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 HD74UH00
2-input NAND Gate
REJ03D0199-0400Z (Previous ADE-205-014B (Z)) Rev.4.00 Jan.30.2004
Description
The HD74UH00 is high-speed CMOS two input NAND gate using silicon gate CMOS process. With CMOS low power dissipation, it provides high-speed equivalent to LS-TTL series. The internal circuit of three stages construction with buffer provides wide noise margin and stable output.
Features
* Encapsulated in very small 5pins package of 2.9 x 1.6 x 1.1 mm, the efficiency to mount on substrate is significantly improved. * The basic gate function is lined up as Renesas uni logic series. * Supplied on emboss taping for high-speed automatic mounting. * Electrical characteristics equivalent to the HD74HC00 Supply voltage range: 2 to 6 V Operating temperature range: -40 to +85C * | IOH | = IOL = 2 mA (min) * Ordering Information
Part Name HD74UH00EL Package Type MPAK-5 pin Package Code MPAK-5V Package Abbreviation - Taping Abbreviation (Quantity) EL (3,000 pcs/reel)
Rev.4.00, Jan.30.2004, page 1 of 6
HD74UH00
Pin Arrangement
IN B
1
5
VCC
IN A
2
GND
3
4
OUT X
(Top view)
Article Indication
Marking Lot number
H
1
A
Absolute Maximum Ratings
Item Supply voltage Input voltage Output voltage Input diode current Output diode current Output current VCC/GND current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC, IGND PT Tstg Ratings -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 20 20 25 25 200 -65 to +150 Unit V V V mA mA mA mA mW C
Rev.4.00, Jan.30.2004, page 2 of 6
HD74UH00
Recommended Operating Conditions
Item Supply voltage Input voltage Output voltage Operating temperature Input rise/fall time Symbol VCC VIN VOUT Topr tr, tf Ratings 2 to 6 0 to VCC 0 to VCC -40 to +85 0 to 1000 (VCC = 2.0 V) 0 to 500 (VCC = 4.5 V) 0 to 400 (VCC = 6.0 V) Unit V V V C ns
Electrical Characteristics
VCC Item Input voltage Symbol (V) VIH 2.0 4.5 6.0 VIL 2.0 4.5 6.0 Output voltage VOH 2.0 4.5 6.0 4.5 6.0 VOL 2.0 4.5 6.0 4.5 6.0 Input current Operating current IIN ICC 6.0 6.0 Ta = 25C Min 1.5
Ta = -40 to 85C
Typ Max Min -- -- -- -- 0.5 1.5 3.15 4.2 --
Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 10.0
Unit Test Conditions V
3.15 -- 4.2 -- -- -- 1.9 4.4 5.9 -- -- -- -- 2.0 4.5 6.0
V
1.35 -- 1.8 -- -- -- -- 1.9 4.4 5.9 4.31 5.63 -- -- --
V
VIN = VIH or VIL IOH = -20 A
4.18 4.31 -- 5.68 5.80 -- -- -- -- -- -- -- -- 0.0 0.0 0.0 0.1 0.1 0.1
IOH = -2 mA IOH = -2.6 mA V VIN = VIH IOL = 20 A
0.17 0.26 -- 0.18 0.26 -- -- -- 0.1 -- 1.0 --
IOL = 2 mA IOL = 2.6 mA A VIN = VCC or GND VIN = VCC or GND
Rev.4.00, Jan.30.2004, page 3 of 6
HD74UH00
Switching Characteristics
(CL = 15 pF, tr = tf = 6 ns, VCC = 5 V)
Ta = 25C Item Output rise/fall time Symbol tTLH tTHL tPLH tPHL Min -- Typ 5 Max 10 Unit ns Test Conditions See Test circuit
Propagation delay time
--
7
15
ns
See Test circuit
(CL = 50 pF, tr = tf = 6 ns)
VCC Ta = 25C Item Output rise/fall time Symbol (V) tTLH tTHL Min Typ 50 14 12 48 12 9 5 10 Ta = -40 to 85C Max Min 125 25 21 100 20 17 10 -- -- -- -- -- -- -- -- -- Max 155 31 26 125 25 21 10 -- pF ns See under figure Unit ns Test Conditions See under figure
2.0 -- 4.5 -- 6.0 --
Propagation delay time
tPLH tPHL
2.0 -- 4.5 -- 6.0 --
Input capacitance
CIN
-- --
-- --
Equivalent capacitance CPD
Note: CPD is equivalent capacitance inside of the IC calculated from the operating current without load (see test circuit). The average operating current without load is calculated according to the expression below. ICC(opr) = CPD* VCC* fIN + ICC
Rev.4.00, Jan.30.2004, page 4 of 6
HD74UH00
Test Circuit
VCC
Pulse generator
Input
Output
50
CL
Note:
Operating current test time, output is open.
Waveforms
6 ns 6 ns
90% Input 50% 10% t THL 90% Output 50% 10% t PHL
90% 50% 10% t TLH 90% 50% 10% t PLH
VCC
GND
VOH
VOL
Rev.4.00, Jan.30.2004, page 5 of 6
HD74UH00
Package Dimensions
Unit: mm
1.9 0.2 0.95 0.95
0.16
+ 0.1 - 0.05
0.6
+ 0.2 0.6 1.6 - 0.1
5 - 0.4 - 0.05 2.9 0.2
0.3
+ 0.1
+ 0.2 1.1 - 0.1
2.8
+ 0.2 - 0.3
0 - 0.1
Package Code JEDEC JEITA Mass (reference value)
MPAK-5V -- -- 0.015 g
Rev.4.00, Jan.30.2004, page 6 of 6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0


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