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19-4035; Rev 2; 9/08
KIT ATION EVALU ABLE AVAIL
Hi-Speed USB 2.0 Switches with 15kV ESD
Features
USB Hi-Speed Switching ESD Protection on COM 15kV Human Body Model 15kV IEC 61000-4-2 Air Gap 8kV IEC 61000-4-2 Contact Power-Supply Range: +2.8V to +5.5V Low 5 (typ) On-Resistance (RON) -3dB Bandwidth: 950MHz (typ) Compatible with Logic I/O Down to 1.4V COM Analog Inputs Fault Protected Against Shorts to +5.5V Low Supply Current 0.6A (typ) Enable Input: Active-Low (EN) MAX4983E Active-High (EN) MAX4984E Small 10-Pin, 1.4mm x 1.8mm UTQFN
General Description
The MAX4983E/MAX4984E are high ESD-protected analog switches that combine the low on-capacitance and low on-resistance necessary for high-performance switching applications. COM1 and COM2 are protected against 15kV ESD without latchup or damage. The devices are ideal for USB 2.0 Hi-Speed applications at 480Mbps. The switches also handle all the requirements for USB low- and full-speed signaling. The MAX4983E/MAX4984E double-pole/double-throw (DPDT) switches are fully specified to operate from a single +2.8V to +5.5V power supply and are protected against a +5.5V short to COM1 and COM2. This feature makes the MAX4983E/MAX4984E fully compliant with the USB 2.0 specification of VBUS fault protection. The devices feature low-threshold-voltage logic inputs, permitting them to be used with low I/O voltage systems. The MAX4983E features an active-low enable input (EN) that when driven high sets the device in shutdown mode. The MAX4984E features an active-high enable input (EN) that when driven low sets the device in shutdown mode. When the device is in shutdown mode, the quiescent supply current is reduced to 0.1A. The MAX4983E/MAX4984E are available in a spacesaving, 10-pin, 1.4mm x 1.8mm UTQFN package, and operate over a -40C to +85C temperature range.
MAX4983E/MAX4984E
Ordering Information
PART MAX4983EEVB+ MAX4984EEVB+ PIN-PACKAGE 10 Ultra-Thin QFN 10 Ultra-Thin QFN TOP MARK AAA AAB
Applications
Cell Phones PDAs Digital Still Cameras GPS Notebook Computers Video Switching Bus Switches
Note: All devices operate over the -40C to +85C extended temperature range. +Denotes a lead-free package.
Eye Diagram
MAX4983E MAX4984E
Pin Configuration
NC2 8 9 10 7 NO2 6
TOP VIEW
EN (EN) VCC
USB 2.0 Hi-SPEED TRANSMIT TEMPLATE
5 4 3
COM2 GND COM1
MAX4983E/ MAX4984E
CB
1 NC1
2 NO1
UTQFN
(EN) FOR MAX4984E ONLY.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.) VCC, COM_, NO_, NC_, EN, EN, CB .................... -0.3V to +6.0V Continuous Current into Any Terminal............................. 30mA Continuous Power Dissipation (TA = +70C) 10-Pin UTQFN (derate 6.9mW/C above +70C)........ 559mW Junction-to-Case Thermal Resistance (JC) (Note 1) 10-Pin UTQFN ...........................................................20.1C/W Junction-to-Ambient Thermal Resistance (JA) (Note 1) 10-Pin UTQFN ........................................................ 143.1C/W Operating Temperature Range .......................... -40C to +85C Junction Temperature Range ......................................... +150C Storage Temperature Range ............................ -65C to +150C Lead Temperature (soldering 10s) ..................................+300C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +2.8V to +5.5V, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +3.0V, TA = +25C.) (Note 2)
