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DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BYV98 Fast soft-recovery rectifier Product specification Supersedes data of May 1993 1996 Jun 07 Philips Semiconductors Product specification Fast soft-recovery rectifier FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Available in ammo-pack. DESCRIPTION Rugged glass SOD57 package, using a high temperature alloyed BYV98 construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM IF(AV) PARAMETER non-repetitive peak reverse voltage repetitive peak reverse voltage average forward current a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS - - Ttp = 55 C; lead length = 10 mm see Fig. 2; averaged over any 20 ms period; see also Fig. 6 Tamb = 60 C; PCB mounting (see Fig.11); see Fig. 3; averaged over any 20 ms period; see also Fig. 6 Ttp = 55 C; see Fig. 4 Tamb = 60 C; see Fig. 5 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax see Fig.7 - MIN. MAX. 2100 2000 1.00 V V A UNIT IF(AV) average forward current - 0.43 A IFRM IFSM repetitive peak forward current non-repetitive peak forward current - - - 9.0 4.5 15 A A A Tstg Tj storage temperature junction temperature -65 -65 +175 +175 C C 1996 Jun 07 2 Philips Semiconductors Product specification Fast soft-recovery rectifier ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current CONDITIONS IF = 2 A; Tj = Tj max; see Fig. 8 IF = 2 A; see Fig. 8 VR = VRRMmax; see Fig. 9 VR = VRRMmax; Tj = 125 C; see Fig. 9 trr reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig. 12 f = 1 MHz; VR = 0 V; see Fig 10 when switched from IF = 1 A to VR 30 V and dIF/dt = -1 A/s; see Fig.13 MIN. - - - - - TYP. - - - - - MAX. 2.2 2.4 5 50 300 BYV98 UNIT V V A A ns Cd dI R -------dt diode capacitance maximum slope of reverse recovery current - - 30 - - 5 pF A/s THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.11. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient CONDITIONS lead length = 10 mm note 1 VALUE 46 100 UNIT K/W K/W 1996 Jun 07 3 Philips Semiconductors Product specification Fast soft-recovery rectifier GRAPHICAL DATA MGC601 BYV98 MGC600 handbook, halfpage 1.6 handbook, halfpage 0.6 IF(AV) (A) 1.2 IF(AV) (A) 0.4 0.8 0.2 0.4 0 0 100 Ttp ( C) o 0 200 0 100 Tamb ( oC) 200 a = 1.42; VR = VRRMmax; = 0.5. Switched mode application. a = 1.42; VR = VRRMmax; = 0.5. Device mounted as shown in Fig.11. Switched mode application. Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). MGC603 handbook, full pagewidth 10 IFRM (A) 8 = 0.05 6 0.1 4 0.2 2 0.5 1.0 0 -2 10 10 -1 1 10 10 2 10 3 tp (ms) 10 4 Ttp = 55C; Rth j-tp = 46 K/W. VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 2000 V. Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. 1996 Jun 07 4 Philips Semiconductors Product specification Fast soft-recovery rectifier BYV98 MGC604 handbook, full pagewidth 5 IFRM (A) 4 = 0.05 3 0.1 2 0.2 1 0.5 1.0 0 -2 10 10 -1 1 10 10 2 10 3 tp (ms) 10 4 Tamb = 60 C; Rth j-a = 100 K/W. VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 2000 V. Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. MGC599 handbook, halfpage 3 handbook, halfpage 200 MEA524 - 1 a=3 P (W) 2.5 2 1.57 Tj o C) ( 1.42 2 100 1 0 0 0.5 IF(AV) (A) 1.0 0 0 1000 VR (V) 2000 a = IF(RMS)/IF(AV); VR = VRRMmax; = 0.5. Solid line = VRRM; = 0.1. Fig.6 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. Dotted line = VRRM; = 0.5. Fig.7 Maximum permissible junction temperature as a function of reverse voltage. 1996 Jun 07 5 Philips Semiconductors Product specification Fast soft-recovery rectifier BYV98 MEA523 handbook, halfpage 10 103 handbook, halfpage IR (A) 102 MLC319 IF (A) 8 6 4 10 2 0 0 1 2 3 4 VF (V) 5 1 0 100 Tj ( o C) 200 Dotted line: Tj = 175 C. Solid line: Tj = 25 C. VR = VRRMmax. Fig.8 Forward current as a function of forward voltage; maximum values. Fig.9 Reverse current as a function of junction temperature; maximum values. 10 2 handbook, halfpage Cd (pF) MGC602 handbook, halfpage 50 25 7 50 10 2 3 1 1 10 102 103 MGA200 VR (V) f = 1 MHz; Tj = 25 C. Dimensions in mm. Fig.10 Diode capacitance as a function of reverse voltage; typical values. Fig.11 Device mounted on a printed-circuit board. 1996 Jun 07 6 Philips Semiconductors Product specification Fast soft-recovery rectifier BYV98 handbook, full pagewidth DUT + IF (A) 0.5 1 t rr 10 25 V 50 0 0.25 0.5 IR (A) 1 t MAM057 Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 15 ns. Fig.12 Test circuit and reverse recovery time waveform and definition. IF ndbook, halfpage dI F dt t rr 10% t dI R dt 100% IR MGC499 Fig.13 Reverse recovery definitions. 1996 Jun 07 7 Philips Semiconductors Product specification Fast soft-recovery rectifier PACKAGE OUTLINE BYV98 handbook, full pagewidth k 3.81 max 28 min Dimensions in mm. The marking band indicates the cathode. , 4.57 max a 0.81 max 28 min MBC880 Fig.14 SOD57. DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 1996 Jun 07 8 |
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