Part Number Hot Search : 
RL155G N316AD MAX550B 01QXC GR2GA SM1608C HC55182 2N342
Product Description
Full Text Search
 

To Download CEG8208 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 Dual N-Channel Enhancement Mode Field Effect Transistor FEATURES
20V, 6.5A, RDS(ON) = 22m @VGS = 4.5V. RDS(ON) = 32m @VGS = 2.5V. Super High dense cell design for extremely low RDS(ON). High power and current handing capability. Lead free product is acquired. TSSOP-8 for Surface Mount Package. ESD Protected: HBM 2000 V
G2 S2 S2 D G1 S1 S1 D
CEG8208
D D
G1
*1K
G2
*1K
S1 *Typical value by design
S2
D
1
8 7 6 5
D S2 S2 G2
S1 2 S1 3 G1 4
TSSOP-8
ABSOLUTE MAXIMUM RATINGS
Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous Drain Current-Pulsed
a
TA = 25 C unless otherwise noted Symbol VDS VGS ID IDM PD TJ,Tstg Limit 20 Units V V A A W C
12
6.5 25 1.5 -55 to 150
Maximum Power Dissipation Operating and Store Temperature Range
Thermal Characteristics
Parameter Thermal Resistance, Junction-to-Ambient b Symbol RJA Limit 83 Units C/W
Details are subject to change without notice . 1
Rev 3. 2006.Aug http://www.cetsemi.com
CEG8208
Electrical Characteristics
Parameter Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Body Leakage Current, Reverse On Characteristics Gate Threshold Voltage Static Drain-Source On-Resistance Dynamic Characteristics c Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics c Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage b td(on) tr td(off) tf Qg Qgs Qgd IS VSD VGS = 0V, IS = 1.5A VDS = 10V, ID =5A, VGS = 4.5V VDD = 10V, ID = 1A, VGS = 4.5V, RGEN = 6 0.35 0.87 3.60 2.01 4.3 1.1 2.5 1.5 1.2 0.7 1.8 7.5 4.3 7.5 us us us us nC nC nC A V gFS Ciss Coss Crss VDS = 10V, ID = 5A VDS = 25V, VGS = 0V, f = 1.0 MHz 17 40 115 15 S pF pF pF VGS(th) RDS(on) VGS = VDS, ID = 250A VGS = 4.5V, ID = 5A VGS = 2.5V, ID = 4A 0.5 18 24 1.2 22 32 V m m BVDSS IDSS IGSSF IGSSR VGS = 0V, ID = 250A VDS = 20V, VGS = 0V VGS = 12V, VDS = 0V VGS = -12V, VDS = 0V 20 1 10 -10 V
A
Tc = 25 C unless otherwise noted Symbol Test Condition Min Typ Max Units
uA uA
Drain-Source Diode Characteristics and Maximun Ratings
Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature. b.Surface Mounted on FR4 board,t < 10sec. b.Pulse Test : Pulse Width < 300s, Duty Cycle < 2%. c.Guaranteed by design, not subject to production testing.
2
CEG8208
20 16 12 8 VGS=4.5,3.5,2.5V 20 25 C 16 12 8 4 0
ID, Drain Current (A)
VGS=1.5V
4 0
ID, Drain Current (A)
TJ=125 C 0.0 0.5 1.0
-55 C 1.5 2.0 2.5
0
0.5
1
1.5
2
VDS, Drain-to-Source Voltage (V) Figure 1. Output Characteristics
2.2 1.9 1.6 1.3 1.0 0.7 0.4 -100 ID=5A VGS=4.5V
VGS, Gate-to-Source Voltage (V) Figure 2. Transfer Characteristics
RDS(ON), Normalized RDS(ON), On-Resistance(Ohms)
IS, Source-drain current (A)
VGS=0V
10
1
10
0
-50
0
50
100
150
200
10
-1
0.4
0.6
0.8
1.0
1.2
1.4
TJ, Junction Temperature( C) Figure 3. On-Resistance Variation with Temperature VTH, Normalized Gate-Source Threshold Voltage
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 VDS=VGS 10 ID=250A
VSD, Body Diode Forward Voltage (V) Figure 4. Body Diode Forward Voltage Variation with Source Current
2
RDS(ON)Limit
ID, Drain Current (A)
10
1
10
0
1ms 10ms 100ms 1s DC
10
-1
-25
0
25
50
75
100
125
150
10
-2
TA=25 C TJ=150 C Single Pulse 10
-2
10
-1
10
0
10
1
10
2
TJ, Junction Temperature( C) Figure 5. Gate Threshold Variation with Temperature
VDS, Drain-Source Voltage (V) Figure 6. Maximum Safe Operating Area
3
CEG8208
VGS, Gate to Source Voltage (V)
5 V =10V DS ID=5A 4 3 2
t on td(on) VOUT
10%
toff tr
90%
td(off)
90% 10%
tf
INVERTED
90%
VIN
1 0
50% 10%
50%
PULSE WIDTH
0 1 2 3 4 5 6
Qg, Total Gate Charge (nC) Figure 7. Gate Charge VDD RL D VOUT Figure 8. Switching Waveforms
V IN VGS RGEN G
S
Figure 9. Switching Test Circuit
10
0
r(t),Normalized Effective Transient Thermal Impedance
D=0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 t2
10
-1
10
-2
Single Pulse
10
-3
1. RcJA (t)=r (t) * RcJA 2. RcJA=See Datasheet 3. TJM-TA = P* RcJA (t) 4. Duty Cycle, D=t1/t2
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
Square Wave Pulse Duration (sec) Figure 10. Normalized Thermal Transient Impedance Curve
4


▲Up To Search▲   

 
Price & Availability of CEG8208

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X