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 SI4463BDY
New Product
Vishay Siliconix
P-Channel 2.5-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W)
0.011 @ VGS = -10 V -20 0.014 @ VGS = -4.5 V 0.020 @ VGS = -2.5 V
ID (A)
-13.7 -12.3 -10.3
S
SO-8
S S S G 1 2 3 4 Top View Ordering Information: SI4463BDY--E3 (Lead Free) SI4463BDY-T1--E3 (Lead Free with Tape and Reel) 8 7 6 5 D D D D G
D P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS ID IDM IS PD TJ, Tstg
10 secs
Steady State
-20 "12
Unit
V
-13.7 -11.1 -50 -2.7 3.0 1.9 -55 to 150
-9.8 -7.9 A
-1.36 1.5 0.95 W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 72789 S-40433--Rev. A, 15-Mar-04 www.vishay.com t v 10 sec Steady State Steady State
Symbol
RthJA RthJF
Typical
35 70 17
Maximum
42 84 21
Unit
_C/W C/W
1
SI4463BDY
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = -250 mA VDS = 0 V, VGS = "12 V VDS = -20 V, VGS = 0 V VDS = -20 V, VGS = 0 V, TJ = 70_C VDS = -5 V, VGS = -4.5 V VGS = -10 V, ID = -13.7 A Drain-Source On-State Resistancea rDS(on) VGS = -4.5 V, ID = -12.3 A VGS = -2.5 V, ID = -5 A Forward Transconductancea Diode Forward Voltagea gfs VSD VDS = -10 V, ID = -13.7 A IS = -2.7 A, VGS = 0 V -30 0.0085 0.010 0.015 44 -0.7 -1.1 0.011 0.014 0.020 S V W -0.6 -1.4 "100 -1 -10 V nA mA A
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd Rg td(on) tr td(off) tf trr IF = -2.3 A, di/dt = 100 A/ms VDD = -10 V, RL = 10 W ID ^ -1 A, VGEN = -4.5 V, Rg = 6 W f = 1 MHz VDS = -10 V, VGS = -4.5 V, ID = -13.7 A 37 8.7 11 2.7 35 60 115 75 50 55 90 170 115 75 ns W 56 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
50 VGS = 10 thru 2.5 V 40 I D - Drain Current (A) I D - Drain Current (A) 40 50
Transfer Characteristics
30 2V 20
30
20 TC = 125_C 10 25_C 0 0.0 -55_C 0.5 1.0 1.5 2.0 2.5
10 1.5 V 0 0 1 2 3 4 5 VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V) Document Number: 72789 S-40433--Rev. A, 15-Mar-04
www.vishay.com
2
SI4463BDY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.04 r DS(on) - On-Resistance ( W ) 5000
Vishay Siliconix
Capacitance
0.03
C - Capacitance (pF)
4000
Ciss
3000
0.02
VGS = 2.5 V VGS = 4.5 V
2000 Coss 1000
0.01 VGS = 10 V 0.00 0 10 20 30 40 50
Crss 0 0 4 8 12 16 20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 13.7 A 4 rDS(on) - On-Resiistance (Normalized) 1.4 1.3 1.2 1.1 1.0 0.9 0.8 -50
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 13.7 A
3
2
1
0 0 5 10 15 20 25 30 35 40 Qg - Total Gate Charge (nC)
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
50 0.05
On-Resistance vs. Gate-to-Source Voltage
ID = 5 A r DS(on) - On-Resistance ( W ) 0.04 ID = 13.7 A 0.03
I S - Source Current (A)
TJ = 150_C 10
0.02
TJ = 25_C
0.01
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 6 7 8 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 72789 S-40433--Rev. A, 15-Mar-04
www.vishay.com
3
SI4463BDY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.6 50
Single Pulse Power, Junction-to-Ambient
0.4 V GS(th) Variance (V) ID = 250 mA Power (W) 0.2
40
30
0.0
20
-0.2
10
-0.4 -50
-25
0
25
50
75
100
125
150
0 0.01
0.1
1 Time (sec)
10
100
600
TJ - Temperature (_C)
100 rDS(on) Limited 10 I D - Drain Current (A)
Safe Operating Area
IDM Limited
P(t) = 0.001 P(t) = 0.01 P(t) = 0.1 P(t) = 1
1
ID(on) Limited
0.1
TC = 25_C Single Pulse BVDSS Limited
P(t) = 10 dc
0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 1 Square Wave Pulse Duration (sec) 10-1
Notes: PDM t1
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 70_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
t1 t2
10
100
600
www.vishay.com
4
Document Number: 72789 S-40433--Rev. A, 15-Mar-04
SI4463BDY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1
Vishay Siliconix
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (sec) 1 10
Document Number: 72789 S-40433--Rev. A, 15-Mar-04
www.vishay.com
5


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