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| Datasheet File OCR Text: |
| .472 12.00 BSC DOCUMENT CONTROL NO. PD - 1804 REVISION: C DATE: 03/09/05 Square .394 10.00 BSC Square .004 .008 0.09 0.20 GAUGE PLANE 0.25 mm .018 0.45 .030 0.75 .039 1.00 REF 1 .063 1.60 Max. .004 0.10 Seating Plane .007 0.17 .010 0.27 .019 0.50 BSC .002 .006 0.05 0.15 .053 .057 1.35 1.45 X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS Notes: 1. All dimensions in millimeters 2. Ref.: JEDEC MS-026D/BCD 3. Package Outline Exclusive of Mold Flash and Metal Burr Pericom Semiconductor Corporation 3545 N. 1st Street, San Jose, CA 95134 1-800-435-2335 * www.pericom.com DESCRIPTION: 64-Pin Low Profile Quad Flat Package, LQFP PACKAGE CODE: FC |
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