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| CY2308 3.3V Zero Delay Buffer Features * Zero input-output propagation delay, adjustable by capacitive load on FBK input * Multiple configurations, see "Available CY2308 Configurations" table * Multiple low-skew outputs -- Output-output skew less than 200 ps -- Device-device skew less than 700 ps -- Two banks of four outputs, three-stateable by two select inputs * 10-MHz to 133-MHz operating range * Low jitter, less than 200 ps cycle-cycle (-1, -1H, -4, -5H) * Advanced 0.65 CMOS technology * Space-saving 16-pin 150-mil SOIC package or 16-pin TSSOP * 3.3V operation * Industrial Temperature available The CY2308 has two banks of four outputs each, which can be controlled by the Select inputs as shown in the table "Selected Input Decoding". If all output clocks are not required, Bank B can be three-stated. The select inputs also allow the input clock to be directly applied to the output for chip and system testing purposes. The CY2308 PLL enters a power down state when there are no rising edges on the REF input. In this mode, all outputs are three-stated and the PLL is turned off, resulting in less than 50 A of current draw. The PLL shuts down in two additional cases as shown in the "Select Input Decoding" table. Multiple CY2308 devices can accept the same input clock and distribute it in a system. In this case, the skew between the outputs of two devices is guaranteed to be less than 700 ps. The CY2308 is available in five different configurations, as shown in the "Available CY2308 Configurations" table on page 2. The CY2308-1 is the base part, where the output frequencies equal the reference if there is no counter in the feedback path. The CY2308-1H is the high-drive version of the -1, and rise and fall times on this device are much faster. The CY2308-2 allows the user to obtain 2X and 1X frequencies on each output bank. The exact configuration and output frequencies depends on which output drives the feedback pin. The CY2308-3 allows the user to obtain 4X and 2X frequencies on the outputs. The CY2308-4 enables the user to obtain 2X clocks on all outputs. Thus, the part is extremely versatile, and can be used in a variety of applications. The CY2308-5H is a high-drive version with REF/2 on both banks. Functional Description The CY2308 is a 3.3V zero delay buffer designed to distribute high-speed clocks in PC, workstation, datacom, telecom, and other high-performance applications. The part has an on-chip PLL which locks to an input clock presented on the REF pin. The PLL feedback is required to be driven into the FBK pin, and can be obtained from one of the outputs. The input-to-output propagation delay is guaranteed to be less than 350 ps, and output-to-output skew is guaranteed to be less than 250 ps. Block Diagram /2 REF Pin Configuration PLL MUX FBK CLKA1 CLKA2 CLKA3 CLKA4 REF CLKA1 CLKA2 VDD GND CLKB1 CLKB2 S2 /2 Extra Divider (-3, -4) Extra Divider (-5H) SOIC Top View 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 FBK CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1 S2 S1 Select Input Decoding /2 CLKB1 CLKB2 CLKB3 Extra Divider (-2, -3) CLKB4 2308-1 2308-2 Cypress Semiconductor Corporation * 3901 North First Street * San Jose * CA 