PARAMETER Operating Power-Supply Range Supply Current Shutdown Supply Current Increase in Supply Current with VCB, VEN Voltage Analog Signal Range Fault-Protection Trip Threshold On-Resistance On-Resistance Match Between Channels On-Resistance Flatness SYMBOL VCC ICC ISHDN VCB = 0V or VCC, VEN = 0V or VEN = VCC VCC = 3.0V VCC = 5.5V CONDITIONS MIN 2.8 0.6 3 0.1 2 0 VCC + 0.6 VCC + 0.8 5 5.5 0.1 0.1 -250 +250 180 -250 +250 1 VCC VCC + 1 10 TYP MAX 5.5 1.5 6.5 UNITS V A A A V V nA A nA
Switch disabled (VEN = VCC or VEN = 0V) 0 VCB VIL or VIH VCB VCC or 0 VEN VIL or VIH VEN VCC
VCOM, VNO, VEN = VCC or VEN = 0V (Note 3) VNC VFP RON RON RFLAT COM_ only, TA = +25C VCOM = 0V to VCC VCOM = 3.6V, VCC = 3.0V VCC = 3.0V, VCOM = 2V (Note 4) VCC = 3.0V, VCOM = 0V to VCC (Note 5) VCC = 4.5V, VCOM = 0V or 4.5V, VNO, VNC = 4.5V or 0V VCC = 5.5V, VCOM = 0V or 5.5V, VNO, VNC with 50A sink current to GND VCC = 5.5V, VCOM = 0V or 5.5V, VNO, VNC = unconnected RL = RS = 50, signal = 0dBm VNO, VNC = 0dBm, RL = RS = 50 (Figure 1) f = 10MHz f = 250MHz f = 500MHz
Off-Leakage Current
ICOM(OFF)
On-Leakage Current AC PERFORMANCE On-Channel -3dB Bandwidth Off-Isolation
ICOM(ON)
BW VISO
950 -48 -20 -17
MHz dB
2
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Hi-Speed USB 2.0 Switches with 15kV ESD
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.8V to +5.5V, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +3.0V, TA = +25C.) (Note 2)
PARAMETER Crosstalk (Note 6) LOGIC INPUT Input Logic-High Input Logic-Low Input Leakage Current DYNAMIC Turn-On Time Turn-Off Time Propagation Delay Fault Protection Response Time Fault Protection Recovery Time Output Skew Between Switches NO_ or NC_ Off-Capacitance COM Off-Capacitance (Figure 5, Note 7) COM On-Capacitance (Figure 5, Note 7) Total Harmonic Distortion Plus Noise ESD PROTECTION Human Body Model COM1, COM2 All Pins IEC 61000-4-2 Air-Gap Discharge IEC 61000-4-2 Contact Discharge Human Body Model 15 15 8 2 kV tON tOFF tPLH, tPHL tFP tFPR tSK VNO or VNC = 1.5V, RL = 300, CL = 35pF, VEN = VCC to 0V or VEN = 0V to VCC (Figure 2) VNO or VNC = 1.5V, RL = 300, CL = 35pF, VEN = VCC to 0V or VEN = 0V to VCC (Figure 2) RL = RS = 50, Figure 3 VCOM = 0V to 5V step, RL = RS = 50, VCC = 3.3V (Figure 4) VCOM = 5V to 0V step, RL = RS = 50, VCC = 3.3V (Figure 4) Skew between switch 1 and 2, RL = RS = 50, (Figure 3, Note 7) 40 2 5.5 4.8 6.5 5.5 0.03 0.5 20 1 100 5.0 100 100 5 s s ps s s ps pF pF pF % VIH VIL IIN -250 1.4 0.5 +250 V V nA SYMBOL VCT CONDITIONS VNO, VNC = 0dBm, RL = RS = 50, Figure 1 f = 10MHz f = 250MHz f = 500MHz MIN TYP -73 -54 -33 dB MAX UNITS
MAX4983E/MAX4984E
CNO(OFF) or f = 1MHz (Figure 5, Note 7) CNC(OFF) CCOM(OFF) CCOM(ON) THD+N f = 1MHz f = 240MHz f = 1MHz f = 240MHz VCOM = 1VP-P, VBIAS = 1V, RL = RS = 50, f = 20Hz to 20kHz
All devices are 100% production tested at TA = +25C. All temperature limits are guaranteed by design. The switch turns off for voltages above VFP, protecting downstream circuits in case of a fault condition. RON(MAX) = ABS(RON(CH1) - RON(CH2)). Flatness is defined as the difference between the maximum and minimum value of on-resistance, as measured over specified analog signal ranges. Note 6: Between any two switches. Note 7: Switch off-capacitance, switch on-capacitance, and output skew between switches are not production tested; guaranteed by design. Note 2: Note 3: Note 4: Note 5:
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
Test Circuits/Timing Diagrams
VOUT VIN VOUT VIN
OFF-ISOLATION = 20log NETWORK ANALYZER 0V OR VCC CB COM1 VIN 50 50 CROSSTALK = 20log
NC1 50 MAX4983E/ MAX4984E NO1* VOUT MEAS REF
50
50
SWITCH IS ENABLED. MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
*FOR CROSSTALK THIS PIN IS NO2. NC2 AND COM2 ARE OPEN.
