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A520GLUE025 - ISOLIERZUBEHOER 250ML DOSE ISOLIERZUBEHOER 0.5L DOSE ISOLIERZUBEHOER 0.5升剂

A520GLUE025_2884774.PDF Datasheet
 Full text search : ISOLIERZUBEHOER 250ML DOSE ISOLIERZUBEHOER 0.5L DOSE ISOLIERZUBEHOER 0.5升剂
 Product Description search : ISOLIERZUBEHOER 250ML DOSE ISOLIERZUBEHOER 0.5L DOSE ISOLIERZUBEHOER 0.5升剂

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PART Description Maker
UT54LVDS032-UPX 5962H9583401QXA 5962H9583401QXC 59 Quad receiver: SMD. QML class V. Lead finish factory option. Total dose 5E5 rad(Si).
Quad receiver: SMD. QML class V. Lead finish hot solder dipped. Total dose 5E5 rad(Si).
Quad receiver: SMD. QML class Q. Lead finish gold. Total dose 5E5 rad(Si).
Quad receiver: SMD. QML class V. Lead finish gold. Total dose 1E6 rad(Si).
Quad receiver: SMD. QML class Q. Lead finish gold. Total dose 1E6 rad(Si).
Quad receiver: SMD. QML class Q. Lead finish hot solder dipped. Total dose 1E6 rad(Si).
Quad Receiver 四接收机
Triple 3-input positive-AND gates 14-PDIP 0 to 70
Quad receiver: SMD. QML class Q. Lead finish hot solder dipped. Total dose 5E5 rad(Si).
Quad receiver: SMD. QML class Q. Lead finish factory option. Total dose 5E5 rad(Si).
Quad receiver: SMD. QML class V. Lead finish gold. Total dose 5E5 rad(Si).
 Aeroflex, Inc.
Aeroflex Inc.
AEROFLEX[Aeroflex Circuit Technology]
Aeroflex Circuit Techno...
5962F-9583302VXC 5962F-9583302VXA 5962F-9583302VXX Quad driver: SMD. Lead finish gold. QML class V. Total dose 3E5 rad(Si).
Quad driver: SMD. Lead finish hot solder dipped. QML class V. Total dose 3E5 rad(Si).
Quad driver: SMD. Lead finish factory option. QML class V. Total dose 3E5 rad(Si).
Quad driver: SMD. Lead finish gold. QML class Q. Total dose 3E5 rad(Si).
Quad driver: SMD. Lead finish factory option. QML class Q. Total dose 3E5 rad(Si).
Quad driver: SMD. Lead finish hot solder dipped. QML class Q. Total dose 1E6 rad(Si).
Quad driver: SMD. Lead finish factory option. QML class Q. Total dose 1E6 rad(Si).
Quad driver: SMD. Lead finish hot solder dipped. QML class V. Total dose 1E6 rad(Si).
Quad driver: SMD. Lead finish gold. QML class V. Total dose 5E5 rad(Si).
Quad driver: SMD. Lead finish hot solder dipped. QML class Q. Total dose 5E5 rad(Si).
Quad driver: SMD. Lead finish gold. QML class Q. Total dose 5E5 rad(Si).
Quad driver: SMD. Lead finish gold. QML class V. Total dose 1E5 rad(Si).
Quad driver: SMD. Lead finish hot solder dipped. QML class V. Total dose 1E5 rad(Si).
 Aeroflex Circuit Technology
5962R-0050501VTBDX 5962R-0050501VTBDC 5962R-005050 USART: SMD. Lead finish optional. QML class V. Total dose 3E5 rad(Si).
USART: SMD. Lead finish gold. QML class V. Total dose 3E5 rad(Si).
USART: SMD. Lead finish solder. QML class V. Total dose 3E5 rad(Si).
USART: SMD. Lead finish solder. QML class Q. Total dose 3E5 rad(Si).
USART: SMD. Lead finish gold. QML class Q. Total dose 3E5 rad(Si).
USART: SMD. Lead finish optional. QML class Q. Total dose 3E5 rad(Si).
 Aeroflex Circuit Technology
GSELD-IRUH3301 Enhanced Low Dose Rate Sensitivity
 International Rectifier
5962-01533 UT8Q512K32-SWC 8Q512K32 UT8Q512K32 UT8Q 512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)).
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).
16Megabit SRAM MCM 16Megabit的SRAM亿立方米
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose none
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose none.
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).
 Aeroflex Circuit Techno...
http://
AEROFLEX[Aeroflex Circuit Technology]
Aeroflex Inc.
Aeroflex, Inc.
MSK196RH-15 Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)
 M.S. Kennedy Corporatio...
MSK496RH-15 Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)
 M.S. Kennedy Corporatio...
5962-8862801QTC 5962-8862801QYX 5962-8862801QTX 59 UT1553B BCRT bus controller/remote terminal/monitor:S. Class designator QML Q. Lead finish gold. Total dose none.
UT1553B BCRT bus controller/remote terminal/monitor:S. Class designator QML Q. Lead finish optional. Total dose none.
UT1553B BCRT bus controller/remote terminal/monitor:S. Class designator QML Q. Lead finish solder. Total dose none.
UT1553B BCRT bus controller/remote terminal/monitor:S. Class designator V. Lead finish gold. Total dose none.
UT1553B BCRT bus controller/remote terminal/monitor:S. Class designator V. Lead finish optional. Total dose none.
UT1553B BCRT bus controller/remote terminal/monitor:S. Class designator V. Lead finish solder. Total dose none.
 Aeroflex Circuit Technology
AM29C943DE AM29C941PC AM29C941DC 100V Dual 2N- and 2P- Channel MOSFET in a MO-036AB package; Similar to IRHG6110 with optional Total Dose Rating of 300kRads
100V Quad N-Channel MOSFET in a 28-pin LCC package; Similar to IRHQ7110 with optional Total Dose Rating of 500kRads 10位D型锁存器
100V Quad P-Channel MOSFET in a 28-pin LCC package; A IRHQ9110 with Standard Packaging 10位D型锁存器
 FCI
NXP Semiconductors N.V.
5962D9960601QUA 5962D9960601QUC 5962D9960601QUX 59 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish factory option.
512K x 8 SRAM. 100ns access time, 5V operation. Extended industrial temp rang flow. Lead finish gold.
 Aeroflex Circuit Technology
5962D0053601QUA 5962D0053601TXA 5962D0053602TXA 59 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option.
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped.
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped.
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow.
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
 Aeroflex Circuit Technology
 
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