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IP3338CX24 10-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4 Rev. 01 -- 13 November 2008 Product data sheet 1. Product profile 1.1 General description The IP3338CX24 is a 10-channel1 LC low-pass filter network designed to filter undesired RF signals in the 800 MHz to 3000 MHz frequency band. In addition, the IP3338CX24 incorporates diodes which protect downstream components from ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP3338CX24 is fabricated using monolithic silicon technology and integrates 10 inductors and 20 back-to-back diodes in a single Wafer-Level Chip-Scale Package (WLCSP) measuring 2.11 mm by 2.11 mm (typical). These features make the IP3338CX24 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features I I I I Pb-free, RoHS compliant and halogen free package; Dark Green compliant Integrated 10-channel -type LC filter network with 60 nH channel inductance 125 series resistance; 25 pF (typical) capacitance per line Integrated ESD protection withstanding 15 kV contact discharge, far exceeding IEC 61000-4-2, level 4 I WLCSP with 0.4 mm pitch 1.3 Applications I I I I Cellular and Personal Communication System (PCS) mobile handsets Cordless telephones Wireless data (WAN/LAN) systems PDAs 1. Also available as a 7-channel device (IP3337CX18). NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 2. Pinning information 2.1 Pinning bump A1 index 1 IP3338CX24/LF 2 3 4 5 A B C D E 001aai820 Transparent top view Fig 1. Table 1. Pin Pin configuration IP3338CX24 Pinning Description filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 filter channel 7 filter channel 8 filter channel 9 filter channel 10 ground no ball A2 and A5 A1 and A4 B2 and B5 B1 and B4 C2 and C5 C1 and C4 D2 and D5 D1 and D4 E2 and E5 E1 and E4 A3, C3, D3, E3 B3 3. Ordering information Table 2. Ordering information Package Name Description wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm Version WLCSP24 Type number IP3338CX24/LF IP3338CX24/LF IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 2 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 4. Functional diagram Ls(ch) Rs(ch) A1, A2, B1, B2, C1, C2, D1, D2, E1, E2 A4, A5, B4, B5, C4, C5, D4, D5, E4, E5 A3, B3, C3, D3 001aai754 Fig 2. Schematic diagram IP3338CX24 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage all pins to ground contact discharge air discharge IEC 61000-4-2, level 4; all pins to ground contact discharge air discharge Ich Ich(M) Pch Ptot Tstg Treflow(peak) Tamb [1] [1] [1] Conditions Min -4.0 -15 -15 Max +4.0 +15 +15 Unit V kV kV -8 -15 -55 -35 +8 +15 10 50 10 100 260 +85 kV kV mA mA mW mW C C channel current (DC) peak channel current channel power dissipation total power dissipation storage temperature peak reflow temperature ambient temperature Tamb = 70 C Tamb = 70 C; 60 s continuous power; Tamb = 70 C Tamb = 70 C 10 s maximum +150 C Device tested with 1000 pulses of 15 kV contact discharges, according to the IEC 61000-4-2 model, which far exceeds IEC 61000-4-2, level 4 (8 kV contact discharge). IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 3 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 6. Characteristics Table 4. Channel characteristics Tamb = 25 C; unless otherwise specified. Symbol Rs(ch) Cch Ls(ch) VBR ILR [1] Parameter channel series resistance channel capacitance channel series inductance breakdown voltage reverse leakage current Conditions f = 0 Hz (DC) Vbias(DC) = 0 V; f = 1 MHz [1] Min 100 6 -10 - Typ 125 25 60 - Max Unit 150 30[1] 10 -6 100 pF nH V V nA Itest = 1 mA Itest = -1 mA per channel; VI = 3.0 V Guaranteed by design. Table 5. Frequency characteristics Tamb = 25 C; unless otherwise specified. Symbol il Parameter insertion loss Conditions Rgen = 50 ; RL = 50 800 MHz < f < 1 GHz 1 GHz < f < 3 GHz at 0 Hz; Rgen = 50 ; RL = 50 ; Vbias(DC) = 0 V f-3dB cut-off frequency measured relative to insertion loss at DC; Rgen = 50 ; RL = 50 800 MHz < f < 3 GHz; Rgen = 50 ; RL = 50 38 35 6 150 40 40 7 180 10 dB dB dB MHz Min Typ Max Unit ct crosstalk attenuation 35 40 - dB 7. Application information 7.1 Insertion loss The setup for measuring insertion loss in a 50 system is shown in Figure 3. IN 50 DUT OUT 50 TEST BOARD Vgen 001aai755 Fig 3. Frequency response measurement configuration The measured frequency response curves for all channels are shown in Figure 4. IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 4 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 0 il (dB) -10 -20 -30 (3) 001aai760 -40 -50 -60 -70 10-1 (2) (1) 1 10 102 103 f (MHz) 104 (1) Channel 1 (pins A2 and A5). (2) Channel 9 (pins E2 and E5). (3) Channel 4 (pins B1 and B4). Fig 4. Measured frequency response curves 7.2 Crosstalk The setup for measuring crosstalk in a 50 system is shown in Figure 5. IN_1 50 DUT OUT_2 OUT_1 50 50 IN_2 50 TEST BOARD Vgen 001aai756 Fig 5. Crosstalk measurement configuration The crosstalk between adjacent channels within the IP3338CX24 for different channel pairs measured in a 50 NetWork Analyzer (NWA) system, is shown in Figure 6. In all cases, all unused connections are terminated with 50 to ground. IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 5 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection ct 0 001aai758 -10 -20 -30 -40 -50 -60 -70 -80 -90 10-1 1 10 102 103 f (MHz) 104 (1) (2) (3) (4) (5) (6) (1) Channels 2 and 6 (pins A1 and C4). (2) Channels 4 and 5 (pins B1 and C5). (3) Channels 4 and 3 (pins B1 and B5). (4) Channels 4 and 7 (pins B1 and D5). (5) Channels 2 and 1 (pins A1 and A5). (6) Channels 2 and 9 (pins A1 and E5). Fig 6. Measured crosstalk between adjacent channels 8. Marking Bump A1 index LASER MARKING AREA 001aai941 top view, balls facing down Fig 7. Marking of IP3338CX24/LF IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 6 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 9. Package outline WLCSP24: wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm IP3338CX24/LF D B A bump A1 index A2 E A A1 detail X e1 e b E e D e2 C B A 1 2 3 4 5 X 0 Dimensions Unit mm A A1 A2 b D E e 0.4 e1 1.6 e2 1.6 1 scale 2 mm max 0.66 0.22 0.31 2.16 2.16 nom 0.61 0.20 0.41 0.26 2.11 2.11 min 0.56 0.18 0.21 2.06 2.06 IP3338CX24_lf_po Outline version IP3338CX24/LF References IEC JEDEC JEITA European projection Issue date 08-05-29 08-09-09 Fig 8. IP3338CX24_1 Package outline IP3338CX24/LF (WLCSP24) (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 7 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 10. Packing information R1 R2 K1 0 D1 0.1 E D T C A0 P A R3 W1 W B B 5 max T1 G B1 F E B0 A 0.2/40 D0 P0 P2 E D C A-A K0 0.1 E D C A0 K B-B 001aai751 Fig 9. Tape and reel information Table 6. Item Overall dimensions Tape dimensions Parameter tape width thickness distance outside width Sprocket holes[1] diameter distance pitch Distance between center lines length direction width direction Symbol W K G B1 D0 E P0 P2 F Specification (mm) Dimension 8.00 1.20 0.75 3.70 1.50 1.75 4.00 2.00 3.50 Tolerance 0.3 maximum minimum maximum +0.1/-0.0 0.1 0.1 0.05 0.05 IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 8 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection Tape dimensions ...continued Parameter length width depth hole diameter pitch radius radius radius depth Symbol A0 B0 K0 D1 P R1 R2 R3 K1 T W1 T1 R Specification (mm) Dimension Tolerance 0.05 0.05 0.05 0.1 0.1 maximum maximum typical -0.1 0.07 max max min 1.90 2.35 0.80 0.50 4.00 0.40 0.30 0.30 0...0.25 10 0.25 5.75 0.1 30 Table 6. Item Compartments Device Carrier tape anti-static[2] Cover tape[3] Bending pad [1] [2] [3] rotation film thickness width film thickness in winding direction Cumulative pitch error: 0.2 mm per 10 pitches. Carbon-loaded polystyrene 100 % recyclable. The cover tape must not overlap the sprocket holes. IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 9 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 11. Design and assembly recommendations 11.1 PCB design guidelines For optimum performance it is recommended to use a Non-Solder Mask PCB Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 7 for the recommended PCB design parameters. Table 7. Parameter PCB pad diameter Micro-via diameter Solder mask aperture diameter Copper thickness Copper finish PCB material Recommended PCB design parameters Value or Specification 200 m 100 m (0.004 inch) 337 m 20 m to 40 m OSP FR4 11.2 PCB assembly guidelines for Pb-free soldering Table 8. Parameter Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder/flux ratio Solder reflow profile Assembly recommendations Value or Specification 330 m 100 m (0.004 inch) SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) 50/50 see Figure 10 T (C) Treflow(peak) 250 230 217 cooling rate pre-heat t1 t2 t3 t4 t5 t (s) 001aai161 The device is capable of withstanding at least three reflows of this profile. Fig 10. Pb-free solder reflow profile IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 10 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection Characteristics Parameter time 1 time 2 time 3 time 4 time 5 rate of change of temperature cooling rate pre-heat Conditions soak time time during T 250 C time during T 230 C time during T > 217 C Min 230 60 10 30 2.5 Typ Max 255 180 30 50 150 540 -6 4.0 Unit C s s s s s C/s C/s Table 9. Symbol t1 t2 t3 t4 t5 dT/dt Treflow(peak) peak reflow temperature 12. Abbreviations Table 10. Acronym DUT EMI ESD FR4 LAN NSMD OSP PCB PCS PDA PSU RoHS WAN WLCSP Abbreviations Description Device Under Test ElectroMagnetic Interference ElectroStatic Discharge Flame Retard 4 Local Area Network Non-Solder Mask Design Organic Solderability Preservative Printed-Circuit Board Personal Communication System Personal Digital Assistant Power Supply Unit Restriction of Hazardous Substances Wide Area Network Wafer-Level Chip-Scale Package 13. Revision history Table 11. Revision history Release date 20081113 Data sheet status Product data sheet Change notice Supersedes Document ID IP3338CX24_1 IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 11 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 14. Legal information 14.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 -- 13 November 2008 12 of 13 NXP Semiconductors IP3338CX24 10-channel integrated LC-filter network with ESD input protection 16. Contents 1 1.1 1.2 1.3 2 2.1 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 11.2 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Design and assembly recommendations . . . 10 PCB design guidelines . . . . . . . . . . . . . . . . . . 10 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 November 2008 Document identifier: IP3338CX24_1 |
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