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July 1996
NDH831N N-Channel Enhancement Mode Field Effect Transistor
General Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and portable electronics where fast switching, low in-line power loss, and resistance to transients are needed.
Features
5.8A, 20V. RDS(ON) = 0.03 @ VGS = 4.5V RDS(ON) = 0.04 @ VGS = 2.7V.
High density cell design for extremely low RDS(ON). Enhanced SuperSOTTM-8 small outline surface mount package with high power and current handling capability.
____________________________________________________________________________________________
5 6 7 8
4 3 2 1
Absolute Maximum Ratings TA = 25C unless otherwise noted Symbol VDSS VGSS ID PD Parameter Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed Maximum Power Dissipation
(Note 1a) (Note 1b) (Note 1c) (Note 1a)
NDH831N 20 8 5.8 20 1.8 1 0.9 -55 to 150
Units V V A
W
TJ,TSTG
Operating and Storage Temperature Range
C
THERMAL CHARACTERISTICS RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note 1a) (Note 1)
70 20
C/W C/W
(c) 1997 Fairchild Semiconductor Corporation
NDH831N Rev. D
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current VGS = 0 V, ID = 250 A VDS = 16 V, VGS = 0 V TJ= 55C Gate - Body Leakage, Forward Gate - Body Leakage, Reverse VGS = 8 V, VDS = 0 V VGS = -8 V, VDS= 0 V VDS = VGS, ID = 250 A TJ= 125C Static Drain-Source On-Resistance VGS = 4.5 V, ID = 5.8 A TJ= 125C VGS = 2.7 V, ID = 5 A ID(on) gFS Ciss Coss Crss tD(on) tr tD(off) tf Qg Qgs Qgd On-State Drain Current VGS = 4.5 V, VDS = 5 V VGS = 2.7 V, VDS = 5 V Forward Transconductance VDS = 10 V, ID = 5.8 A VDS = 10 V, VGS = 0 V, f = 1.0 MHz DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance 720 430 155 pF pF pF 20 5 14 S 0.4 0.3 0.6 0.35 0.022 0.03 0.027 20 1 10 100 -100 V A A nA nA
ON CHARACTERISTICS (Note 2) Gate Threshold Voltage 1 0.8 0.03 0.54 0.04 A W V
SWITCHING CHARACTERISTICS (Note 2) Turn - On Delay Time Turn - On Rise Time Turn - Off Delay Time Turn - Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS = 5 V, ID = 5.8 A, VGS = 4.5 V VDD = 6 V, ID = 1 A, VGEN = 4.5 V, RGEN = 6 10 30 55 20 19.5 1.8 5.5 20 50 80 40 28 ns ns ns ns nC nC nC
NDH831N Rev. D
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Parameter Conditions Min Typ Max 1.5
(Note 2)
Units A V
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS IS VSD
Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design.
Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS = 0 V, IS = 1.5 A 0.75
1.2
PD (t) =
R J A (t)
T J-TA
=
R J C CA +R (t)
T J-TA
= I 2 (t) x RDS(ON ) D
TJ
Typical RqJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment: a. 70oC/W when mounted on a 1 in2 pad of 2oz copper. b. 125oC/W when mounted on a 0.026 in2 pad of 2oz copper. c. 135oC/W when mounted on a 0.005 in2 pad of 2oz copper.
1a
1b
1c
Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%.
NDH831N Rev. D
Typical Electrical Characteristics
30
V GS =4.5V 3.5 3.0
2
2.5
DRAIN-SOURCE ON-RESISTANCE 1.8
I D , DRAIN-SOURCE CURRENT (A)
25
20
R DS(on) NORMALIZED ,
2.7 2.0
1.6
VGS = 2.0V
15
1.4
2 .5 2 .7 3 .0 3.5 4 .0 4 .5 5.0
10
1.2
1.5
5
1
0 0 0.5 1 1.5 2 2.5 3 VDS , DRAIN-SOURCE VOLTAGE (V)
0.8 0 5 10 15 20 I D , DRAIN CURRENT (A) 25 30
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Gate Voltage and Drain Current.
1.6 DRAIN-SOURCE ON-RESISTANCE
2
R DS(ON) , NORMALIZED
1.4
DRAIN-SOURCE ON-RESISTANCE
I D = 5.8A VGS = 4.5V
R DS(on) , NORMALIZED
V GS = 4.5 V TJ = 125C
1.5
1.2
1
25C
1
0.8
-55C
0.6 -50
0.5
-25
0 25 50 75 100 TJ , JUNCTION TEMPERATURE (C)
125
150
0
5
10 15 20 I , DRAIN CURRENT (A)
D
25
30
Figure 3. On-Resistance Variation with Temperature.
