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STL50NH3LL N-channel 30V - 0.011 - 13A - PowerFLATTM (6x5) Ultra low gate charge STripFETTM Power MOSFET General features Type STL50NH3LL VDSS 30V RDS(on) <0.013 ID 13A (4) Improved die-to-footprint ratio Very low profile package (1mm max) Very low thermal resistance Very low gate charge Low threshold device PowerFLATTM( 6x5 ) Description This application specific Power MOSFET is the latest generation of STMicroelectronics unique "STripFETTM" technology. The resulting transistor is optimized for low on-resistance and minimal gate charge. The Chip-scaled PowerFLATTM package allows a significant board space saving, still boosting the performance. Internal schematic diagram Applications Switching application Order codes Part number STL50NH3LL Marking L50NH3LL Package PowerFLATTM (6x5) Packaging Tape & reel March 2006 Rev 7 1/12 www.st.com 12 Contents: STL50NH3LL Contents: 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 Test circuit ................................................ 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2/12 STL50NH3LL Electrical ratings 1 Electrical ratings Table 1. Symbol VDS VGS(1) VGS(2) ID(3) ID(4) IDM ID (5) (4) Absolute maximum ratings Parameter Drain-source voltage (VGS = 0) Gate-source voltage Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC=100C Drain current (pulsed) Drain current (continuous) at TC = 25C Total dissipation at T C = 25C Total dissipation at T C = 25C Derating factor Value 30 16 18 27 8.1 108 13 4 60 0.03 -55 to 150 Unit V V V A A A A W W W/C C PTOT (4) PTOT (3) TJ Tstg Operating junction temperature Storage temperature 1. Continuous mode 2. Guaranteed for test time < 15ms 3. The value is rated according R thj-c and is limited by wire bonding 4. The value is rated according R thj-pcb 5. Pulse width limited by safe operating area Table 2. Symbol Rthj-case Rthj-pcb (1) Thermal resistance Parameter Thermal resistance junction-case (Drain) Thermal resistance junction-ambient Value 2.08 31.3 Unit C/W C/W 1. When mounted on FR-4 board of 1inch, 2oz Cu, t < 10sec Table 3. Symbol IAR EAS Avalanche data Parameter Not-repetitive avalanche current (pulse width limited by Tj Max) Single pulse avalanche energy (starting Tj=25C, Id=Iav, Vdd=24V) Value 6 800 Unit A mJ 3/12 Electrical characteristics STL50NH3LL 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol V(BR)DSS IDSS On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test condictions ID = 250A, VGS= 0 VDS = Max rating, VDS = Max rating @125C VGS = 16V VDS= V GS, ID = 250A VGS= 10V, ID= 6.5A VGS= 4.5V, ID= 6.5A 1 0.011 0.012 0.013 0.015 Min. 30 1 10 100 Typ. Max. Unit V A A nA V IGSS VGS(th) RDS(on) Table 5. Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd RG Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test condictions VDS =10V, ID = 6.5A Min. Typ. 32 965 285 38 9 3.7 3 12 Max. Unit S pF pF pF nC nC nC VDS =25V, f=1 MHz, VGS=0 VDD=15V, ID = 13A VGS =4.5V (see Figure 7) f=1 MHz Gate DC Bias = 0 Test signal level = 20mV open drain Gate input resistance 0.5 1.5 2.5 1. Pulsed: pulse duration=300s, duty cycle 1.5% 4/12 STL50NH3LL Electrical characteristics Table 6. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test condictions VDD =15V, ID= 6.5A, RG=4.7, VGS=4.5V (see Figure 13) Min. Typ. 15 32 18 8.5 Max. Unit ns ns ns ns Table 7. Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD=13A, VGS=0 ISD=13A, di/dt = 100A/s, VDD=20V, Tj=150C (see Figure 15) 24 17.4 1.45 Test condictions Min Typ. Max 13 52 1.3 Unit A A V ns nC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% 5/12 Electrical characteristics STL50NH3LL 2.1 Figure 1. Electrical characteristics (curves) Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 6/12 STL50NH3LL Figure 7. Gate charge vs gate-source voltage Figure 8. Electrical characteristics Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Normalized on resistance vs temperature Figure 11. Source-drain diode forward characteristics Figure 12. Normalized BVDSS vs temperature 7/12 Test circuit STL50NH3LL 3 Test circuit Figure 14. Gate charge test circuit Figure 13. Switching times test circuit for resistive load Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform 8/12 STL50NH3LL Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/12 Package mechanical data STL50NH3LL PowerFLATTM (6x5) MECHANICAL DATA mm. DIM. MIN. A A1 A3 b D D1 D2 E E1 E2 E4 e L 0.70 3.43 2.58 4.15 0.35 0.80 TYP 0.83 0.02 0.20 0.40 5.00 4.75 4.20 6.00 5.75 3.48 2.63 1.27 0.80 0.90 0.027 3.53 2.68 0.135 4.25 0.163 0.47 0.013 MAX. 0.93 0.05 MIN. 0.031 TYP. 0.032 0.0007 0.007 0.015 0.196 0.187 0.165 0.236 0.226 0.137 0.103 0.050 0.031 0.035 0.139 0.105 0.167 0.018 MAX. 0.036 0.0019 inch 10/12 STL50NH3LL Revision history 5 Revision history Table 8. Date 21-Jul-2005 14-Apr-2005 20-Jun-2005 22-Jun-2005 30-Sep-2005 04-Jan-2006 30-Mar-2006 Revision history Revision 1 2 3 4 5 6 7 First Release Final version Updated mechanical data New Rg value on Table 6 Inserted ecopack indication New footprint New template Changes 11/12 STL50NH3LL Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12 |
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