Figure 1. Off-Isolation and Crosstalk
MAX4983E/ MAX4984E NO OR NC RL EN (EN) LOGIC INPUT CL COM
LOGIC INPUT VOUT
VIH 50% VIL t OFF VOUT 0.9 x V0UT
t R < 5ns t F < 5ns
VIN_
SWITCH OUTPUT
0V t ON
0.1 x VOUT
CL INCLUDES FIXTURE AND STRAY CAPACITANCE. RL VOUT = VIN_ RL + RON
(
)
IN DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH.
Figure 2. Switching Time
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Hi-Speed USB 2.0 Switches with 15kV ESD
Test Circuits/Timing Diagrams (continued)
MAX4983E/MAX4984E
RS VIN+
NC1 OR NO1
MAX4983E/ MAX4984E COM1 RL VOUT+ tPLH = tPLHX OR tPLHY tPHL = tPHLX OR tPHLY tSK(O) = |tPLHX - tPLHY| OR |tPHLX - tPHLY| tSK(P) = |tPLHX - tPHLX| OR |tPLHY - tPHLY|
RS VIN-
NC2 OR NO2
COM2 RL CB VIL TO VIH
VOUT-
tINRISE VCC VIN+ 0V VCC VIN0V tOUTRISE tPLHX VCC VOUT+ 0V VCC VOUT0V tPHLY tPLHY 50% 50% 50% 50% 10% tPHLX 90% 50% 50% 50% 50% 10%
tINFALL
90%
90% 10%
tOUTFALL
90% 10%
Figure 3. Output Signal Skew, Rise/Fall Time, Propagation Delay
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
Test Circuits/Timing Diagrams (continued)
VCC = 3.3V MAX4983E/ MAX4984E VCOM tFP tFPR 5V 3V 0V
VFP VNO VNC 3V 0V
Figure 4. Fault-Protection Response/Recovery Time
COM
MAX4983E/ MAX4984E CB VIL OR VIH
CAPACITANCE METER
NC_ OR NO_
Figure 5. Channel Off-/On-Capacitance
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
Typical Operating Characteristics
(VCC = 3.0V, TA = +25C, unless otherwise noted.)
COM LEAKAGE CURRENT vs. TEMPERATURE
MAX4983E/4E toc02
ON-RESISTANCE vs. VCOM
MAX4983E/4E toc01
ON-RESISTANCE vs. VCOM
7 6 5 80 70 LEAKAGE CURRENT (nA) 60 50 40 30 20 10 0 0 1 VCOM (V) 2 3 -40
5 4 RON () 3 2 1 0 0 1 2 3 VCOM (V) 4 5 6 VCC = 5.5V VCC = 2.8V
COM ON-LEAKAGE
RON ()
4 3 TA = +85C 2 1 0 TA = +25C TA = -40C
COM OFF-LEAKAGE
-15
10
35
60
85
TEMPERATURE (C)
QUIESCENT SUPPLY CURRENT vs. TEMPERATURE
MAX4983E/4E toc04
QUIESCENT SUPPLY CURRENT vs. LOGIC LEVEL
MAX4983E/4E toc05
LOGIC-INPUT THRESHOLD vs. SUPPLY VOLTAGE
MAX4983E/4E toc06
4.0 QUIESCENT SUPPLY CURRENT (A) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -15 10 35 60 VCC = 2.8V VCC = 5.5V
5 QUIESCENT SUPPLY CURRENT (A)
1.2 1.0 LOGIC THRESHOLD (V) 0.8 0.6 0.4 0.2 0
4
3
VIH
VIL
2
1
0 85 0 1 2 3 TEMPERATURE (C) LOGIC LEVEL (V)
2.8
3.8
4.8
SUPPLY VOLTAGE (V)
FREQUENCY RESPONSE
MAX4983E/4E toc07
TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY
RL = 600
MAX4983E/4E toc08
0 -10 -20 -30 MAGNITUDE (dB) -40 -50 -60 -70 -80 -90 -100 1 10 100 CROSSTALK ON-LOSS
1
THD+N (%)
OFF-ISOLATION
0.1
0.01
0.001 1,000 10 100 1,000 FREQUENCY (Hz) 10,000 100,000 FREQUENCY (MHz)
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MAX4983E/4E toc03
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
Pin Description
PIN MAX4983E 1 2 3 4 5 6 7 8 -- 9 10 MAX4984E 1 2 3 4 5 6 7 -- 8 9 10 NAME NC1 NO1 COM1 GND COM2 NO2 NC2 EN EN VCC CB FUNCTION Normally Closed Terminal for Switch 1 Normally Open Terminal for Switch 1 Common Terminal for Switch 1 Ground Common Terminal for Switch 2 Normally Open Terminal for Switch 2 Normally Closed Terminal for Switch 2 Active-Low Enable Input. Drive EN high to put switches in high impedance. Drive EN low for normal operation. Active-High Enable Input. Drive EN low to put switches in high impedance. Drive EN high for normal operation. Positive Supply Voltage Input. Bypass VCC to GND with a 0.1F ceramic capacitor as close as possible to the device. Digital Control Input. Drive CB low to connect COM_ to NC_. Drive CB high to connect COM_ to NO_.