Figure 4. On-Resistance Variation with Drain Current and Temperature.
30
1.4
V DS = 5.0V
25 ID , DRAIN CURRENT (A)
GATE-SOURCE THRESHOLD VOLTAGE
T = -55C J
125C
V th, NORMALIZED
1.2
V DS = V GS I D = 250A
25C
20
1
15
0.8
10
0.6
5
0 0 0.5 1 1.5 2 2.5 3 VGS , GATE TO SOURCE VOLTAGE (V) 3.5 4
0.4 -50
-25
0 25 50 75 100 TJ , JUNCTION TEMPERATURE (C)
125
150
Figure 5. Transfer Characteristics.
Figure 6. Gate Threshold Variation with Temperature.
NDH831N Rev. D
Typical Electrical Characteristics
DRAIN-SOURCE BREAKDOWN VOLTAGE
1.12
I D = 250A
I S , REVERSE DRAIN CURRENT (A)
30 10 5 1
V GS = 0V
BV DSS , NORMALIZED
1.08
1.04
TJ = 125C
0.1
25C
-55C
1
0.01
0.96
0.001
0.92 -50
-25
0 25 50 75 100 TJ , JUNCTION TEMPERATURE (C)
125
150
0.0001 0 0.2 0.4 0.6 0.8 1 1.2 V SD , BODY DIODE FORWARD VOLTAGE (V) 1.4
Figure 7. Breakdown Voltage Variation with Temperature.
Figure 8. Body Diode Forward Voltage Variation with Current and Temperature.
3000 2000
5 V GS , GATE-SOURCE VOLTAGE (V)
I D = 5.8A
4
V DS = 5V 15V 10V
CAPACITANCE (pF)
1000
C iss C oss
3
500 300 200
2
f = 1 MHz V GS = 0 V
C rss
1
100 0.1
0
0.2 0.5 1 2 5 10 20 V DS , DRAIN TO SOURCE VOLTAGE (V)
0
5
10 15 Q g , GATE CHARGE (nC)
20
25
Figure 9. Capacitance Characteristics.
Figure 10. Gate Charge Characteristics.
VDD V IN
D
t on
t off tr
90%
RL V OUT
t d(on)
t d(off)
90%
tf
VGS
VOUT
R GEN
10%
10%
INVERTED
G
DUT 90% S
V IN
10%
50%
50%
PULSE WIDTH
Figure 11. Switching Test Circuit
Figure 12. Switching Waveforms
NDH831N Rev. D
Typical Thermal Characteristics
25 2.5
V DS = 5.0V
20 STEADY-STATE POWER DISSIPATION (W) , TRANSCONDUCTANCE (SIEMENS)
TJ = -55C 25C
15
2
1a
1.5
125C
10
1
1b 1c
5
0.5
4.5"x5" FR-4 Board TA = 2 5 o C Still Air
g 0 0 5 10 I D , DRAIN CURRENT (A) 15 20
FS
0 0
0.2 0.4 0.6 0.8 2oz COPPER MOUNTING PAD AREA (in 2 )
1
Figure 13. Transconductance Variation with Drain Current and Temperature.
Figure 14. SuperSOTTM-8 Maximum Steady-State Power Dissipation versus Copper Mounting Pad Area.
7 I D , STEADY-STATE DRAIN CURRENT (A)
30 10
10
RD S(O LIM N) IT
0u
s
6 ID , DRAIN CURRENT (A)
1a
1m 10 10 0m ms s
s
3 1 0.3
5
1s
1b
V GS = 4.5V
0.1 0.03 0.01 0.1
10 s DC
4
1c 4.5"x5" FR-4 Board TA = 25 C Still Air VG S = 4.5V
o
SINGLE PULSE R J A = See Note 1c T A = 25C
0.2 0.5 1 2 5 10 V DS , DRAIN-SOURCE VOLTAGE (V) 20 40
3
0
0.2 0.4 0.6 0.8 2 2oz COPPER MOUNTING PAD AREA (in )
1
Figure 15. Maximum Steady-State Drain Current versus Copper Mounting Pad Area.
1
r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE
Figure 16. Maximum Safe Operating Area.
