| PART |
Description |
Maker |
| 5962R-0050501VTBDX 5962R-0050501VTBDC 5962R-005050 |
USART: SMD. Lead finish optional. QML class V. Total dose 3E5 rad(Si). USART: SMD. Lead finish gold. QML class V. Total dose 3E5 rad(Si). USART: SMD. Lead finish solder. QML class V. Total dose 3E5 rad(Si). USART: SMD. Lead finish solder. QML class Q. Total dose 3E5 rad(Si). USART: SMD. Lead finish gold. QML class Q. Total dose 3E5 rad(Si). USART: SMD. Lead finish optional. QML class Q. Total dose 3E5 rad(Si).
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Aeroflex Circuit Technology
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| GSIONLDIRUH33P253B1M |
Low Dose Test Report
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International Rectifier
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| 5962H0153501QXA 5962H0153501QXC 5962H0153501VXC 59 |
LVDS deserializer:SMD. Total dose 1E6 rad(Si). QML class Q. Lead finish hot solder dipped. LVDS deserializer:SMD. Total dose 1E6 rad(Si). QML class Q. Lead finish gold. LVDS deserializer:SMD. Total dose 1E6 rad(Si). QML class V. Lead finish gold. LVDS deserializer:SMD. Total dose 1E6 rad(Si). QML class V. Lead finish factory option. LVDS deserializer:SMD. Total dose 1E6 rad(Si). QML class V. Lead finish hot solder dipped. Deserializer. Lead finish hot solder dipped.
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Aeroflex Circuit Technology
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| GSIONIRUH33P253B1M |
Total Ionizing Dose Test Report
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International Rectifier
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| 5962-0151101TXC 5962-0151101QXC 5962-0151101 UT9Q5 |
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)). 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 3E4(30krad(Si)). 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 5E4(50krad(Si)). 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 1E4(10krad(Si)). UT9Q512K32 16Megabit SRAM MCM UT9Q512K32 16Megabit SRAM MCM 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose none 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose none 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 1E4(10krad(Si)). 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 5E4(50krad(Si)).
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AEROFLEX[Aeroflex Circuit Technology]
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| R251/C/2 R251/G/2 |
MESSZYLINDER MIT STOPFEN 10ML 2PK MESSZYLINDER麻省理工学院STOPFEN毫升2PK MESSZYLINDER MIT STOPFEN 250ML 2PK MESSZYLINDER麻省理工学院STOPFEN 250MLPK
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Littelfuse, Inc.
|
| MSK496RH-15 |
Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)
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M.S. Kennedy Corporatio...
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| ISL71823ASRH |
Single Event and Total Dose Hardened, High-Speed, Dual Output PWMs
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Intersil
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| 5962H0153601QYC 5962H0153601QYX 5962H0153601VYA 59 |
Octal 400 Mbps bus LVDS repeater:SMD. Total dose 1E6 rad(Si). QML class Q. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 1E6 rad(Si). QML class Q. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 1E6 rad(Si). QML class V. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 1E6 rad(Si). QML class V. Lead finish gold. Octal 400 Mbps bus LVDS repeater. Lead finish gold. Octal 400 Mbps bus LVDS repeater. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 3E5 rad(Si). QML class Q. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 3E5 rad(Si). QML class Q. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 3E5 rad(Si). QML class Q. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 3E5 rad(Si). QML class V. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 3E5 rad(Si). QML class V. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 3E5 rad(Si). QML class V. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 5E5 rad(Si). QML class Q. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 5E5 rad(Si). QML class Q. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 5E5 rad(Si). QML class Q. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 5E5 rad(Si). QML class V. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 5E5 rad(Si). QML class V. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 5E5 rad(Si). QML class V. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. Total dose 1E5 rad(Si). QML class Q. Lead finish hot solder dipped.
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Aeroflex Circuit Technology
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| UT7C139C45GCX UT7C138C45GCA UT7C138C45WCC UT7C138C |
Dual-port SRAM: SMD with busy flag. Lead finish gold. Class V. Device type 04 (4Kx9, CMOS compatible inputs, 55 ns). Total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish gold. Class V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish solder. Class Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose 3E5 rads(Si). 4Kx9 dual-port SRAM. Lead finish gold. 55ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Prototype flow. 4Kx9 dual-port SRAM. Lead finish gold. 45ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Prototype flow. 4Kx8 dual-port SRAM. Lead finish optional. 55ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. 4Kx8 dual-port SRAM. Lead finish solder. 55ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose 3E5 rads(Si). 4Kx8/9 Radiation-Hardened Dual-Port Static RAM with Busy Flag Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator V. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator V. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator V. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator Q. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator Q. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). Total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator Q. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). Total dose G. Federal stock class designator: no options. 4Kx8 dual-port SRAM. Lead finish solder. 45ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. 4Kx8 dual-port SRAM. Lead finish gold. 45ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Prototype flow. 4Kx8 dual-port SRAM. Lead finish gold. 55ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Prototype flow. 4Kx9 dual-port SRAM. Lead finish solder. 45ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. 4Kx9 dual-port SRAM. Lead finish optional. 45ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). Total dose 3E5 rads(Si). 4Kx9 dual-port SRAM. Lead finish optional. 55ns access time. CMOS-compatible inputs, 5.5V operation. Total dose none. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class V. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). Total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish solder. Class V. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). Total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish solder. Class V. Device type 04 (4Kx9, CMOS compatible inputs, 55 ns). Total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish gold. Class Q. Device type 04 (4Kx9, CMOS compatible inputs, 55 ns). Total dose 3E5 rads(Si).
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AEROFLEX[Aeroflex Circuit Technology]
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