Detailed Description
The MAX4983E/MAX4984E are 15kV ESD-protected DPDT analog switches. The devices are ideal for USB 2.0 Hi-Speed (480Mbps) switching applications and also meet USB low- and full-speed requirements. The MAX4983E/MAX4984E are fully specified to operate from a single +2.8V to +5.5V supply. The low VIH threshold of the devices permits them to be used with logic levels as low as 1.4V. The MAX4983E/MAX4984E are based on a charge-pump-assisted n-channel architecture. The devices feature a shutdown mode to reduce the quiescent current to less than 0.1A (typ).
outputs. The charge-pump-assisted n-channel architecture allows the switch to pass analog signals that exceed V CC up to the overvoltage fault protection threshold. This allows USB signals that exceed VCC to pass, allowing compliance with USB requirements for voltage levels.
Overvoltage Fault Protection
The MAX4983E/MAX4984E feature overvoltage fault protection on COM_. Fault protection protects the switch and USB transceiver from damaging voltage levels. When voltages on COM exceed the fault protection threshold, (VFP), COM_, NC_ and NO_ are high impedance.
Digital Control Input
The MAX4983E/MAX4984E provide a single-bit control logic input, CB. CB controls the position of the switches as shown in the Functional Diagram/Truth Table. Driving CB rail-to-rail minimizes power consumption. With a +2.8V to +5.5V supply voltage range, the device is +1.4V logic compatible.
Enable Input
The MAX4983E/MAX4984E feature a shutdown mode that reduces the supply current to less than 0.1A and places COM_ in high impedance. Drive EN high for the MAX4983E or EN low for the MAX4984E to place the devices in shutdown mode. When EN is driven low or EN is driven high, the devices are in normal operation.
Analog Signal Levels
The on-resistance of the MAX4983E/MAX4984E is very low and stable as the analog input signals are swept from ground to VCC (see the Typical Operating Characteristics). These switches are bidirectional, allowing NO_, NC_, and COM_ to be configured as either inputs or
Applications Information
USB Switching
The MAX4983E/MAX4984E analog switches are fully compliant with the USB 2.0 specification. The low on-resistance and low on-capacitance of these switches make them ideal for high-performance switching applications.
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Hi-Speed USB 2.0 Switches with 15kV ESD
The MAX4983E/MAX4984E are ideal for routing USB data lines (see Figure 6) and for applications that require switching between multiple USB hosts (see Figure 7). The MAX4983E/MAX4984E also feature overvoltage fault protection to guard systems against shorts to the USB VBUS voltage that is required for all USB applications.