95134 * 408-943-2600 August 30, 1999 CY2308 Select Input Decoding S2 0 0 1 1 S1 0 1 0 1 CLOCK A1-A4 Three-State Driven Driven Driven CLOCK B1-B4 Three-State Three-State Driven Driven Output Source PLL PLL Reference PLL PLL Shutdown Y N Y N Available CY2308 Configurations Device CY2308-1 CY2308-1H CY2308-2 CY2308-2 CY2308-3 CY2308-3 CY2308-4 CY2308-5H Feedback From Bank A or Bank B Bank A or Bank B Bank A Bank B Bank A Bank B Bank A or Bank B Bank A or Bank B Bank A Frequency Reference Reference Reference 2 X Reference 2 X Reference 4 X Reference 2 X Reference Reference /2 Bank B Frequency Reference Reference Reference/2 Reference Reference or Reference[1] 2 X Reference 2 X Reference Reference /2 Note: 1. Output phase is indeterminant (0 or 180 from input clock). If phase integrity is required, use the CY2308-2. 2 CY2308 Zero Delay and Skew Control REF. Input to CLKA/CLKB Delay v/s Difference in Loading between FBK pin and CLKA/CLKB pins To close the feedback loop of the CY2308, the FBK pin can be driven from any of the eight available output pins. The output driving the FBK pin will be driving a total load of 7 pF plus any additional load that it drives. The relative loading of this output (with respect to the remaining outputs) can adjust the inputoutput delay. This is shown in the graph above. For applications requiring zero input-output delay, all outputs including the one providing feedback should be equally load- ed. If input-output delay adjustments are required, use the above graph to calculate loading differences between the feedback output and remaining outputs. For zero output-output skew, be sure to load outputs equally. For further information on using CY2308, refer to the application note "CY2308: Zero Delay Buffer." 3 CY2308 Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 REF [2] Signal CLKA1[3] CLKA2 VDD GND CLKB1 CLKB2 S2[4] S1 [4] [3] [3] [3] [3] Description Input reference frequency, 5V tolerant input Clock output, Bank A Clock output, Bank A 3.3V supply Ground Clock output, Bank B Clock output, Bank B Select input, bit 2 Select input, bit 1 Clock output, Bank B Clock output, Bank B Ground 3.3V supply CLKB3 GND VDD CLKA3 CLKA4 FBK CLKB4[3] [3] [3] Clock output, Bank A Clock output, Bank A PLL feedback input Storage Temperature ................................. -65C to +150C Max. Soldering Temperature (10 sec.) ........................ 260C Junction Temperature .................................................. 150C Static Discharge Voltage (per MIL-STD-883, Method 3015) ............................. >2000V Maximum Ratings Supply Voltage to Ground Potential ............... -0.5V to +7.0V DC Input Voltage (Except Ref)...............-0.5V to VDD + 0.5V DC Input Voltage REF............................................-0.5 to 7V Notes: 2. Weak pull-down. 3. Weak pull-down on all outputs. 4. Weak pull-ups on these inputs. 