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  Datasheet File OCR Text:
 GF1A THRU GF1M
SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts
* E D
DO-214BA
Forward Current - 1.0 Ampere
FEATURES
Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Ideal for surface mount automotive applications High temperature metallurgically bonded construction Glass passivated cavity-free junction Capable of meeting environmental standards of MIL-S-19500 Built-in strain relief Easy pick and place High temperature soldering guaranteed: 450C/5 seconds at terminals Complete device submersible temperature of 265C for 10 seconds in solder bath
E P A T
N
0.060 (1.52) 0.040 (1.02)
T
0.187 (4.75) 0.167 (4.24)
0.0105 (0.27) 0.0065 (0.17)
0.118 (3.00) 0.106 (2.69)
0.108 (2.74) 0.098 (2.49)
0.060 (1.52) 0.030 (0.76)
0.152 TYP. 0.006 0.226 (5.74) 0.196 (4.98)
0.114 (2.90) 0.094 (2.39)
Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846
(R)
*Glass-plastic encapsulation technique is covered by
Dimensions in inches and (millimeters)
MECHANICAL DATA
Case: JEDEC DO-214BA molded plastic over glass body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0048 ounces, 0.120 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
GF1A GA
GF1B GB
GF1D GD
GF1G GG
GF1J GJ
GF1K GK
GF1M GM
UNITS
Device marking code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=125C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current at rated DC blocking voltage Typical reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range TA=25C TA=125C VRRM VRMS VDC I(AV)
50 35 50
100 70 100
200 140 200
400 280 400 1.0
600 420 600
800 560 800
1000 700 1000
Volts Volts Volts Amp
IFSM VF IR trr CJ RJA RJL TJ, TSTG
30.0 1.10 5.0 50.0 2.0 15.0 80.0 26.0 -65 to +175 1.20
Amps Volts A s pF C/W C
NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied VR=4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
4/98
RATINGS AND CHARACTERISTIC CURVES GF1A THRU GF1M
FIG. 1 - FORWARD CURRENT DERATING CURVE AVERAGE FORWARD RECTIFIED CURRENT, AMPERES
60 HZ RESISTIVE OR INDUCTIVE LOAD P.C.B. MOUNTED on 0.2 x 0.2" (5.0 x 5.0mm) COPPER PAD AREAS
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
30
PEAK FORWARD SURGE CURRENT, AMPERES
1.0
25 20 15 10 5.0 0
TJ=TJ max. 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method)
0.5
0 100
110
120
130
140
150
160
175
LEAD TEMPERATURE, C
1
10
NUMBER OF CYCLES AT 60 HZ
100
FIG. 3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS INSTANTANEOUS REVERSE CURRENT, MICROAMPERES
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
10
INSTANTANEOUS FORWARD CURRENT, AMPERES
10
TJ=25C PULSE WIDTH=300s 1% DUTY CYCLE
1
TJ=100C
1
0.1
0.1
TJ=25C
0.01
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE, %
0.01 0.4
0.6
0.8
1.0
1.2
1.4
1.6
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
TJ=25C f=1.0 MHZ Vsig=50mVp-p
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE TRANSIENT THERMAL IMPEDANCE (C/W)
30
JUNCTION CAPACITANCE, pF
100
MOUNTED ON 0.20 x 0.27" (5 x 7mm) COPPER PAD AREAS
10
10
1
1
1
10
REVERSE VOLTAGE, VOLTS
100
0.1 0.01
0.1
1
t, PULSE DURATION, sec
10
100


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Price & Availability of GF1D
Newark

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Rutronik

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Chip 1 Exchange

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Avnet Silica

Part # Manufacturer Description Price BuyNow  Qty.
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Symmetry Electronics

Part # Manufacturer Description Price BuyNow  Qty.
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Wuhan P&S

Part # Manufacturer Description Price BuyNow  Qty.
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