| PART |
Description |
Maker |
| N111250 |
PACKAGING: 4,000 PCS PER REEL
|
E-SWITCH
|
| M29F04B55N1F M29F04B45K1E M29F04B90N1T M29F04B45N6 |
Reversible Motor Driver for Output 1.0A (1 Motor); Package: SIP9; Constitution materials list: Packing style: Tube packaging; Package quantity: 1000
4ch System Motor Driver ICs; Package: HSOP-M28; Constitution materials list: Packing style: Tube packaging; Package quantity: 1000; Minimum package quantity: 1000; 4兆位12KB的8，统一座）单电源闪
4 Mbit (512Kb x8, Uniform Block) Single Supply Flash Memory 4兆位12KB的8，统一座）单电源闪
Reversible Motor Drivers for Output 1.0A or more (2 Motors); Package: HSIP10; Constitution materials list: Packing style: Tube packaging; Package quantity: 500; Minimum package quantity: 500; 4兆位12KB的8，统一座）单电源闪
|
意法半导
STMicroelectronics N.V.
|
| 87911-5211 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 52 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0903257004 90325-7004 |
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, with PCB Pegs, 4 Circuits, Tube Packaging
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, with PCB Pegs, 4 Circuits, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9010 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 10 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 10 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 87911-4611 87911-6611 0879116611 0879114611 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 46 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0878980824 87898-0824 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tube Packaging, without Cap, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Tube Packaging, without Cap, Lead-free
|
Molex Electronics Ltd.
|
| 0878980626 87898-0626 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 6 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 6 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 0878981826 87898-1826 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 18 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 87898-2026 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 20 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 87437-0442 |
1.50mm Pitch Pico-SPOX Wire-to-Board Header, Surface Mount, Vertical, Shrouded, 4 Circuits, Tube Packaging, Lead-Free
|
Molex Electronics Ltd.
|
|