4 CY2308 Operating Conditions for CY2308SC-XX Commercial Temperature Devices Parameter VDD TA CL CIN Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance[5] Description Min. 3.0 0 Max. 3.6 70 30 15 7 Unit V C pF pF pF Electrical Characteristics for CY2308SC-XX Commercial Temperature Devices Parameter VIL VIH IIL IIH VOL VOH IDD (PD mode) IDD Description Input LOW Voltage Input HIGH Voltage Input LOW Current Input HIGH Current Output LOW Voltage [6] Test Conditions Min. 2.0 Max 0.8 Unit V V A A V V VIN = 0V VIN = VDD IOL = 8 mA (-1, -2, -3, -4) IOL = 12 mA (-1H, -5H) IOH = -8 mA (-1, -2, -3, -4) IOH = -12mA (-1H, -5H) Unloaded outputs, 100-MHz REF, Select inputs at VDD or GND Unloaded outputs, 66-MHz REF (-1,-2,-3,-4) Unloaded outputs, 33-MHz REF (-1,-2,-3,-4) 2.4 50.0 100.0 0.4 Output HIGH Voltage[6] Power Down Supply Current REF = 0 MHz Supply Current 12.0 45.0 70.0 (-1H,-5H) 32.0 18.0 A mA mA mA mA Notes: 5. Applies to both Ref Clock and FBK. 6. Parameter is guaranteed by design and characterization. Not 100% tested in production. 5 CY2308 Switching Characteristics for CY2308SC-XX Commercial Temperature Devices [8] Parameter t1 t1 t1 Name Output Frequency Output Frequency Output Frequency Duty Cycle[6] = t2 / t1 (-1,-2,-3,-4,-1H,-5H) Duty Cycle[6] = t2 / t1 (-1,-2,-3,-4,-1H,-5H) t3 t3 t3 t4 t4 t4 t5 Rise Time[6] (-1, -2, -3, -4) Rise Time[6] (-1, -2, -3, -4) Rise Time[6] (-1H, -5H) Fall Time[6] (-1, -2, -3, -4) Fall Time[6] (-1, -2, -3, -4) Fall Time[6] (-1H, -5H) Test Conditions 30-pF load, All devices 20-pF load, -1H, -5H devices[7] 15-pF load, -1, -2, -3, -4 devices Measured at 1.4V, FOUT =66.66 MHz 30-pF load Measured at 1.4V, FOUT <50.0 MHz 15-pf load Measured between 0.8V and 2.0V, 30-pF load Measured between 0.8V and 2.0V, 15-pF load Measured between 0.8V and 2.0V, 30-pF load Measured between 0.8V and 2.0V, 30-pF load Measured between 0.8V and 2.0V, 15-pF load Measured between 0.8V and 2.0V, 30-pF load Min. 10 10 10 40.0 45.0 50.0 50.0 Typ. Max. 100 133.3 133.3 60.0 55.0 2.20 1.50 1.50 2.20 1.50 1.25 200 200 200 400 0 0 1 200 200 100 400 400 1.0 250 700 Unit MHz MHz MHz % % ns ns ns ns ns ns ps ps ps ps ps ps V/ns ps ps ps ps ps ms Output to Output Skew on All outputs equally loaded same Bank (-1,-2,-3,-4)[6] Output to Output Skew (-1H,-5H) Output Bank A to Output Bank B Skew (-1,-4,-5H) Output Bank A to Output Bank B Skew (-2,-3) All outputs equally loaded All outputs equally loaded All outputs equally loaded t6 t7 t8 tJ Delay, REF Rising Edge to Measured at VDD/2 FBK Rising Edge[6] Device to Device Skew [6] Output Slew Rate[6] Cycle to Cycle Jitter[6] (-1, -1H, -4, -5H) Measured at VDD/2 on the FBK pins of devices Measured between 0.8V and 2.0V on -1H, -5H device using Test Circuit #2 Measured at 66.67 MHz, loaded outputs, 15-pF load Measured at 66.67 MHz, loaded outputs, 30-pF load Measured at 133.3 MHz, loaded outputs, 15-pF load tJ Cycle to Cycle Jitter[6] (-2, -3) Measured at 66.67 MHz, loaded outputs 30-pF load Measured at 66.67 MHz, loaded outputs 15-pF load tLOCK PLL Lock Time[6] Stable power supply, valid clocks presented on REF and FBK pins Notes: 7. CY2308-5H has maximum input frequency of 133.33 MHz and maximum output of 66.67 MHz. 8. All parameters are specified with loaded outputs. 