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| Philips Semiconductors Objective specification Silicon Diffused Power Transistor BUJ202AX GENERAL DESCRIPTION High-voltage, high-speed planar-passivated npn power switching transistor in a plastic full-pack envelope intended for use in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor control systems, etc. QUICK REFERENCE DATA SYMBOL VCESM VCBO VCEO IC ICM Ptot VCEsat tf PARAMETER Collector-emitter voltage peak value Collector-Base voltage (open emitter) Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Fall time CONDITIONS VBE = 0 V TYP. 88 MAX. 850 850 450 2 3 18 1.0 150 UNIT V V V A A W V ns Tmb 25 C IC = 1.0 A;IB = 0.2 A Ic=1A,IB1=0.2A,IB2=0.2A PINNING - SOT186A PIN 1 2 3 base collector emitter DESCRIPTION PIN CONFIGURATION case SYMBOL c b 123 case isolated e LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL VCESM VCEO VCBO IC ICM IB IBM Ptot Tstg Tj PARAMETER Collector to emitter voltage Collector to emitter voltage (open base) Collector to base voltage (open emitter) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature CONDITIONS VBE = 0 V MIN. -65 MAX. 850 450 850 2 3 0.75 1 18 150 150 UNIT V V V A A A A W C C Tmb 25 C THERMAL RESISTANCES THERMAL RESISTANCES SYMBOL Rth j-mb Rth j-a PARAMETER Junction to mounting base Junction to ambient in free air CONDITIONS TYP. 55 MAX. 7.2 UNIT K/W K/W August 1998 1 Rev 1.000 Philips Semiconductors Objective specification Silicon Diffused Power Transistor BUJ202AX ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER Repetitive peak voltage from all three terminals to external heatsink CONDITIONS R.H. 65% ; clean and dustfree MIN. TYP. MAX. 1500 UNIT V Cisol Capacitance from T2 to external f = 1 MHz heatsink - 12 - pF STATIC CHARACTERISTICS Tmb = 25 C unless otherwise specified SYMBOL ICES ICES IEBO VCEOsust VCEsat VBEsat hFE PARAMETER Collector cut-off current 1 CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 C VEB = 5 V; IC = 0 A IB = 0 A; IC = 100 mA; L = 25 mH IC = 1 A; IB = 0.2 A IC = 1 A; IB = 0.2 A IC = 10 mA; VCE = 5 V IC = 100 mA; VCE = 5 V MIN. 450 10 14 TYP. - MAX. 0.2 1.5 1 1.0 1.1 35 35 UNIT mA mA mA V V V Emitter cut-off current Collector-emitter sustaining voltage Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain DYNAMIC CHARACTERISTICS Tmb = 25 C unless otherwise specified SYMBOL PARAMETER Switching times (resistive load) ton ts tf Turn-on time Turn-off storage time Turn-off fall time Switching times (inductive load) ts tf ts tf Turn-off storage time Turn-off fall time Switching times (inductive load) Turn-off storage time Turn-off fall time CONDITIONS ICon = 1.0 A; IBon = -IBoff = 0.2 A; RL = 75 ohms; VBB2 = 4 V; TYP. MAX. UNIT s s s s ns s ns - 0.5 3.5 1.4 ICon = 1.0 A; IBon = 0.2 A; LB = 1 H; -VBB = 5 V ICon = 1.0 A; IBon = 0.2 A; LB = 1 H; -VBB = 5 V; Tj = 100 C 88 1.4 150 - 1.5 200 1 Measured with half sine-wave voltage (curve tracer). August 1998 2 Rev 1.000 Philips Semiconductors Objective specification Silicon Diffused Power Transistor BUJ202AX MECHANICAL DATA Dimensions in mm Net Mass: 2 g 10.3 max 3.2 3.0 4.6 max 2.9 max Recesses (2x) 2.5 0.8 max. depth 2.8 6.4 15.8 19 max. max. seating plane 15.8 max 3 max. not tinned 3 2.5 13.5 min. 1 0.4 M 2 3 1.0 (2x) 0.6 2.54 0.5 2.5 1.3 0.9 0.7 5.08 Fig.1. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". August 1998 3 Rev 1.000 Philips Semiconductors Objective specification Silicon Diffused Power Transistor BUJ202AX DEFINITIONS Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1998 4 Rev 1.000 |
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