| PART |
Description |
Maker |
| C3216X7S2A225KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1608X7S2A104KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| CAK-001 CAK-001MF CAK-001AF CAK-2405F CAK-002AF CA |
TDK DC to DC Converters, DC to AC inverters
|
TDK[TDK Electronics]
|
| C2012X7R1E225K C2012X7R1E475K C1608X7R1H474K C1608 |
TDK MLCC PRODUCT LINE
2012 MLCC PRODUCT GUIDE
TDK MLCC PRODUCT LINE
2012 MLCC PRODUCT GUIDE
|
TDK Electronics
|
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
| 55PC0233 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55A0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55A.
|
TE Connectivity Ltd
|
| 55PC1221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| ATMEGA16M1 ATMEGA16M1AUTO ATMEGA32C1 ATMEGA64M1 |
Automotive Specification at 150掳C
Automotive Specification at 150°C
|
ATMEL Corporation
|