6 CY2308 Operating Conditions for CY2308SI-XX Industrial Temperature Devices Parameter VDD TA CL CIN Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance[5] Description Min. 3.0 -40 Max. 3.6 85 30 15 7 Unit V C pF pF pF Electrical Characteristics for CY2308SI-XX Industrial Temperature Devices Parameter VIL VIH IIL IIH VOL VOH IDD (PD mode) IDD Description Input LOW Voltage Input HIGH Voltage Input LOW Current Input HIGH Current Output LOW Voltage[6] Output HIGH Voltage[6] Power Down Supply Current Supply Current VIN = 0V VIN = VDD IOL = 8 mA (-1, -2, -3, -4) IOL = 12 mA (-1H, -5H) IOH = -8 mA (-1, -2, -3, -4) IOH = -12 mA (-1H, -5H) REF = 0 MHz Unloaded outputs, 100 MHz, Select inputs at VDD or GND Unloaded outputs, 66-MHz REF (-1,-2,-3,-4) Unloaded outputs, 66-MHz REF (-1,-2,-3,-4) 2.4 25.0 45.0 70(-1H,-5H) 35.0 20.0 2.0 50.0 100.0 0.4 Test Conditions Min. Max. 0.8 Unit V V A A V V A mA mA mA mA 7 CY2308 Switching Characteristics for CY2308SI-XX Industrial Temperature Devices [8] Parameter t1 t1 t1 Name Output Frequency Output Frequency Output Frequency Duty Cycle[6] = t2 / t1 (-1,-2,-3,-4,-1H,-5H) Duty Cycle[6] = t2 / t1 (-1,-2,-3,-4,-1H,-5H) t3 t3 t3 t4 t4 t4 t5 Rise Time[6] (-1, -2, -3, -4) Rise Time[6] (-1, -2, -3, -4) Rise Time[6] (-1H, -5H) Fall Time[6] (-1, -2, -3, -4) Fall Time[6] (-1, -2, -3, -4) Fall Time[6] (-1H, -5H) Output to Output Skew on same Bank (-1,-2,-3,-4)[6] Output to Output Skew (-1H,-5H) Output Bank A to Output Bank B Skew (-1,-4,-5H) Output Bank A to Output Bank B Skew (-2,-3) t6 t7 t8 tJ Delay, REF Rising Edge to FBK Rising Edge[6] Device to Device Skew[6] Output Slew Rate[6] Cycle to Cycle Jitter[6] (-1, -1H, -4, -5H) Test Conditions 30-pF load, All devices 20-pF load, -1H, -5H devices[7] 15-pF load, -1, -2, -3, -4 devices Measured at 1.4V, FOUT =66.66 MHz 30-pF load Measured at 1.4V, FOUT <50.0 MHz 15-pF load Measured between 0.8V and 2.0V, 30-pF load Measured between 0.8V and 2.0V, 15-pF load Measured between 0.8V and 2.0V, 30-pF load Measured between 0.8V and 2.0V, 30-pF load Measured between 0.8V and 2.0V, 15-pF load Measured between 0.8V and 2.0V, 30-pF load All outputs equally loaded All outputs equally loaded All outputs equally loaded All outputs equally loaded Measured at VDD/2 Measured at VDD/2 on the FBK pins of devices Measured between 0.8V and 2.0V on -1H, -5H device using Test Circuit # 2 Measured at 66.67 MHz, loaded outputs, 15-pF load Measured at 66.67 MHz, loaded outputs, 30-pF load Measured at 133.3 MHz, loaded outputs, 15 pF load tJ Cycle to Cycle Jitter[6] (-2, -3) Measured at 66.67 MHz, loaded outputs 30-pF load Measured at 66.67 MHz, loaded outputs 15-pF load tLOCK PLL Lock Time[6] Stable power supply, valid clocks presented on REF and FBK pins 1 200 200 100 400 400 1.0 0 0 2.50 1.50 1.50 2.50 1.50 1.25 200 200 200 400 250 700 ns ns ns ns ns ns ps ps ps ps ps ps V/ns ps ps ps ps ps ms Min. 10 10 10 40.0 45.0 50.0 50.0 Typ. Max. 100 133.3 133.3 60.0 55.0 Unit MHz MHz MHz % % 8 CY2308 Switching Waveforms Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V 2308-3 All Outputs Rise/Fall Time 2.0V 0.8V t3 2.0V 0.8V t4 2308-4 3.3V 0V OUTPUT Output-Output Skew OUTPUT 1.4V OUTPUT t5 1.4V 2308-5 Input-Output Propagation Delay INPUT VDD /2 FBK t6 VDD/2 2308-6 Device-Device Skew FBK, Device 1 VDD /2 FBK, Device 2 t7 VDD /2 2308-7 9 CY2308 Typical Duty Cycle[9] and IDD Trends[10] for CY2308-1,2,3,4 Duty Cycle Vs VDD (for 30 pF Loads over Frequency - 3.3V, 25C) 60 58 56 54 Duty Cycle (%) Duty Cycle (%) 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MHz 60 58 56 54 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MHz 