0 .5 0 .3 0 .2 0 .1 0.05
D = 0.5
0.2 0.1 0.05 0.02
R JA (t) = r(t) * R JA R JA = See Note 1c
P(pk)
t1 TJ - T
t2
0.03 0.02 0.01 0 .0 0 0 1
0.01 Single Pulse
= P * R JA (t) A Duty Cycle, D = t 1 / t 2 0 .0 1 0 .1 t 1, TIME (sec) 1 10 100 300
0 .001
Figure 17. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change depending on the circuit board design.
NDH831N Rev. D
SuperSOTTM-8 Tape and Reel Data and Package Dimensions
SSOT-8 Packaging Configuration: Figure 1.0
Customized Label
Packaging Description:
SSOT-8 parts are shipped in tape. The carrier tape is made from a di ssipat ive (carbo n filled) po ly carbon ate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film , adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped w ith 3,000 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 unit s per 7" or 177cm diameter reel. This and some other options are further described in the Packagin g Information table. These full reels are in di vidu ally barcod e labeled and placed inside a standard intermediate box (ill ustrated in figure 1.0) made of recyclable corrugated brow n paper. One box contains two reels maximum. And t hese boxes are placed ins ide a barcode labeled shipp ing bo x whic h comes in di fferent sizes depend in g on t he nu mber of parts shippe d.
F63TNR Label Anti static Cover Tape
Static Dissi pat ive Emboss ed Carrier Tape
F852 831N F852 831N F852 831N F852 831N F852 831N
Pin 1
SSOT-8 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard
(no f l ow c ode )
D84Z TNR 500 7" Dia 184x187x47 1,000 0.0416 0.0980
TNR 3,000 13" D ia 343x64x343 6,000 0.0416 0.5615
SSOT-8 Unit Orientation
343mm x 342mm x 64mm Intermediate box for Standar d and L99Z Opti ons
F63TNR Label
F63TNR Label
F63TNR Labe l sa mpl e 184mm x 187mm x 47mm Pizza Box fo r D84Z Option F63TNR Label
LOT: CBVK741B019 FSID: FDR835N QTY: 3000 SPEC:
SSOT-8 Tape Leader and Trailer Configuration: Figur e 2.0
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN: N/F: F
(F63TNR)3
Carrier Tape Cover Tape
Components Traile r Tape 300mm mi nimum or 38 empty pockets Lead er Tape 500mm mi nimum or 62 empty poc kets
August 1999, Rev. C
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SSOT-8 Embossed Carrier Tape Configuration: Figur e 3.0
T E1 P0
D0
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter Pkg type SSOT-8 (12mm)
A0
4.47 +/-0.10
B0
5.00 +/-0.10
W
12.0 +/-0.3
D0
1.55 +/-0.05
D1
1.50 +/-0.10
E1
1.75 +/-0.10
E2
10.25 mi n
F
5.50 +/-0.05
P1
8.0 +/-0.1
P0
4.0 +/-0.1
K0
1.37 +/-0.10
T
0.280 +/-0.150
Wc
9.5 +/-0.025
Tc
0.06 +/-0.02
Notes : A0, B0, and K0 dimensions are deter mined with r espec t to t he EIA/Jedec RS-481 rotationa l and lateral movement requi remen ts (see sketches A, B, and C).
20 deg maximum Typical component cavity center line
0.5mm maximum
B0 20 deg maximum component rotation
0.5mm maximum
Sketch A (Si de or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
SSOT-8 Reel Configuration: Figur e 4.0
Component Rotation
W1 Measured at Hub
Dim A Max
Dim A max
Dim N
See detail AA
7" Diameter Option
B Min Dim C See detail AA W3
Dim D min
13" Diameter Option
W2 max Measured at Hub DETAIL AA
Dimensions are in inches and millimeters
Tape Size
12mm
Reel Option
7" Dia
Dim A
7.00 177.8 13.00 330
Dim B
0.059 1.5 0.059 1.5
Dim C
512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2 0.795 20.2
Dim N
5.906 150 7.00 178
Dim W1
0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0
Dim W2
0.724 18.4 0.724 18.4
Dim W3 (LSL-USL)
0.469 - 0.606 11.9 - 15.4 0.469 - 0.606 11.9 - 15.4
12mm
13" Dia
(c) 1998 Fairchild Semiconductor Corporation
July 1999, Rev. C
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SuperSOTTM-8 (FS PKG Code 34, 35)
1:1
Scale 1:1 on letter size paper
Di mensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.0416
September 1998, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
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DISCLAIMER
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SyncFETTM TinyLogicTM UHCTM VCXTM
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LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. D

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