PART |
Description |
Maker |
MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
CMCM |
Ceramic Multi-Chip Module Package
|
Amkor Technology, Inc.
|
FDMF8700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
AS8FLC2M32BP-90_IT AS8FLC2M32BP-90_Q AS8FLC2M32BP- |
Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array
|
Austin Semiconductor http://
|
5962R0622903VYC AT68166FT-YM25-E AT68166FT-YM25-SC |
512K X 32 STANDARD SRAM, 25 ns, CQFP68 Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi- Chip Module
|
E2V TECHNOLOGIES PLC ATMEL Corporation
|
SKY77601 |
Multi-Mode, Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets
|
Skyworks Solutions Inc.
|
WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32 512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
AS8S512K32AQ1-25L_Q AS8S512K32P-17L/IT AS8S512K32P |
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 PGA-66 512K x 32 SRAM SRAM MEMORY ARRAY
|
Micross Components Austin Semiconductor
|
SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72 x32 SRAM Module X32号的SRAM模块 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp. TE Connectivity, Ltd.
|