133 MHz Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) Duty Cycle Vs Frequency (for 30 pF Loads ov er Te mperature - 3.3V) Duty Cycle Vs Fre que ncy (for 15 pF Loads over T emperature - 3.3V) 60 58 56 54 Duty Cycle (%) 60 58 56 -40C 0C 25C 70C 85C Duty Cycle (%) 54 52 50 48 46 44 42 40 -40C 0C 25C 70C 85C 52 50 48 46 44 42 40 20 40 60 80 Fre que ncy (MHz) 100 120 140 20 40 60 80 Fre que ncy (MHz) 100 120 140 IDD vs Number of Loaded Outputs (f or 30 pF Loads over Frequency - 3.3V, 25C) 140 120 100 80 60 40 20 0 0 2 4 6 8 # o f Lo ad ed O utp uts 33 MH z 66 MH z 1 00 MHz IDD vs Number of Loaded Outputs (f or 15 pF Loads over Frequency - 3.3V, 25C) 140 120 100 80 60 40 20 0 0 2 4 # of L oaded Ou t put s 6 8 33 MH z 66 MH z 1 00 MHz Notes: 9. Duty Cycle is taken from typical chip measured at 1.4V. 10. I DD data is calculated from IDD = ICORE + nCVf, where ICORE is the unloaded current. (n = # of outputs; C = Capacitance load per output (F); V = Voltage Supply (V); f = frequency (Hz)) 10 CY2308 Typical Duty Cycle[9] and IDD Trends[10] for CY2308-1H, 5H Duty Cycle Vs VDD (for 30 pF Loads over Frequency - 3.3V, 25C) 60 58 56 54 Duty Cycle (%) Duty Cycle (%) 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MHz 60 58 56 54 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MH z 133 MH z Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) Duty Cycle Vs Frequency (for 30 pF Loads over Temperature - 3.3V) 60 60 58 58 56 56 -40C 54 54 Duty Cycle Vs Frequency Duty Cycle Vs VDD (for 15 pF Loads over Temperature - 25C) (for 15 pF Loads over Frequency - 3.3V,3.3V) 60 58 56 54 Duty Cycle (%) 52 50 48 46 44 42 40 20 40 60 80 Frequency (MHz) 100 120 140 Duty Cycle (%) Duty Cycle (%) 0C 25C 70C 85C 52 52 50 50 48 48 46 46 44 44 42 42 40 40 20 3 40 3.1 60 3.2 80 3.3 Frequency (MHz) VDD (V) 100 3.4 120 3.5 140 3.6 -40C 33 MHz 0C 66 MHz 25C 100 MH z 70C 133 MH z 85C IDD vs Number of Loaded Outputs (f or 30 pF Loads over Frequency - 3.3V, 25C) 140 140 120 120 100 100 80 60 40 20 20 0 0 0 2 4 6 8 33 M Hz 66 M Hz 100 M H z 40 80 IDD vs Number of Loaded Outputs (f or 15 pF Loads over Frequency - 3.3V, 25C) 33 M Hz 66 M Hz 60 100 M H z 0 # o f L o ad ed O u tp uts 2 4 6 8 # of L oaded Ou t put s 11 CY2308 Test Circuits Test Circuit # 1 VDD 0.1 F OUTPUTS V DD 0.1 F GND GND 0.1 F CLK OUT C LOAD 0.1 F Test Circuit # 2 V DD OUTPUTS 1 K V DD GND GND 1 K CLK out 10 pF Test Circuit for all parameters except t8 Test Circuit for t8, Output slew rate on -1H, -5 device Ordering Information Ordering Code CY2308SC-1 CY2308SI-1 CY2308SC-1H CY2308SI-1H CY2308ZC-1H CY2308ZI-1H CY2308SC-2 CY2308SI-2 CY2308SC-3 CY2308SI-3 CY2308SC-4 CY2308SI-4 CY2308SC-5H CY2308SI-5H Document #: 38-00528-G Package Name S16 S16 S16 S16 Z16 Z16 S16 S16 S16 S16 S16 S16 S16 S16 Package Type 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil TSSOP 16-pin 150-mil TSSOP 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC Operating Range Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial 12 CY2308 Package Diagrams 16-Lead (150-Mil) Molded SOIC S16 51-85068-A 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16 51-85091 (c) Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. |
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