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PUMX2
NPN/NPN general-purpose double transistors
Rev. 01 -- 10 November 2005 Product data sheet
1. Product profile
1.1 General description
NPN/NPN general-purpose double transistors in a small SOT363 (SC-88) Surface Mounted Device (SMD) plastic package.
1.2 Features
s Simplifies circuit design s Reduces component count s Reduces pick and place costs
1.3 Applications
s General-purpose switching and amplification
1.4 Quick reference data
Table 1: Symbol VCEO IC hFE Quick reference data Parameter collector-emitter voltage collector current DC current gain VCE = 6 V; IC = 1 mA Conditions open base Min 120 Typ 250 Max 50 150 560 Unit V mA
Per transistor
2. Pinning information
Table 2: Pin 1 2 3 4 5 6 Pinning Description emitter TR1 emitter TR2 base TR2 collector TR2 base TR1 collector TR1
1 2 3 1 2 3
006aaa653
Simplified outline
6 5 4
Symbol
6 TR1 5 4 TR2
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
3. Ordering information
Table 3: Ordering information Package Name PUMX2 SC-88 Description plastic surface mounted package; 6 leads Version SOT363 Type number
4. Marking
Table 4: PUMX2
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
Marking codes Marking code [1] Z1*
Type number
5. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Per device Ptot Tstg Tj Tamb
[1]
Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation total power dissipation storage temperature junction temperature ambient temperature
Conditions open emitter open base open collector single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C Tamb 25 C
[1]
Min -65 -65
Max 60 50 7 150 200 100 180 300 +150 150 +150
Unit V V V mA mA mA mW mW C C C
Per transistor
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
PUMX2_1
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 10 November 2005
2 of 8
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
6. Thermal characteristics
Table 6: Symbol Rth(j-a) Per device Rth(j-a)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to ambient Conditions in free air
[1]
Min -
Typ -
Max 694
Unit K/W
Per transistor
in free air
[1]
-
-
417
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7: Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current DC current gain Conditions VCB = 60 V; IE = 0 A VCB = 60 V; IE = 0 A; Tj = 150 C VEB = 7 V; IC = 0 A VCE = 6 V; IC = 1 mA Min 120 100 Typ 250 Max 100 50 100 560 250 3 mV MHz pF Unit nA A nA Per transistor
IEBO hFE VCEsat fT Cc
collector-emitter IC = 50 mA; IB = 5 mA saturation voltage transition frequency collector capacitance VCE = 12 V; IE = 2 mA; f = 100 MHz VCB = 12 V; IE = ie = 0 A; f = 1 MHz
PUMX2_1
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 10 November 2005
3 of 8
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
8. Package outline
2.2 1.8 6 5 4 0.45 0.15 1.1 0.8
2.2 1.35 2.0 1.15
pin 1 index
1 0.65 1.3 Dimensions in mm
2
3 0.3 0.2 0.25 0.10 04-11-08
Fig 1. Package outline SOT363 (SC-88)
9. Packing information
Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number PUMX2 Package SOT363 Description 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2
[1] [2] [3]
[2] [3]
Packing quantity 3000 -115 -125 10000 -135 -165
For further information and the availability of packing methods, see Section 16. T1: normal taping T2: reverse taping
PUMX2_1
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 10 November 2005
4 of 8
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
10. Soldering
2.65 0.60 (2x)
2.35
0.40 0.90 2.10 (2x) 0.50 (4x)
solder paste solder lands solder resist occupied area
0.50 (4x)
1.20 2.40
MSA432
Dimensions in mm
Fig 2. Reflow soldering footprint SOT363 (SC-88)
5.25
4.50
0.30 1.00 4.00
solder lands solder resist occupied area 1.15 3.75 transport direction during soldering
MSA426
Dimensions in mm
Fig 3. Wave soldering footprint SOT363 (SC-88)
PUMX2_1
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 10 November 2005
5 of 8
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
11. Revision history
Table 9: PUMX2_1 Revision history Release date 20051110 Data sheet status Product data sheet Change notice Doc. number Supersedes Document ID
PUMX2_1
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 10 November 2005
6 of 8
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
12. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
15. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
PUMX2_1
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 10 November 2005
7 of 8
Philips Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
17. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 3 3 4 4 5 6 7 7 7 7 7
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 10 November 2005 Document number: PUMX2_1
Published in The Netherlands

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