Functional Diagram/Truth Table
VCC EN (EN)
MAX4983E/MAX4984E
CB
MAX4983E/ MAX4984E
Extended ESD Protection
As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. COM1 and COM2 are further protected against static electricity. The ESD structures withstand high ESD in normal operation and when the device is powered down. After an ESD event, the MAX4983E/ MAX4984E continue to function without latchup. The MAX4983E and MAX4984E are characterized for protection to the following limits: * 15kV using Human Body Model * 8kV using IEC 61000-4-2 Contact Discharge method * 15kV using IEC 61000-4-2 Air-Gap Discharge method
EN 0 0 1 CB 0 1 X NO1 COM1 NC1
NO2 COM2 NC2
GND
MAX4983E N0_ OFF ON OFF NC_ ON OFF OFF COM_ -- -- HI-Z
ESD Test Conditions
ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.
X = DON'T CARE. MAX4984E EN 1 1 0 CB 0 1 X N0_ OFF ON OFF NC_ ON OFF OFF COM_ -- -- HI-Z
Human Body Model
Figure 8a shows the Human Body Model and Figure 8b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5k resistor.
X = DON'T CARE.
IEC 61000-4-2
The main difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2. Because series resistance is lower in the IEC 61000-4-2 ESD test model (Figure 9a), the ESD-withstand voltage measured to this standard is generally lower than that measured using the Human Body Model. Figure 9b shows the current waveform for the 8kV IEC 61000-4-2 Level 4 ESD Contact Discharge test. The Air-Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized. Ensure that bypass capacitors are as close as possible to the device. Use large ground planes where possible.
Power-Supply Sequencing
Caution: Do not exceed the absolute maximum ratings because stresses beyond the listed ratings may cause permanent damage to the device. Proper power-supply sequencing is recommended for all devices. Always apply VCC before applying analog signals, especially if the analog signal is not current limited.
Layout
USB Hi-Speed requires careful PCB layout with 45 controlled-impedance matched traces of equal lengths. PROCESS: BiCMOS
Chip Information
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
ASIC I D+ HI-SPEED USB TRANSCEIVER MAX4983E/ MAX4984E NC1 COM1 NO1 D+ NC2 ASIC II D+ HI-SPEED USB TRANSCEIVER COM2 NO2 DHI-SPEED USB TRANSCEIVER DCOM2 NO2 D+ USB HOST II NC2 D+ COM1 NO1 VBUS MAX4983E/ MAX4984E NC1 DD+ USB HOST I
D-
DGND USB CONNECTOR
D-
Figure 6. USB Data Routing/Typical Application Circuit
Figure 7. Switching Between Multiple USB Hosts
RC 1M CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE
RD 1500 DISCHARGE RESISTANCE DEVICE UNDER TEST IP 100% 90% AMPERES IR PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE)
Cs 100pF
STORAGE CAPACITOR
36.8% 10% 0 0 tRL TIME tDL CURRENT WAVEFORM
Figure 8a. Human Body ESD Test Model
Figure 8b. Human Body Current Waveform
RC 50M to 100M CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE
RD 330 DISCHARGE RESISTANCE DEVICE UNDER TEST
I 100% 90% IPEAK 10% tR = 0.7ns to 1ns 30ns 60ns t
Cs 150pF
STORAGE CAPACITOR
Figure 9a. IEC 61000-4-2 ESD Test Model
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Figure 9b. IEC 61000-4-2 ESD Generator Current Waveform
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
Package Information
For the latest package outline information, go to www.maxim-ic.com/packages. PACKAGE TYPE 10 Ultra-Thin QFN PACKAGE CODE V101A1CN-1 DOCUMENT NO. 21-0028
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Hi-Speed USB 2.0 Switches with 15kV ESD MAX4983E/MAX4984E
Revision History
REVISION NUMBER 0 1 2 REVISION DATE 2/08 5/08 9/08 Initial release Removal of future product asterisks, global change to Hi-Speed Changes to EC table DESCRIPTION PAGES CHANGED -- 1, 8, 9, 10 3
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

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