical circuit application is shown in Figure 1. This is suitable for 75 transmission line connections at both the input and the output and is useful for distribution of wide-band signals such as video via cables. The 75 reverse terminating resistor R4 gives the correct matching condition to a terminated video cable. The amplifier load is then 150 in parallel with the local feedback network. 470 470 Figure 1 Typical video signal application circuit, gain = 2 (overall gain = 1 for 75 load The wide bandwidth of this device necessitates some care in the layout of the printed circuit. A continuous ground plane is required under the device and its signal connection paths, to provide the shortest possible ground return paths for signals and power supply filtering. A double-sided or multi-layer PCB construction is required, with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane. For the power supply filtering, low inductance surface mount capacitors are normally required. It has been found that very good RF decoupling is provided on each supply using a 1000pF NPO size 0805 or smaller ceramic surface mount capacitor, closest to the device pin, with an adjacent 0.1 F X7R capacitor. Other configurations are possible and it may be found that a single 0.01 F X7R capacitor on each supply gives good results. However this should be supported by larger decoupling capacitors elsewhere on the printed circuit board. Values of 1 to 10 F are recommended, particularly where the voltage regulators are located more than a few inches from the device. These larger capacitors are recommended to be solid tantalum electrolytic or ceramic types. Note particularly that the inverting input of this current feedback type of amplifier is sensitive to small amounts of capacitance to ground which occur as part of the practical circuit board layout. This capacitance affects bandwidth, frequency response peaking and pulse overshoot. Therefore to minimize this capacitance, the feedback components R2 and R3 of Figure 1 should be positioned as close as possible to the inverting input connection. Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 4 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 The frequency response and pulse response will vary according to particular values of resistors and layout capacitance. The response can be tailored for the application to some extent by choice of the value of feedback resistor. Figures 2 and 3 show the small signal unity gain and gain of 2 frequency responses. 3 RF = 680 0 Gain (dB) RF = 820 RF = 1k VIN = 200mVPP TA = 25 VS = 5V G= 1 RL = 150 CL = 10pF -3 -6 1 10 Frequency (MHz) 100 1000 Figure 2 Unity gain small signal bandwidth 9 RF = 430 6 Gain (dB) RF = 560 RF = 470 3 VIN = 200mVPP TA = 25 VS = 5V G= 2 RL = 150 CL = 10pF 0 1 Figure 3 10 100 Frequency (MHz) 1000 Gain of 2 small signal bandwidth Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 5 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Figures 4 and 5 show the large signal unity gain of 2 frequency responses. Large signal G = 1 3 0 -3 Gain (dB) Gain (dB) -6 -9 -12 -15 -18 -21 1 VIN = 1VPP VS = 5V RL = 150 RF = 820 TA = 25 G= 1 CL = 10pF Large signal G = 2 9 6 3 0 -3 -6 -9 -12 VIN = 1VPP VS = 5V RL = 150 RF = 560 TA = 25 G= 2 CL = 10pF 10 Frequency (MHz) 100 1000 -15 1 10 Frequency (MHz) 100 1000 Figures 4 and 5 Large signal unity gain of 2 frequency response The ZXFV20x family are primarily video amplifiers; Figures 6 and 7 show the NTSC/PAL differential gain and phase errors at a gain of 2. Diff gain error 0.05% 0.04% 0.04% Diff phase error 0.005 0 Differential Phase Error -0.005 -0.01 -0.015 -0.02 -0.025 VIN = 280mVPP TA = 25 VS = 5V G= 2 RL = 150 CL = 10pF RF = 560 -0.48 -0.24 0 0.24 0.48 0.72 Differential Gain Error 0.03% 0.03% 0.02% 0.02% 0.01% 0.01% 0.00% -0.01% VIN = 280mVPP TA = 25 VS = 5V G= 2 RL = 150 CL = 10pF RF = 560 -0.48 -0.24 0 0.24 0.48 0.72 -0.01% -0.72 -0.03 -0.72 VBIAS (VDC) VBIAS(VDC) Figures 6 and 7 NTSC/PAL differential gain and phase errors at a gain of 2 Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 6 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Pinout details V S+ OUT V S+IN NC NC OUT3 IN3 IN3+ VS- -IN NC VS+ IN1+ IN1+ ZXFV202E5 Single NC ININ+ VSNC V S+ OUT NC ZXFV204 IN2+ IN2 OUT2 OUT1 ZXFV203 Triple ZXFV202N8 Single OUT1 IN1IN1+ OUT4 IN4 IN4+ VS- OUT1 IN1 IN1+ V S- V S+ OUT2 IN2 IN2+ VS+ IN2+ IN2OUT2 ZXFV204 IN3+ IN3 OUT3 ZXFV204 Dual ZXFV201 Quad Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 7 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Package details - SO8, SO14 Dim. A A1 D (8 pin) D (14 pin) H E Inches Min. 0.053 0.004 0.189 0.337 0.228 0.150 Max. 0.069 0.010 0.197 0.344 0.244 0.157 Millimeters Min. 1.35 0.10 4.80 8.55 5.80 3.80 Max. 1.75 0.25 5.00 8.75 6.20 4.00 Dim. L e b c Inches Min. 0.016 0.013 0.008 0 Max. 0.050 0.020 0.010 8 0.020 Millimeters Min. 0.40 0.33 0.19 0 0.25 Max. 1.27 0.51 0.25 8 0.50 0.050 BSC 1.27 BSC h 0.010 Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 8 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Package outline - SOT23 E e b 3 leads e1 L1 E1 D A A1 L c Dim. A A1 b C D e Millimeters Min. 0.01 0.30 0.085 2.80 Max. 1.12 0.10 0.50 0.120 3.04 - Inches Min. 0.0004 0.012 0.003 0.110 Max. 0.044 0.004 0.020 0.008 0.120 Dim. e1 E E1 L L1 - Millimeters Min. 2.10 1.20 0.25 0.45 Max. 2.64 1.40 0.62 0.62 1.90 NOM Inches Max. 0.083 0.047 0.018 0.018 Max. 0.104 0.055 0.024 0.024 0.075 NOM 0.95 NOM 0.0375 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 9 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" Future device intended for production at some point. Samples may be available "Active" Product status recommended for new designs "Last time buy (LTB)" Device will be discontinued and last time buy period and delivery is in effect "Not recommended for new designs" Device is still in production to support existing designs and production "Obsolete" Production has been discontinued Datasheet status key: "Draft version" This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. "Provisional version" This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. "Issue" This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com (c) 2007 Published by Zetex Semiconductors plc Issue 5 - May 2007 (c) Zetex Semiconductors plc 2007 10 www.zetex.com |
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